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1. 发明授权

US07550097B2 Thermal conductive material utilizing electrically conductive nanoparticles 有权
标题翻译：导电材料利用导电纳米粒子
公开(公告)号：US07550097B2
公开(公告)日：2009-06-23
申请号：US10654391
申请日：2003-09-03
申请人： Sandeep Shrikant Tonapi , Hong Zhong , Davide Louis Simone , Raymond Albert Fillion
发明人： Sandeep Shrikant Tonapi , Hong Zhong , Davide Louis Simone , Raymond Albert Fillion
IPC分类号： H01B1/22
CPC分类号： H01L24/29 , C09K5/14 , H01L23/373 , H01L23/3732 , H01L23/3737 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/29393 , H01L2224/29499 , H01L2224/32245 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12044 , H01L2924/14 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles.
摘要翻译：热界面组合物含有非导电的微米尺寸的填料和与聚合物基质混合的导电纳米颗粒。这样的组合物增加了聚合物复合材料的体积热导率，并且降低了热界面材料和相应配合表面之间存在的热界面电阻。这样的组合物是非导电的。含有纳米颗粒的制剂与没有纳米颗粒的制剂相比，显示出微米级颗粒的相分离较少。

2. 发明授权

US07062008B2 Detector assembly thermal management system and method 失效
标题翻译：检测器总成热管理系统及方法
公开(公告)号：US07062008B2
公开(公告)日：2006-06-13
申请号：US10610163
申请日：2003-06-30
申请人： Ashutosh Joshi , William Edward Burdick, Jr. , Sandeep Shrikant Tonapi , Joseph Lacey
发明人： Ashutosh Joshi , William Edward Burdick, Jr. , Sandeep Shrikant Tonapi , Joseph Lacey
IPC分类号： G01T1/00
CPC分类号： A61B6/035 , A61B6/4488
摘要： A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object. A detector array comprises a plurality of detector assemblies. A gantry secured to the X-ray radiation source and the detector array rotates around a longitudinal axis. Further, each of the detector assembly comprises a detector subassembly adapted to detect the X-ray beams. These detector subassemblies are further adapted to convert the X-ray beams to a plurality of electrical signals. At least one circuit board assembly is coupled to the detector subassembly. The circuit board assembly typically comprises an integrated circuit array, such as, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array further comprises a plurality of integrated circuit chips, for example, data acquisition chips mounted on at least one printed circuit board. A thermal management system is adapted for thermal communication between the data acquisition chip array and a heat sink assembly to control the thermal environment of each detector assembly. A processor is typically configured to process the electrical signals to generate a plurality of projection measurements. The processor is further adapted to perform computations on the projection measurements to construct an image of the object therefrom.
摘要翻译：计算机断层摄影（CT）系统包括通过物体投影多个X射线束的X射线辐射源。检测器阵列包括多个检测器组件。固定到X射线辐射源的台架和检测器阵列围绕纵向轴线旋转。此外，每个检测器组件包括适于检测X射线束的检测器子组件。这些检测器子组件还适于将X射线束转换成多个电信号。至少一个电路板组件耦合到检测器子组件。电路板组件通常包括集成电路阵列，例如数据采集芯片阵列，以获取对应于电信号的数据。集成电路阵列还包括多个集成电路芯片，例如安装在至少一个印刷电路板上的数据采集芯片。热管理系统适用于数据采集芯片阵列与散热器组件之间的热通信，以控制每个探测器组件的热环境。处理器通常被配置为处理电信号以产生多个投影测量。处理器还适于对投影测量执行计算以从其构建对象的图像。

