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    • 1. 发明申请
    • Display Device and Manufacturing Method Therefor
    • 显示装置及其制造方法
    • US20090065777A1
    • 2009-03-12
    • US12208371
    • 2008-09-11
    • Eiji OueTakuo KaitohHidekazu MiyakeToshio MiyazawaYuichiro Takashina
    • Eiji OueTakuo KaitohHidekazu MiyakeToshio MiyazawaYuichiro Takashina
    • H01L33/00H01L21/00
    • H01L27/1229H01L27/1214H01L27/1274H01L29/66765H01L29/78678
    • In a display device of the present invention which forms thin film transistors on a substrate, the thin film transistor comprises: a silicon nitride film which is formed on the substrate in a state that the silicon nitride film covers a gate electrode; a silicon oxide film which is selectively formed on the silicon nitride film; a semiconductor layer which is formed at least on an upper surface of the silicon oxide film and includes a pseudo single crystal layer or a polycrystalline layer; and a drain electrode and a source electrode which are formed on an upper surface of the semiconductor layer by way of a contact layer, wherein either one of the pseudo single crystal layer and the poly-crystalline layer is formed by crystallizing the amorphous silicon layer, and a peripheral-side wall surface of the pseudo single crystal layer or the polycrystalline layer is contiguously constituted with a peripheral-side wall surface of the silicon oxide film below the pseudo single crystal layer or the polycrystalline layer without a stepped portion.
    • 在本发明的在基板上形成薄膜晶体管的显示装置中,薄膜晶体管包括:在氮化硅膜覆盖栅电极的状态下在基板上形成的氮化硅膜; 选择性地形成在氮化硅膜上的氧化硅膜; 形成在所述氧化硅膜的上表面上的半导体层,其包含伪单晶层或多晶层; 以及通过接触层形成在半导体层的上表面上的漏电极和源电极,其中通过使非晶硅层结晶来形成伪单晶层和多晶层中的任一个, 并且伪单晶层或多晶层的外围侧壁表面在不具有台阶部分的伪单晶层或多晶层下方的氧化硅膜的周向侧壁表面附近构成。
    • 5. 发明授权
    • Display device and manufacturing method therefor
    • 显示装置及其制造方法
    • US07952095B2
    • 2011-05-31
    • US12208371
    • 2008-09-11
    • Eiji OueTakuo KaitohHidekazu MiyakeToshio MiyazawaYuichiro Takashina
    • Eiji OueTakuo KaitohHidekazu MiyakeToshio MiyazawaYuichiro Takashina
    • H01L29/04H01L21/00
    • H01L27/1229H01L27/1214H01L27/1274H01L29/66765H01L29/78678
    • In a display device of the present invention which forms thin film transistors on a substrate, the thin film transistor comprises: a silicon nitride film which is formed on the substrate in a state that the silicon nitride film covers a gate electrode; a silicon oxide film which is selectively formed on the silicon nitride film; a semiconductor layer which is formed at least on an upper surface of the silicon oxide film and includes a pseudo single crystal layer or a polycrystalline layer; and a drain electrode and a source electrode which are formed on an upper surface of the semiconductor layer by way of a contact layer, wherein either one of the pseudo single crystal layer and the poly-crystalline layer is formed by crystallizing the amorphous silicon layer, and a peripheral-side wall surface of the pseudo single crystal layer or the polycrystalline layer is contiguously constituted with a peripheral-side wall surface of the silicon oxide film below the pseudo single crystal layer or the polycrystalline layer without a stepped portion.
