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1. 发明申请

US20060275952A1 Method for making electronic devices 审中-公开
标题翻译：制造电子设备的方法
公开(公告)号：US20060275952A1
公开(公告)日：2006-12-07
申请号：US11146838
申请日：2005-06-07
申请人： Arun Gowda , Sandeep Tonapi , Ryan Mills , David Esler , Stephen Latham , John Campbell
发明人： Arun Gowda , Sandeep Tonapi , Ryan Mills , David Esler , Stephen Latham , John Campbell
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L21/4871 , H01L23/3737 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01021 , H01L2924/01046 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/12044 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Disclosed are methods for forming an electronic device that comprises a material that functions as an underfill material as well as a thermal interface material simultaneously. The electronic assembly comprising a heat dissipating element, a semiconductor chip, a substrate and a thermally conductive material is also given here, wherein the thermally conductive material serves as an underfill material as well as a thermal interface material simultaneously.
摘要翻译：公开了用于形成电子装置的方法，该电子装置包括同时用作底部填充材料的材料以及热界面材料。此处还给出了包括散热元件，半导体芯片，基板和导热材料的电子组件，其中导热材料同时用作底部填充材料以及热界面材料。

2. 发明申请

US20060192280A1 Method of forming electronic devices 审中-公开
标题翻译：电子器件形成方法
公开(公告)号：US20060192280A1
公开(公告)日：2006-08-31
申请号：US11068376
申请日：2005-02-28
申请人： David Esler , Donald Buckley , Sandeep Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Arun Gowda
发明人： David Esler , Donald Buckley , Sandeep Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Arun Gowda
IPC分类号： H01L23/48 , H01L21/58
CPC分类号： H05K3/3436 , H01L23/49816 , H01L2924/0002 , H05K2201/0209 , H05K2201/10977 , Y02P70/613 , H01L2924/00
摘要： A method of forming polymer reinforced solder-bumped containing device or substrate is described. The method comprises the following steps: providing a device or substrate having at least one solder bump formed thereon; coating a predetermined portion of the device or substrate with a curable polymer reinforcement material forming a layer on the device or substrate, partially curing the curable polymer reinforcement material to provide a solder-bumped structure comprising a partially cured polymer reinforcement material, and, making a connection between the solder-bumped structure formed and a printed circuit board or array of attachment pads and fully curing the partially cured polymer reinforcement material to provide a reinforced interconnection. Full curing of the polymer reinforcement material may take place either during the “reflow step” or subsequent to it (post-curing).
摘要翻译：描述了形成聚合物增强焊料凸起的装置或基底的方法。该方法包括以下步骤：提供其上形成有至少一个焊料凸块的器件或衬底; 用形成在所述装置或基底上的层的可固化聚合物增强材料涂覆所述装置或基材的预定部分，部分固化所述可固化聚合物增强材料，以提供包含部分固化的聚合物增强材料的焊料凸起结构，所形成的焊料凸起结构与印刷电路板或附接焊盘阵列之间的连接，并且完全固化部分固化的聚合物增强材料以提供增强的互连。聚合物增强材料的完全固化可以在“回流步骤”或之后（后固化）发生。

3. 发明申请

US20060275608A1 B-stageable film, electronic device, and associated process 审中-公开
标题翻译： B级电影，电子设备和相关过程
公开(公告)号：US20060275608A1
公开(公告)日：2006-12-07
申请号：US11147061
申请日：2005-06-07
申请人： Sandeep Tonapi , John Campbell , Ryan Mills , Jian Zhang , Stephen Latham
发明人： Sandeep Tonapi , John Campbell , Ryan Mills , Jian Zhang , Stephen Latham
IPC分类号： B32B27/38 , C08L63/00 , H01L21/00
CPC分类号： H01L23/3737 , C09J7/10 , H01L23/42 , H01L2924/0002 , H01L2924/3011 , Y10T428/31511 , H01L2924/00
摘要： A B-stageable film that includes a thermal interface material is provided. The film may secure a heat-generating device to a heat-dissipating component, may further cross-link, and may conduct thermal energy from the heat-generating device to the heat-dissipating component. A method of making and using the film is provided, as well as a device that incorporates the film.
摘要翻译：提供了包括热界面材料的可B阶段的膜。该膜可以将发热装置固定到散热部件，可以进一步交联，并且可以将热能从发热装置传导到散热部件。提供了制造和使用该膜的方法，以及包含该膜的装置。