3. 发明授权

US07022410B2 Combinations of resin compositions and methods of use thereof 有权
标题翻译：树脂组合物的组合及其使用方法
公开(公告)号：US07022410B2
公开(公告)日：2006-04-04
申请号：US10736946
申请日：2003-12-16
申请人： Sandeep Shrikant Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Slawomir Rubinsztajn
发明人： Sandeep Shrikant Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Slawomir Rubinsztajn
IPC分类号： B32B27/38 , H01L21/50 , C08L63/00
CPC分类号： H01L21/563 , C08L63/00 , C08L2205/02 , H01L23/293 , H01L24/29 , H01L2224/73203 , H01L2924/01012 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , Y10T428/31511 , Y10T428/31515 , C08L2666/22 , C08L83/00 , H01L2924/00
摘要： A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.
摘要翻译：提供了用作底部填充材料的组合物。底部填充材料包括第一可固化透明树脂组合物和第二可固化助熔树脂组合物。第一可固化树脂组合物包括至少一种与溶剂组合的芳族环氧树脂，官能化胶体二氧化硅分散体和至少一种选自脂环族环氧单体，脂族环氧单体，羟基芳族化合物和组合的其它组分，以及混合物，从而形成溶剂改性树脂。第二可固化助熔组合物包含至少一种环氧树脂。两种树脂组合物的组合可用于生产底部填充材料，并且适合用作电子芯片的密封剂。

4. 发明申请

US20050181214A1 Curable epoxy compositions, methods and articles made therefrom 审中-公开
标题翻译：可固化的环氧组合物，由其制成的方法和制品
公开(公告)号：US20050181214A1
公开(公告)日：2005-08-18
申请号：US11006265
申请日：2004-12-07
申请人： John Robert Campbell , Slawomir Rubinsztajn , Florian Johannes Schattenmann , Sandeep Shrikant Tonapi , Ananth Prabhakumar , Wing-Keung Woo , Joseph Michael Anostario , Donna Marie Sherman
发明人： John Robert Campbell , Slawomir Rubinsztajn , Florian Johannes Schattenmann , Sandeep Shrikant Tonapi , Ananth Prabhakumar , Wing-Keung Woo , Joseph Michael Anostario , Donna Marie Sherman
IPC分类号： C01B33/149 , C08L63/00 , H01L21/56 , H01L23/29 , B32B27/38
CPC分类号： H01L23/295 , C01B33/149 , C08L63/00 , H01L21/563 , H01L23/293 , H01L2224/73203 , H01L2924/01019 , H01L2924/0102 , H01L2924/01055 , H01L2924/01066 , H01L2924/01067 , H01L2924/01079 , H01L2924/01087 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , Y10T428/31511 , C08L2666/28 , C08L2666/54 , H01L2924/00
摘要： A curable epoxy formulation comprises an epoxy monomer, an epoxy oligomer, or a combination thereof; an organofunctionalized colloidal silica; a cure catalyst; and optional reagents. Further embodiments of the present invention include a method for making the curable epoxy formulation and a semiconductor package comprising the curable epoxy formulation. Embodiments of cured formulations can have low coefficients of thermal expansion and/or high glass transition temperatures.
摘要翻译：可固化环氧树脂制剂包含环氧单体，环氧低聚物或其组合; 有机官能胶体二氧化硅; 固化催化剂; 和任选试剂。本发明的其它实施方案包括制备可固化环氧树脂制剂的方法和包含可固化环氧树脂制剂的半导体封装。固化制剂的实施方案可以具有低的热膨胀系数和/或高的玻璃化转变温度。

