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    • 4. 发明授权
    • Method for covering a microfluidic assembly
    • 覆盖微流体组件的方法
    • US07553393B2
    • 2009-06-30
    • US10182792
    • 2001-01-22
    • Helene DerandAnders Larsson
    • Helene DerandAnders Larsson
    • B29C65/00
    • B01L3/502707B01J2219/00783B01L2200/0689B01L2200/12B01L2300/0816B01L2300/0887B29C65/02B29C65/14B29C65/4815B29C65/483B29C66/1122B29C66/53461B29C66/71B29C66/72321B29C66/73172B29C66/73176B29L2031/756B32B37/0023B32B2037/1215Y10T436/2575B29K2067/003B29K2069/00
    • A method for covering a set of open microchannel structures which are fabricated on a planar surface made of plastics and which comprise two or more part areas that have different surface characteristics. The method comprises the steps of: a) providing the surface comprising the set of microchannel structures; b) providing a lid-forming sheet having on one side an even layer of a thermoglue; c) applying the side of the sheet having the thermoglue against the surface carrying the microchannel structure; d) heating the assembly created in step (c) to selectively liquefy the hot-melt adhesive while at the same time pressing the sheet material and the planar surface of the substrate together; e) permitting the resulting laminate-covered microchannel structure to cool. An assembly comprising (a) a planar substrate, the surface of which has a set of one or more open microchannel structures each of which comprises part areas representing different functionalities, and (b) a lid-forming material covering said set of microchannel structures and having one or more openings going from a microchannel structure to ambient atmosphere. The assembly is characterized in that the joint between said surface and said sheet material is a thermoglue that possibly has been cured.
    • 一种用于覆盖一组开放式微通道结构的方法,其制造在由塑料制成的平面上,并且包括具有不同表面特性的两个或多个部分区域。 该方法包括以下步骤:a)提供包括一组微通道结构的表面; b)提供在一侧具有均匀的热镀层层的盖形成片; c)将具有热胶粘层的片材的侧面施加在承载微通道结构的表面上; d)加热步骤(c)中产生的组件以选择性地液化热熔粘合剂,同时将片材和基片的平面表面压在一起; e)允许所得层压物覆盖的微通道结构冷却。 一种组件,其包括(a)平面基板,其表面具有一组一个或多个开放微通道结构,每个开放微通道结构包括表示不同功能的部分区域,以及(b)覆盖所述一组微通道结构的盖形成材料, 具有从微通道结构到环境气氛的一个或多个开口。 该组件的特征在于,所述表面和所述片材之间的接合是可能已经固化的热电胶。