4. 发明申请

US20080019097A1 THERMAL TRANSPORT STRUCTURE 审中-公开
标题翻译：热运输结构
公开(公告)号：US20080019097A1
公开(公告)日：2008-01-24
申请号：US11782049
申请日：2007-07-24
申请人： Jian Zhang , Sandeep Tonapi , Arun Gowda , Ryan Mills
发明人： Jian Zhang , Sandeep Tonapi , Arun Gowda , Ryan Mills
IPC分类号： H05K7/20
CPC分类号： F28F13/00 , F28F2013/005 , H01L23/3677 , H01L23/3733 , H01L23/42 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： A thermally manageable system is provided. The system may include a heat-generating unit, a heat-dissipating unit, and a thermal transport structure located between the heat-dissipating unit and the heat-generating unit. The thermal transport structure has a first surface in thermal communication with the heat-generating unit and a second surface in thermal communication with the heat-dissipating unit. The thermal transport structure includes a thermally conductive material having a length-to-width ratio greater than 1, and the length is oriented to directionally facilitate heat conduction in a direction about perpendicular at least one of the thermal transport structure first surface or second surface. The thermal transport layer comprises a plurality of individual thermally conductive strips or channels that define a discontinuous array within a relatively non-thermally conductive matrix.
摘要翻译：提供热管理系统。该系统可以包括位于散热单元和发热单元之间的发热单元，散热单元和热传输结构。热传输结构具有与发热单元热连通的第一表面和与散热单元热连通的第二表面。热传输结构包括长度与宽度比大于1的导热材料，并且长度方向定向地促进沿热交换结构第一表面或第二表面中的至少一个的大致垂直方向的热传导。热传递层包括在相对非导热的基质内限定不连续阵列的多个独立的导热条或通道。

5. 发明申请

US20070240310A1 Thermal management system and associated method 有权
标题翻译：热管理系统及相关方法
公开(公告)号：US20070240310A1
公开(公告)日：2007-10-18
申请号：US11247113
申请日：2005-10-11
申请人： Jian Zhang , Sandeep Tonapi , Ryan Mills , Arun Gowda
发明人： Jian Zhang , Sandeep Tonapi , Ryan Mills , Arun Gowda
IPC分类号： B21D53/02
CPC分类号： B32B27/06 , B32B5/14 , B32B7/02 , B32B27/08 , B32B27/20 , B32B2264/102 , B32B2264/105 , B32B2307/30 , B32B2307/302 , B32B2307/706 , H05K7/20481 , Y10T29/4935 , Y10T29/49366 , Y10T29/49885 , Y10T428/269
摘要： A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.
摘要翻译：提供一种制造热界面结构的方法。该方法可以包括在树脂层上设置热传输层以形成层叠结构，并且将层叠结构切片以形成在切片的第一表面上具有热传输层的第一暴露部分的横截面切片，以及所述热传输层在所述切片的第二表面上的第二暴露部分。

6. 发明申请

US20070231560A1 THERMAL TRANSPORT STRUCTURE AND ASSOCIATED METHOD 有权
标题翻译：热运输结构及相关方法
公开(公告)号：US20070231560A1
公开(公告)日：2007-10-04
申请号：US11247114
申请日：2005-10-11
申请人： Jian Zhang , Sandeep Tonapi , Ryan Mills , Arun Gowda
发明人： Jian Zhang , Sandeep Tonapi , Ryan Mills , Arun Gowda
IPC分类号： B32B5/16
CPC分类号： F28F13/00 , F28F2013/005 , H01L23/3733 , H01L23/42 , H01L2924/0002 , Y10T428/25 , Y10T428/26 , Y10T428/269 , Y10T428/30 , Y10T428/31504 , H01L2924/00
摘要： A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.
摘要翻译：提供具有热传输层和树脂层的热传输结构。热传输层可以包括第一表面和第二表面，并且具有设置在热传输层中的导热材料，其中导热材料沿预定方向取向以便于相对于预定方向的热传导。此外，树脂层固定到热传输层第二表面，其中树脂层的导热性比热传输层相对较少。

7. 发明申请

US20050170188A1 Resin compositions and methods of use thereof 审中-公开
标题翻译：树脂组合物及其使用方法
公开(公告)号：US20050170188A1
公开(公告)日：2005-08-04
申请号：US11096160
申请日：2005-04-01
申请人： John Campbell , Slawomir Rubinsztajn , David Gibson , Sandeep Tonapi , Ryan Mills , Ananth Prabhakumar
发明人： John Campbell , Slawomir Rubinsztajn , David Gibson , Sandeep Tonapi , Ryan Mills , Ananth Prabhakumar
IPC分类号： B32B27/38
CPC分类号： C08G59/3218 , C08G59/24 , C08G59/4215 , C08G59/68 , C08K3/36 , H01L21/563 , H01L23/293 , H01L2224/73203 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , Y10T428/31511 , C08L63/00 , H01L2924/00
摘要： A composition comprises a first curable resin composition that includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, combinations thereof, and mixtures thereof. The composition can include a separate second curable fluxing composition that comprises at least one epoxy resin. The first curable resin or the combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.
摘要翻译：组合物包含第一可固化树脂组合物，其包含至少一种与溶剂组合的芳族环氧树脂，官能化胶态二氧化硅分散体和至少一种选自脂环族单体，脂族环氧单体，羟基芳族化合物化合物，其组合，及其混合物。组合物可以包括单独的第二可固化助熔组合物，其包含至少一种环氧树脂。第一可固化树脂或两种树脂组合物的组合可用于生产底部填充材料，并且适合用作电子芯片的密封剂。

