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    • 1. 发明公开
    • 양방향 광모듈
    • 双向光学模块
    • KR1020130075053A
    • 2013-07-05
    • KR1020110143249
    • 2011-12-27
    • 주식회사 한택
    • 최재식김도훈김중택주관종김효겸
    • G02B6/42
    • G02B6/26G02B6/4246
    • PURPOSE: A bidirectional optical module is provided to perform bidirectional signal transmission and to minimize the size of an optical module and to reduce manufacturing costs. CONSTITUTION: A bidirectional optical module (100) a first optical transmission member (20), a second optical transmission member (30), a wavelength filter part (40), an optical conversion device (50), an electrical optical conversion device (60), and a controller (70). The first optical transmission member is formed lengthways to one direction. An optical signal is transferred to the first optical transmission member. The second optical transmission member is formed lengthways to one direction and receives the optical signal. The second optical transmission member is combined with the first optical transmission member by light. The wavelength filter part is arranged between the first optical transmission member and the second optical transmission member. The wavelength filter part passes a first optical signal which is entered from the second optical transmission member and has a wavelength of a first area band and reflects a second optical signal which is entered from the second optical transmission member and has a wavelength of a second area band. The optical conversion device receives the first optical signal by being combined with the first optical transmission member by the light. The electrical optical conversion device receives the second optical signal by being combined with the second optical transmission member. The controller is electrically connected to the optical conversion device and the electrical optical conversion device and analyzes an electric signal which is transformed in the optical conversion device. The controller applies the electric signal to the electrical optical conversion device so that the second optical signal is transmitted from the electrical optical conversion device. [Reference numerals] (AA) Reception; (BB) Transmission
    • 目的:提供双向光模块来执行双向信号传输,并最大限度地减小光模块的尺寸并降低制造成本。 构成:双向光学模块(100),第一光传输构件(20),第二光传输构件(30),波长滤波器部分(40),光转换装置(50),电光转换装置 )和控制器(70)。 第一光传输构件沿一个方向纵向形成。 光信号被传送到第一光传输部件。 第二光传输构件沿一个方向纵向形成并接收光信号。 第二光传输部件通过光与第一光传输部件组合。 波长滤波器部分布置在第一光传输部件和第二光传输部件之间。 波长滤波器部分通过从第二光传输部件输入的具有第一区域频带的波长的第一光信号,并反射从第二光传输部件输入的具有第二区域波长的第二光信号 带。 光转换装置通过与第一光传输部件的光组合而接收第一光信号。 电光转换装置通过与第二光传输部件组合来接收第二光信号。 控制器电连接到光转换装置和电光转换装置,并分析在光转换装置中变换的电信号。 控制器将电信号施加到电光转换装置,使得从电光转换装置发送第二光信号。 (附图标记)(AA)接收; (BB)传输
    • 2. 发明授权
    • 프로브 블럭
    • 探测块
    • KR100951717B1
    • 2010-04-07
    • KR1020090056764
    • 2009-06-25
    • 주식회사 한택
    • 이동국류승호
    • G01R1/073G02F1/133H01L21/66
    • G01R1/07364G01R1/07392G01R31/2879G01R31/2887G02F1/133
    • PURPOSE: By adding a same pressure to a probe pin arranged as the minute pitch the probe block minimizes the damage of the probe pin through the error prevention of the checking procedure. CONSTITUTION: A housing block(110) is attachable and detachably combined in the lower part of the joint plate. The first aligning hole is formed in the center area of the housing block, the front alignment block(120) is combined in the shear of the housing block. A plurality of first slits is formed in the front alignment block into the regular interval. The rearward alignment block(130) is combined in the backend of the housing block. The shear of the probe pin is inserted into the first slit. The backend of the probe pin is inserted into the second slit. In the fixed bar is the lower of the probe pin, the probe pin is fixed by pressurizing the probe pin.
