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    • 8. 发明申请
    • ELECTRICAL POWER TOOLS
    • 电动工具
    • US20120045290A1
    • 2012-02-23
    • US13205064
    • 2011-08-08
    • Yoshinori SHIBATATakuji KIMURA
    • Yoshinori SHIBATATakuji KIMURA
    • B27C5/10B23C1/20
    • B27C5/10Y10T409/306608Y10T409/307952
    • An electrical power tool may include a base capable of contacting the work-piece, a tool main body detachably attached to the base, and an elevating mechanism that is capable of changing a relative position of the tool main body to the base. The elevating mechanism includes a male elevating member that is releasably integrated with the tool main body, a female elevating member that is attached to the base and is capable of relatively raising and lowering the male elevating member, and an integrating mechanism that is capable of releasably integrating the male elevating member with the tool main body. The tool main body is capable of being removed from the base while the male elevating member is left in the base when the male elevating member is released from the tool main body by operating the integrating mechanism.
    • 电动工具可以包括能够接触工件的基座,可拆卸地附接到基座的工具主体和能够改变工具主体相对于基座的相对位置的升降机构。 升降机构包括与工具主体可释放地一体化的阳升降构件,附接到基座并能够相对地升高和降低阳升降构件的阴升降构件,以及能够可释放的整体机构 将阳升降构件与工具主体集成。 当阳升降构件通过操作积分机构从阳具升降构件从工具主体释放时,能够将基座上的阳升降构件从基座移除。
    • 9. 发明授权
    • Bonding method
    • 粘合方法
    • US07770781B2
    • 2010-08-10
    • US12223538
    • 2008-02-05
    • Yoshinori ShibataYoshinori IshikawaTeruyoshi Ichiyanagi
    • Yoshinori ShibataYoshinori IshikawaTeruyoshi Ichiyanagi
    • B23K31/02
    • B23K35/30H01L2224/29007H01L2224/29339H01L2224/83048H01L2224/8384H01L2924/00014
    • At a comparatively early stage, members to be bonded are pressurized together by an applied pressure that is a comparatively low pressure. Under an applied pressure condition (a gas venting process) of the comparatively low pressure, an organic protective film is vaporized by heating a bonding material, and a void portion of a porous structure that is formed by metal nanoparticles and a binder in the bonding material is not collapsed any more than necessary due to the applied pressure. Thus, the void portion of the porous structure functions as a degassing path for the gasified organic protective film, and the gas is smoothly released from between the members to be bonded. At the time point when the temperature of the bonding material has reached a predetermined temperature, the applied pressure is increased from the comparatively low pressure to a comparatively high pressure (a pressure increase process). Further, the bonding strength is increased by bonding the members to be bonded together by applying the comparatively high pressure (a bonding process).
    • 在比较早的阶段,待粘合的构件通过相对低的压力施加压力。 在相对较低压力的施加压力条件(排气过程)下,通过加热接合材料和在接合材料中由金属纳米颗粒和粘合剂形成的多孔结构的空隙部分,有机保护膜被蒸发 由于施加的压力,不会因为必要而折叠。 因此,多孔结构的空隙部分作为气化的有机保护膜的脱气路径起作用,并且气体从要结合的构件之间平滑地释放。 在接合材料的温度达到规定温度的时刻,施加的压力从较低的压力增加到比较高的压力(增压过程)。 此外,通过施加比较高的压力(接合工艺)将待接合的部件接合来增加接合强度。