8. 发明申请

US20060293172A1 Cure catalyst, composition, electronic device and associated method 有权
标题翻译：固化催化剂，组成，电子装置及相关方法
公开(公告)号：US20060293172A1
公开(公告)日：2006-12-28
申请号：US11167847
申请日：2005-06-23
申请人： Slawomir Rubinsztajn , John Campbell , Ryan Mills , Sandeep Tonapi , Ananth Prabhakumar
发明人： Slawomir Rubinsztajn , John Campbell , Ryan Mills , Sandeep Tonapi , Ananth Prabhakumar
IPC分类号： B01J31/00
CPC分类号： H01L23/293 , B01J31/0237 , B01J31/0244 , B01J31/146 , C08G59/68 , C08G59/70 , H01L21/563 , H01L24/81 , H01L2224/73203 , H01L2224/8121 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/12044 , H01L2924/3025 , H01L2924/00
摘要： A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.
摘要翻译：提供固化催化剂。固化催化剂可以包括路易斯酸和含氮分子或非叔膦中的一种或两种。含氮分子可以包括单胺或杂环芳族有机化合物。可固化组合物可包括固化催化剂。电子设备可以包括可固化组合物。还提供与前述相关的方法。

9. 发明申请

US20050049352A1 Solvent-modified resin compositions and methods of use thereof 审中-公开
标题翻译：溶剂改性树脂组合物及其使用方法
公开(公告)号：US20050049352A1
公开(公告)日：2005-03-03
申请号：US10737943
申请日：2003-12-16
申请人： Slawomir Rubinsztajn , Sandeep Tonapi , David Gibson , John Campbell , Ananth Prabhakumar , Ryan Mills
发明人： Slawomir Rubinsztajn , Sandeep Tonapi , David Gibson , John Campbell , Ananth Prabhakumar , Ryan Mills
IPC分类号： C08K9/06 , C08L63/00 , C09C1/30 , H01L21/56 , H01L23/29 , C08K3/34
CPC分类号： B82Y30/00 , C01P2004/64 , C08K9/06 , C08L63/00 , C09C1/3081 , H01L21/563 , H01L23/293 , H01L23/295 , H01L2224/73203 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/12044 , H01L2924/00
摘要： A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.
摘要翻译：提供了用作底部填充材料的溶剂改性树脂组合物。所述组合物具有至少一种环氧树脂，至少一种溶剂和官能化胶体二氧化硅的填料。溶剂改性树脂组合物可用于制备透明的B阶树脂膜。本公开的实施例包括用作晶片级底部填充物，以及用于电子芯片的密封剂。

10. 发明授权

US07022410B2 Combinations of resin compositions and methods of use thereof 有权
标题翻译：树脂组合物的组合及其使用方法
公开(公告)号：US07022410B2
公开(公告)日：2006-04-04
申请号：US10736946
申请日：2003-12-16
申请人： Sandeep Shrikant Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Slawomir Rubinsztajn
发明人： Sandeep Shrikant Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Slawomir Rubinsztajn
IPC分类号： B32B27/38 , H01L21/50 , C08L63/00
CPC分类号： H01L21/563 , C08L63/00 , C08L2205/02 , H01L23/293 , H01L24/29 , H01L2224/73203 , H01L2924/01012 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , Y10T428/31511 , Y10T428/31515 , C08L2666/22 , C08L83/00 , H01L2924/00
摘要： A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.
摘要翻译：提供了用作底部填充材料的组合物。底部填充材料包括第一可固化透明树脂组合物和第二可固化助熔树脂组合物。第一可固化树脂组合物包括至少一种与溶剂组合的芳族环氧树脂，官能化胶体二氧化硅分散体和至少一种选自脂环族环氧单体，脂族环氧单体，羟基芳族化合物和组合的其它组分，以及混合物，从而形成溶剂改性树脂。第二可固化助熔组合物包含至少一种环氧树脂。两种树脂组合物的组合可用于生产底部填充材料，并且适合用作电子芯片的密封剂。

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