    • 目的:通过为以微小间距排列的探针提供相同的压力,探头块通过检查程序的错误防止将探针的损坏最小化。 构成:壳体块(110)可连接并可拆卸地组合在接合板的下部。 第一对准孔形成在壳体块的中心区域中,前对准块(120)组合在壳体块的剪切中。 在正向对准块中形成多个第一狭缝,形成规则间隔。 后对准块(130)组合在壳体块的后端中。 探针的剪切被插入到第一狭缝中。 探针的后端插入第二个狭缝。 固定杆是探针的下端,探针通过加压探头固定。
    • 3. 发明授权
    • 라인센서 카메라를 이용한 반도체 기판의 결함검출장치 및방법
    • 使用线传感器相机检测晶片缺陷的装置和方法
    • KR100793182B1
    • 2008-01-10
    • KR1020070012924
    • 2007-02-07
    • 주식회사 한택
    • 문우석한종규황병문김진섭
    • H01L21/66
    • G01R31/311G01N21/9505G06K9/20
    • 반도체 기판의 결함검출장치 및 방법이 개시된다. 광학부는 검사스테이지의 하단에 위치하여 검사스테이지 상의 투광성 재질의 검사영역에 위치한 반도체 기판으로 적외선광을 조사한다. 영상취득부는 반도체 기판을 투과한 적외선광을 검출하여 획득한 영상신호를 출력한다. 이송부는 영상취득부 또는 검사스테이지를 영상취득부에 구비된 라인센서의 촬영영역의 단변방향으로 이송하고, 영상취득부와 검사스테이지의 상대적인 직선운동거리에 대응하여 소정의 주기를 갖는 펄스신호를 출력한다. 제어부는 펄스신호를 계수하여 반도체 기판이 촬영영역의 단변의 길이에 대응하는 거리만큼 이송될 때마다 영상취득부로 반도체 기판을 촬영하도록 제어하는 촬영지시신호를 출력한다. 결함검출부는 각각의 영상신호를 결합하여 생성한 검사영상으로부터 반도체 기판에 존재하는 결함의 위치를 검출한다. 영상취득부에 구비된 각각의 라인센서는 촬영지시신호가 입력되면 자체에 축적되어 있는 전하를 인접하는 라인센서로 전달한 후 반도체 기판을 투과한 적외선광을 검출하고, 이송방향의 반대방향으로 종단에 위치한 라인센서는 입력되는 촬영지시신호의 개수가 라인센서의 개수를 초과하는 시점부터 자체에 축적되어 있는 전하를 영상신호로서 출력한다. 본 발명에 따르면, 상대적으로 적은 광량의 적외선을 이용하면서 신속하고 정확하게 반도체 기판에 존재하는 결함을 검출할 수 있다.
    • 4. 发明授权
    • 파장 다중 분할 커플러 장치를 이용한 양방향 광모듈
    • 파장다중분할커플러장치를이용한양방향광모듈
    • KR100465650B1
    • 2005-01-13
    • KR1020020028732
    • 2002-05-23
    • 주식회사 한택
    • 주관종최재식양진세지광순김억연정기우김도훈김은하송경수이지연
    • G02B6/42
    • PURPOSE: A bidirectional optical module using a WDM(Wavelength Divisional Multiplexing) coupler is provided to manufacture an accurate substrate by using a semiconductor silicon process and a passive alignment method. CONSTITUTION: A bidirectional optical module using a WDM coupler includes a light receiving device(118), a light emitting device(120), a WDM coupler, and a substrate(110). The WDM coupler includes two lines(132a,132b) and a common line. The lines(132a,132b) are optically coupled to the light receiving device(118) and the light emitting device(120). The lines(132a,132b) are unified by the common line. The substrate(110) includes an optical device installation portion(112) and an optical line installation portion(114). The receiving device(118) and the light emitting device(120) are installed on the optical device installation portion(112). The lines(132a,132b) are installed on the optical line installation portion(114).
    • 目的:提供使用WDM(波分多路复用)耦合器的双向光学模块,以通过使用半导体硅工艺和被动对准方法来制造精确的衬底。 构成:使用WDM耦合器的双向光模块包括光接收装置(118),发光装置(120),WDM耦合器和衬底(110)。 WDM耦合器包括两条线路(132a,132b)和一条公共线路。 线(132a,132b)光学耦合到光接收装置(118)和发光装置(120)。 线(132a,132b)由公用线统一。 基板(110)包括光学装置安装部分(112)和光学线路安装部分(114)。 接收装置(118)和发光装置(120)安装在光学装置安装部分(112)上。 线路(132a,132b)安装在光线路安装部分(114)上。
    • 5. 发明公开
    • 레이저를 이용한 반도체 기판 처리 시스템 및 방법
    • 使用激光处理半导体衬底的系统和方法
    • KR1020040093677A
    • 2004-11-08
    • KR1020030026588
    • 2003-04-26
    • 주식회사 한택
    • 김대진류제길김현중
    • H01L21/268B23K26/00B23K101/40
    • H01L21/268B23K26/0066B23K2201/40
    • PURPOSE: A system and method for treating a semiconductor substrate using laser are provided to perform a variety of processes on various semiconductor substrates by using control data determined from images of a slot and the substrates. CONSTITUTION: A system includes a storage part, a process control part, and a substrate treatment part. The storage part(110) stores control data for a slot according to treatment processes. A semiconductor substrate is loaded on the slot. The process control part(120) detects identification information of the slot. The process control part controls the treatment process of the semiconductor substrate by reading the control data corresponding to the identification information. The substrate treatment part(130) treats the semiconductor substrate by using laser beam having the predetermined energy corresponding to the read control data.
