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1. 发明授权

US07374471B2 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups 失效
标题翻译：用于使用一个或多个可枢转的装载和卸载杯来研磨半导体晶片的装置和方法
公开(公告)号：US07374471B2
公开(公告)日：2008-05-20
申请号：US10765613
申请日：2004-01-27
申请人： In Kwon Jeong
发明人： In Kwon Jeong
IPC分类号： B24B51/00
CPC分类号： B24B41/005 , B24B37/042 , B24B37/345 , H01L21/67745
摘要： An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more pivotable load-and-unload cups to transfer the objects to and/or from one or more object carriers to polish the objects. Each pivotable load-and-unload cup may be configured to transfer the objects to and/or from a single object carrier. Alternatively, each pivotable load-and-unload cup may be configured to transfer the objects to and/or from two object carriers. The pivotable load-and-unload cups may be configured to be pivoted about one or more pivoting points over at least one polishing surface, such as a polishing pad surface.
摘要翻译：用于抛光诸如半导体晶片的物体的装置和方法利用一个或多个可枢转的装载和卸载杯将物体传送到一个或多个物体载体和/或从一个或多个物体载体抛光物体。每个可枢转的装载和卸载杯可以被配置成将物体传送到单个物体载体和/或从单个物体载体传送。或者，每个可枢转的负载和卸载杯可以被配置成将物体传送到和/或从两个物体载体传送。可枢转装载和卸载杯可以被配置为围绕至少一个抛光表面（例如抛光垫表面）围绕一个或多个枢转点枢转。

2. 发明授权

US07223153B2 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces 失效
标题翻译：使用一个或多个抛光表面研磨半导体晶片的装置和方法
公开(公告)号：US07223153B2
公开(公告)日：2007-05-29
申请号：US10829593
申请日：2004-04-21
申请人： In Kwon Jeong
发明人： In Kwon Jeong
IPC分类号： B24B49/00 , B24B7/00
CPC分类号： B24B37/345 , B24B51/00
摘要： An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The load-and-unload cup may be configured to move to and from the wafer carriers in a pivoting manner. The load-and-unload cup may be configured to move to and from the wafer carriers in a linear reciprocating manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a pivoting manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a linear reciprocating manner.
摘要翻译：用于抛光诸如半导体晶片的物体的装置和方法利用一个或多个抛光表面，多个晶片载体和至少一个装载和卸载杯。负载和卸载杯可以被配置成以枢转方式移动到晶片载体和从晶片载体移动。负载和卸载杯可以被配置为以线性往复运动方式移动到晶片载体和从晶片载体移动。晶片载体可以构造成以枢转的方式移动到和从装载和卸载杯移动。晶片载体可以被配置成以线性往复运动的方式移动到装载和卸载杯中和从其卸载。

3. 发明授权

US07238614B2 Methods for fabricating one or more metal damascene structures in a semiconductor wafer 失效
标题翻译：在半导体晶片中制造一个或多个金属镶嵌结构的方法
公开(公告)号：US07238614B2
公开(公告)日：2007-07-03
申请号：US11270270
申请日：2005-11-08
申请人： In Kwon Jeong
发明人： In Kwon Jeong
IPC分类号： H01L23/495
CPC分类号： H01L21/7684 , H01L21/31053 , H01L21/32115 , H01L21/3212 , H01L21/32125
摘要： Methods for fabricating one or more metal (e.g., copper) damascene structures in a semiconductor wafer use at least three polishing steps to reduce erosion topography in the resulting metal damascene structures and/or increase throughput. The polishing steps may be performed at four polishing units of a polishing apparatus, which may include one or more pivotable load/unload cups to transfer the semiconductor wafer between some of the polishing units.
摘要翻译：在半导体晶片中制造一个或多个金属（例如铜）镶嵌结构的方法使用至少三个抛光步骤以减少所得金属镶嵌结构中的侵蚀形貌和/或增加生产量。抛光步骤可以在抛光装置的四个抛光单元处执行，抛光装置可以包括一个或多个可枢转的装载/卸载杯，以在一些抛光单元之间传送半导体晶片。

4. 发明授权

US07367866B2 Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups 失效
标题翻译：使用可枢转的加载/卸载杯来研磨半导体晶片的装置和方法
公开(公告)号：US07367866B2
公开(公告)日：2008-05-06
申请号：US11208158
申请日：2005-08-18
申请人： In Kwon Jeong
发明人： In Kwon Jeong
IPC分类号： B24B51/00
CPC分类号： B24B37/345
摘要： An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups are located between the object carriers.
摘要翻译：用于抛光诸如半导体晶片的物体的装置和方法利用可枢转的装载/卸载杯将物体转移到物体载体上以在至少一个抛光表面上抛光物体。可枢转装载/卸载杯的枢转轴线位于物体载体之间。

5. 发明授权

US07364496B2 Polishing head for polishing semiconductor wafers 失效
标题翻译：用于抛光半导体晶片的抛光头
公开(公告)号：US07364496B2
公开(公告)日：2008-04-29
申请号：US11680588
申请日：2007-02-28
申请人： David E. Berkstresser , Jerry J. Berkstresser , Jino Park , In-Kwon Jeong
发明人： David E. Berkstresser , Jerry J. Berkstresser , Jino Park , In-Kwon Jeong
IPC分类号： B24B7/22
CPC分类号： B24B37/30
摘要： A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.
摘要翻译：用于处理和抛光半导体晶片的抛光头和方法使用具有至少一个凹陷区域和外部柔性膜的基底结构，所述至少一个凹陷区域和外部柔性膜可以符合至少一个凹部区域以形成至少一个凹陷部，以将半导体晶片保持在外部当对至少一个凹陷施加抽吸时的柔性膜。

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