    • 在本发明的在基板上形成薄膜晶体管的显示装置中,薄膜晶体管包括:在氮化硅膜覆盖栅电极的状态下在基板上形成的氮化硅膜; 选择性地形成在氮化硅膜上的氧化硅膜; 形成在所述氧化硅膜的上表面上的半导体层,其包含伪单晶层或多晶层; 以及通过接触层形成在半导体层的上表面上的漏电极和源电极,其中通过使非晶硅层结晶来形成伪单晶层和多晶层中的任一个, 并且伪单晶层或多晶层的外围侧壁表面在不具有台阶部分的伪单晶层或多晶层下方的氧化硅膜的周向侧壁表面附近构成。
    • 9. 发明授权
    • Manufacturing method of a display device
    • 显示装置的制造方法
    • US07524685B2
    • 2009-04-28
    • US11509739
    • 2006-08-25
    • Takuo KaitohEiji OueToshihiko Itoga
    • Takuo KaitohEiji OueToshihiko Itoga
    • H01L21/66
    • H01L21/02675H01L21/2026H01L27/1285H01L27/1296H01L29/04
    • The present invention provides a manufacturing method of a display device which can decrease the lowering of a yield rate of the display device attributed to the aggregations generated by pseudo single crystallization of a silicon film. A manufacturing method of a display device includes a semiconductor film reforming step which reforms a semiconductor film into a second state in which the semiconductor film possesses elongated crystalline particles by radiating a laser beam to the semiconductor film in a first state, an aggregation detecting step which detects the aggregation of the semiconductor film which is generated in the semiconductor film reforming step, and a defect determination step which determines a product as a defective product when a position of the aggregation is present in the inside of the predetermined region and determines the product as a good product when the position of the aggregation is present outside the predetermined region.
    • 本发明提供一种显示装置的制造方法,其能够降低归因于硅膜的伪单晶化产生的聚集的显示装置的成品率的降低。 显示装置的制造方法包括:半导体膜重整工序,其将第一状态下的半导体膜照射激光,将半导体膜改性为半导体膜具有细长结晶粒子的第二状态,聚集检测步骤, 检测在半导体膜重整步骤中产生的半导体膜的聚集,以及缺陷确定步骤,当聚集的位置存在于预定区域的内部时,将产品确定为不合格品,并将产品确定为 当聚集的位置存在于预定区域之外时,产品是良好的。
    • 10. 发明申请
    • MANUFACTURING METHOD OF DISPLAY DEVICE
    • 显示装置的制造方法
    • US20080070351A1
    • 2008-03-20
    • US11857481
    • 2007-09-19
    • Eiji OueYasukazu KimuraDaisuke SonodaToshiyuki MatsuuraTakeshi Kuriyagawa
    • Eiji OueYasukazu KimuraDaisuke SonodaToshiyuki MatsuuraTakeshi Kuriyagawa
    • H01L21/84
    • H01L27/1288H01L27/1255H01L29/78645
    • In a display device manufacturing method including a step of forming a semiconductor film above a substrate and a step of implanting an impurity to each of a first semiconductor film in a first region of the substrate, a second semiconductor film in a second region outside the first region, and a third semiconductor film in a third region outside the first and second regions, the implanting step includes: a first step of forming a first resist above the substrate so as to be thicker in the first region than in the second region, the first resist covering the first and second regions and having an opening in the third region; a second step of implanting an impurity to only the third semiconductor in the third region using the first resist as a mask; a third step of thinning the first resist so as to form a second resist that covers the first region and has an opening in each of second and third regions; a fourth step of implanting an impurity to the second and third semiconductor films in the second and third regions simultaneously using the second resist as a mask; and a fifth step of implanting an impurity to the first to third semiconductor films in the first to third regions simultaneously.
    • 在包括在衬底上形成半导体膜的步骤和在衬底的第一区域中向第一半导体膜中的每一个注入杂质的步骤的显示器件制造方法中,在第一区域之外的第二区域中的第二半导体膜 区域,以及在第一和第二区域外的第三区域中的第三半导体膜,所述注入步骤包括:第一步骤,在所述衬底上方形成第一抗蚀剂,使其在所述第一区域中比在所述第二区域中更厚, 第一抗蚀剂覆盖第一和第二区域并且在第三区域中具有开口; 使用第一抗蚀剂作为掩模将杂质注入第三区域中的第三半导体的第二步骤; 第三步骤,使第一抗蚀剂变薄以形成覆盖第一区域并在第二和第三区域中的每一个具有开口的第二抗蚀剂; 第四步骤,使用第二抗蚀剂作为掩模,将杂质注入第二和第三区域中的第二和第三半导体膜; 以及将第一至第三区域中的第一至第三半导体膜同时注入杂质的第五步骤。