    • 目的:提供使用激光处理半导体衬底的系统和方法,通过使用从槽和衬底的图像确定的控制数据,在各种半导体衬底上执行各种处理。 构成:系统包括存储部件,过程控制部件和基板处理部件。 存储部(110)根据处理处理存储时隙的控制数据。 半导体衬底被加载在槽上。 处理控制部(120)检测槽的识别信息。 过程控制部分通过读取对应于识别信息的控制数据来控制半导体衬底的处理过程。 基板处理部(130)通过使用具有与读取控制数据对应的规定能量的激光束来对半导体基板进行处理。
    • 6. 发明公开
    • 반도체 기판의 처리 생산성을 향상시키기 위한 반도체제조 장치 및 이를 이용한 반도체 제조 방법
    • 用于提高半导体基板的生产率的半导体制造装置和使用该半导体基板的半导体制造方法
    • KR1020040092306A
    • 2004-11-03
    • KR1020030026587
    • 2003-04-26
    • 주식회사 한택
    • 김대진류제길김현중
    • H01L21/02
    • PURPOSE: A semiconductor manufacturing apparatus and method are provided to improve the productivity of semiconductor substrates and to reduce the unit cost of products by driving simultaneously a plurality of chucks using only one motor. CONSTITUTION: A semiconductor manufacturing apparatus(100) includes a laser generator(102), an optical system(104), a vacuum chamber(120), a stage(121) in the vacuum chamber, a motor, and pumping system(140). A plurality of chucks(126,128) are installed on the stage to load semiconductor substrates(130,132). The chucks are driven through a plurality of screws by using the motor. The screws are rotated to opposite directions from a center of a linear motion guide.
    • 目的:提供一种半导体制造装置和方法,以提高半导体基板的生产率并且通过仅使用一个电动机同时驱动多个卡盘来降低产品的单位成本。 构成:半导体制造装置(100)包括激光发生器(102),光学系统(104),真空室(120),真空室中的台(121),电动机和泵送系统(140) 。 多个卡盘(126,128)安装在载物台上以加载半导体基板(130,132)。 通过使用电动机将卡盘驱动通过多个螺钉。 螺钉从直线运动导轨的中心旋转到相反的方向。
    • 7. 发明授权
    • 광모듈 패키지
    • 광모듈패키지
    • KR100415754B1
    • 2004-01-24
    • KR1020020004426
    • 2002-01-25
    • 주식회사 한택
    • 주관종최재식양진세김상모지광순김억연정기우김은하김도훈송경수이지연
    • G02B6/00
    • PURPOSE: An optical module package is provided to previously prevent the thermal stress to the spiral optical fiber coupled to the optical device. CONSTITUTION: An optical module package includes an optical device(140), an optical fiber(120), a substrate(130), a thermal expansion correction member(190), a package sidewall. The optical fiber(120) having a predetermined period without having a coated layer from the end is optically connected to the optical device(140). The thermal expansion correction member(190) supports the substrate(130) at a specific portion. And, the package sidewall is provided with a first part for supporting the optical fiber(120) at the position being spaced apart from the substrate(130) and a second part for supporting the specific portion of the thermal expansion correction portion at the position being spaced apart from the specific portion at a direction opposite to the first part. In the optical module package, the thermal expansion correction member(190) has a thermal expansion coefficient being larger than that of the package side wall.