5. 发明授权

US06931092B2 System and method for thermal management of CT detector circuitry 失效
标题翻译： CT检测器电路的热管理系统和方法
公开(公告)号：US06931092B2
公开(公告)日：2005-08-16
申请号：US10609755
申请日：2003-06-30
申请人： Ashutosh Joshi , William Edward Burdick, Jr. , Sandeep Shrikant Tonapi , Joseph Lacey
发明人： Ashutosh Joshi , William Edward Burdick, Jr. , Sandeep Shrikant Tonapi , Joseph Lacey
IPC分类号： A61B6/03 , G01N23/083
CPC分类号： A61B6/032 , A61B6/4233 , A61B6/4411 , A61B6/4488 , H01L2924/0002 , H01L2924/00
摘要： A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object and a detector array comprising a plurality of detector assemblies. Each of the detector assembly further comprises a detector subassembly adapted to detect the X-ray beams and further adapted to convert the X-ray beams to a plurality of electrical signals and at least one integrated circuit array, for example, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array, for example, data acquisition chip array further comprises a plurality of integrated circuits, such as, data acquisition chips mounted on at least one printed circuit board and a thermal management system adapted for thermal communication between the data acquisition chip array and a heat sink assembly to control thermal environment of each detector assembly. The heat sink further comprises a spreader plate extending over 2 or more data acquisition chips to reduce the temperature difference within the data acquisition chips.
摘要翻译：计算机断层摄影（CT）系统包括通过物体投射多个X射线束的X射线辐射源和包括多个检测器组件的检测器阵列。每个检测器组件还包括检测器子组件，其适于检测X射线束，并且还适于将X射线束转换成多个电信号和至少一个集成电路阵列，例如数据采集芯片阵列获取对应于电信号的数据。集成电路阵列，例如数据采集芯片阵列还包括多个集成电路，例如安装在至少一个印刷电路板上的数据采集芯片和适于在数据采集芯片阵列和用于控制每个检测器组件的热环境的散热器组件。散热器还包括延伸超过2个或更多个数据采集芯片的扩展板，以减少数据采集芯片内的温差。

6. 发明授权

US08048819B2 Cure catalyst, composition, electronic device and associated method 有权
标题翻译：固化催化剂，组成，电子装置及相关方法
公开(公告)号：US08048819B2
公开(公告)日：2011-11-01
申请号：US11167847
申请日：2005-06-23
申请人： Slawomir Rubinsztajn , John Robert Campbell , Ryan Christopher Mills , Sandeep Shrikant Tonapi , Ananth Prabhakumar
发明人： Slawomir Rubinsztajn , John Robert Campbell , Ryan Christopher Mills , Sandeep Shrikant Tonapi , Ananth Prabhakumar
IPC分类号： B01J21/00 , B01J23/00 , B01J25/00 , B01J29/00 , B01J31/00 , B01J21/02 , B01J21/04 , B01J23/02
CPC分类号： H01L23/293 , B01J31/0237 , B01J31/0244 , B01J31/146 , C08G59/68 , C08G59/70 , H01L21/563 , H01L24/81 , H01L2224/73203 , H01L2224/8121 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/12044 , H01L2924/3025 , H01L2924/00
摘要： A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.
摘要翻译：提供固化催化剂。固化催化剂可以包括路易斯酸和含氮分子或非叔膦中的一种或两种。含氮分子可以包括单胺或杂环芳族有机化合物。可固化组合物可包括固化催化剂。电子设备可以包括可固化组合物。还提供与前述相关的方法。

7. 发明授权

US07797808B2 Thermal management system and associated method 有权
标题翻译：热管理系统及相关方法
公开(公告)号：US07797808B2
公开(公告)日：2010-09-21
申请号：US11247113
申请日：2005-10-11
申请人： Jian Zhang , Sandeep Shrikant Tonapi , Ryan Christopher Mills , Arun Virupaksha Gowda
发明人： Jian Zhang , Sandeep Shrikant Tonapi , Ryan Christopher Mills , Arun Virupaksha Gowda
IPC分类号： B23P25/00 , B32B17/10
CPC分类号： B32B27/06 , B32B5/14 , B32B7/02 , B32B27/08 , B32B27/20 , B32B2264/102 , B32B2264/105 , B32B2307/30 , B32B2307/302 , B32B2307/706 , H05K7/20481 , Y10T29/4935 , Y10T29/49366 , Y10T29/49885 , Y10T428/269
摘要： A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.
摘要翻译：提供一种制造热界面结构的方法。该方法可以包括在树脂层上设置热传输层以形成层叠结构，并且将层叠结构切片以形成在切片的第一表面上具有热传输层的第一暴露部分的横截面切片，以及所述热传输层在所述切片的第二表面上的第二暴露部分。