    • 目的:提供光学模块封装以预先防止耦合到光学装置的螺旋光纤的热应力。 构成:光模块封装包括光学器件(140),光纤(120),衬底(130),热膨胀校正构件(190),封装侧壁。 具有预定周期而没有从末端起具有涂层的光纤(120)光学连接到光学装置(140)。 热膨胀修正部件190在特定部位支撑基板130。 并且,封装侧壁在与基板(130)隔开的位置设置有用于支撑光纤(120)的第一部分和用于支撑热膨胀校正部分的特定部分的第二部分, 在与第一部分相反的方向上与特定部分间隔开。 在光模块封装中,热膨胀修正部件(190)的热膨胀系数大于封装件侧壁的热膨胀系数。
    • 8. 发明公开
    • 반도체소자의 솔더 볼 검사 장치 및 방법
    • 用于测试半导体器件的焊球的装置和方法
    • KR1020010108632A
    • 2001-12-08
    • KR1020000029244
    • 2000-05-30
    • 주식회사 한택
    • 양진세
    • H01L21/66
    • 본 발명은 반도체소자의 솔더 볼 검사장치 및 그 방법에 관한 것으로서, 반도체소자의 솔더 볼 검사장치는 전후좌우로 이동이 가능한 테이블에 피검사체인 솔더 볼이 형성되어 있는 보드를 탑재하고, 상기 테이블의 상부는 정해진 입사각으로 광을 조사하는 링 형상의 광원들이 설치되어 있어 상기 광원들이 조절기의 신호에 따라 순차적으로 광을 조사하면, 원형 솔더 볼의 표면에 링무늬가 형성되며, 이렇게 형성된 링무늬들을 테이블 직상부에 설치되어 있는 카메라로 두 프레임 이상 촬영하여 이미지 처리부에서 광조사각과 무늬간격등의 기초 정보로부터 솔더 볼의 표면 정보를 얻고, 이를 기초로 솔더 볼의 삼차원 표면을 재현하여 솔더 볼의 3차원 정보를 효과적으로 얻을 수 있어 솔더 볼의 균일성이나 이상 유무를 간단하게 알 수 있다.
    • 9. 发明授权
    • 분류테이블 및 이를 이용한 싱귤레이션 장치
    • 使用分拣表的分拣台和。ATION ATION ATION ATION ATION。。。。。。。。。
    • KR101281495B1
    • 2013-07-17
    • KR1020130037356
    • 2013-04-05
    • 주식회사 한택
    • 김홍열강형규
    • H01L21/683H01L21/50H01L21/301
    • PURPOSE: A sorting table and a singulation apparatus using the same are provided to reduce the process time by configuring the sorting table in a zigzag array so as to be able to sort in one table. CONSTITUTION: A first package group adsorption pad (652) is fixed on an upper plate (650). The first package group adsorption pad is vacuum connected to an upper plate vacuum connecting tube (610). A lower plate (640) is installed in the lower part of the upper plate with an interval. A second package group adsorption pad (660) is connected to a lower plate vacuum connecting tube (620). The first package group adsorption pad and the second package group adsorption pad are formed in a zigzag array on one sorting table.
    • 目的:提供一种排序表和使用该分类表的分割装置,以通过将分类表配置成Z字形阵列以便能够在一个表中进行排序来减少处理时间。 构成:第一包装组吸附垫(652)固定在上板(650)上。 第一组组吸附垫被真空连接到上板真空连接管(610)。 下板(640)以间隔安装在上板的下部。 第二包装组吸附垫(660)连接到下板真空连接管(620)。 第一包装组吸附垫和第二包装组吸附垫在一个分拣台上以锯齿形排列形成。
    • 10. 发明公开
    • 어레이 광 콜리메이터
    • 阵列光学吸收器
    • KR1020130016456A
    • 2013-02-15
    • KR1020120145453
    • 2012-12-13
    • 주식회사 한택
    • 최재식김도훈김중택주관종김효겸
    • G02B27/30G02B6/40
    • G02B27/30G02B3/0006G02B6/30G02B6/3672G02B6/403
    • PURPOSE: An array optical collimator using a passive alignment method is provided to easily and accurately arrange an optical fiber array and a lens array. CONSTITUTION: An array optical collimator(1000) includes a lens array block(100), an optical fiber array block(200), and a base board(300). The lens array block arranges multiple lenses in an array form. The optical fiber array block arranges multiple optical fibers in an array form. The base board combines the lens array block and the optical fiber array block and composes optical coupling between the lens array block and the optical fiber array block. The optical axial direction of the optical fiber is inclined to the optical axial direction of the lens, and light outputted from the optical fiber enters the lens in the optical axial direction of the lens.
    • 目的:提供使用无源对准方法的阵列光学准直器,以容易且准确地布置光纤阵列和透镜阵列。 构造:阵列光学准直器(1000)包括透镜阵列块(100),光纤阵列块(200)和基板(300)。 透镜阵列块以阵列形式布置多个透镜。 光纤阵列块以阵列形式布置多条光纤。 基板组合透镜阵列块和光纤阵列块,并构成透镜阵列块和光纤阵列块之间的光耦合。 光纤的光轴方向与透镜的光轴方向倾斜,从光纤输出的光在透镜的光轴方向上进入透镜。