8. 发明申请

US20090256254A1 WAFER LEVEL INTERCONNECTION AND METHOD 审中-公开
标题翻译： WAFER LEVEL INTERCONNTION和方法
公开(公告)号：US20090256254A1
公开(公告)日：2009-10-15
申请号：US12100447
申请日：2008-04-10
申请人： William Edward Burdick, JR. , Jeffrey Scott Erlbaum , Kaustubh Ravindra Nagarkar , Sandeep Shrikant Tonapi
发明人： William Edward Burdick, JR. , Jeffrey Scott Erlbaum , Kaustubh Ravindra Nagarkar , Sandeep Shrikant Tonapi
IPC分类号： H01L23/48 , H01L31/00 , H01L21/00
CPC分类号： H01L31/022458 , H01L31/0516 , Y02E10/50
摘要： A semiconductor assembly includes a semiconductor wafer including backside contact pads coupled to respective contact regions of different signal types and insulation separating the backside contact regions by signal type. The semiconductor assembly further includes metallization situated over at least a portion of the insulation and interconnecting the backside contact pads.
摘要翻译：半导体组件包括半导体晶片，其包括耦合到不同信号类型的相应接触区域的背面接触焊盘，并且通过信号类型隔离背侧接触区域。半导体组件还包括位于绝缘体的至少一部分上并且互连背面接触焊盘的金属化。

9. 发明授权

US07297399B2 Thermal transport structure and associated method 有权
标题翻译：热传输结构及相关方法
公开(公告)号：US07297399B2
公开(公告)日：2007-11-20
申请号：US11247114
申请日：2005-10-11
申请人： Jian Zhang , Sandeep Shrikant Tonapi , Ryan Christopher Mills , Arun Virupaksha Gowda
发明人： Jian Zhang , Sandeep Shrikant Tonapi , Ryan Christopher Mills , Arun Virupaksha Gowda
IPC分类号： B32B27/12
CPC分类号： F28F13/00 , F28F2013/005 , H01L23/3733 , H01L23/42 , H01L2924/0002 , Y10T428/25 , Y10T428/26 , Y10T428/269 , Y10T428/30 , Y10T428/31504 , H01L2924/00
摘要： A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.
摘要翻译：提供具有热传输层和树脂层的热传输结构。热传输层可以包括第一表面和第二表面，并且具有设置在热传输层中的导热材料，其中导热材料沿预定方向取向以便于相对于预定方向的热传导。此外，树脂层固定到热传输层第二表面，其中树脂层的导热性比热传输层相对较少。

10. 发明申请

US20050131106A1 Combinations of resin compositions and methods of use thereof 有权
标题翻译：树脂组合物的组合及其使用方法
公开(公告)号：US20050131106A1
公开(公告)日：2005-06-16
申请号：US10736946
申请日：2003-12-16
申请人： Sandeep Shrikant Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Slawomir Rubinsztajn
发明人： Sandeep Shrikant Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Slawomir Rubinsztajn
IPC分类号： C08L63/00 , H01L21/56 , H01L23/29 , C08K9/00 , C08K3/34
CPC分类号： H01L21/563 , C08L63/00 , C08L2205/02 , H01L23/293 , H01L24/29 , H01L2224/73203 , H01L2924/01012 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , Y10T428/31511 , Y10T428/31515 , C08L2666/22 , C08L83/00 , H01L2924/00
摘要： A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.
摘要翻译：提供了用作底部填充材料的组合物。底部填充材料包括第一可固化透明树脂组合物和第二可固化助熔树脂组合物。第一可固化树脂组合物包括至少一种与溶剂组合的芳族环氧树脂，官能化胶体二氧化硅分散体和至少一种选自脂环族环氧单体，脂族环氧单体，羟基芳族化合物和组合的其它组分，以及混合物，从而形成溶剂改性树脂。第二可固化助熔组合物包含至少一种环氧树脂。两种树脂组合物的组合可用于生产底部填充材料，并且适合用作电子芯片的密封剂。

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