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    • 2. 发明公开
    • 구조인자 조절을 통한 극자외선 노광공정용 Mo/Si반사형 다층박막
    • 通过控制结构因子的超紫外线曝光过程的多晶硅反射型多层薄膜
    • KR1020030069428A
    • 2003-08-27
    • KR1020020009057
    • 2002-02-20
    • 학교법인 한양학원
    • 안진호정용재이승윤허성민손영수
    • H01L21/027
    • PURPOSE: A molybdenum-silicon reflection type multilayered thin film for an ultraviolet exposure process by controlling a structure factor is provided to increase yield by forming a multilayered thin film mirror having high reflectivity regarding the light of an ultraviolet region. CONSTITUTION: A dual structure of a molybdenum layer and a silicon layer is repeatedly stacked on a semiconductor substrate in a period of 40. At least one of the lowermost molybdenum layers in the first to fifth periods of the stack structure is 2.9-3.3 nanometer in thickness. The molybdenum layer of the stack structure in the period of sixth or higher is 2.7-2.9 nanometer in thickness and the silicon layer is 3.9-4.1 nanometer in thickness.
    • 目的:提供一种通过控制结构因素进行紫外线曝光工艺的钼硅反射型多层薄膜,以通过形成关于紫外线区域的高反射率的多层薄膜反射镜来提高产量。 构成:在40个周期内,在半导体衬底上重复层叠钼层和硅层的双重结构。堆叠结构的第一至第五周期中的最下层钼层中的至少一个为2.9-3.3纳米 厚度。 第六层或更高层的堆叠结构的钼层的厚度为2.7-2.9纳米,硅层的厚度为3.9-4.1纳米。
    • 3. 发明授权
    • 마스크 멤브레인의 제조방법
    • 마스크멤브레인의제조방법
    • KR100392191B1
    • 2003-07-22
    • KR1020010023327
    • 2001-04-30
    • 학교법인 한양학원
    • 안진호박창모
    • H01L21/027
    • PURPOSE: A method for fabricating a mask membrane is provided to compensate the disadvantage of as a mask membrane for LIGA by using synthesized by ECR plasma CVD. CONSTITUTION: The first process is that gases of 5 percent SiH4, CH4 and N2 mixing Ar are deposited on a p-type silicon substrate while changing microwave power from 300W to 600W and the temperature of substrate from 400 to 700 with the pressure fixed 10m Torr. The second process is that on the back side is made to form window opening which is dry-etched to expose Si after and is deposited respectively on each side of Si wafer. The sheet is etched to be membrane by using KOH liquid at temperature 85.
    • 目的:提供一种用于制造掩模膜的方法,以补偿通过使用由ECR等离子体CVD合成的作为用于LIGA的掩模膜的缺点。 构成:第一种工艺是将5%SiH 4,CH 4和N 2混合Ar的气体沉积在p型硅衬底上,同时将压力固定为10m Torr的微波功率从300W变为600W并且将衬底温度从400变为700 。 第二个过程是在背面形成窗口,该窗口被干蚀刻以暴露出Si之后的Si,并分别沉积在Si晶片的每一侧上。 通过在85℃下使用KOH液体将片材蚀刻成膜。
    • 4. 发明公开
    • 반사형 다층 박막 미러 및 그 제조 방법
    • 反射多层薄膜反射镜及其制造方法
    • KR1020030054211A
    • 2003-07-02
    • KR1020010084340
    • 2001-12-24
    • 학교법인 한양학원
    • 안진호정용재이승윤허성민
    • H01L21/027
    • PURPOSE: A reflective multilayer thin film mirror and a method for manufacturing the same are provided to be capable of improving the yield of a device by applying the mirror to a mask for carrying out an exposure process at a semiconductor device. CONSTITUTION: An Ru layer(12) is formed on a semiconductor substrate(10). An Mo layer(14) is formed on the Ru layer. An Sr layer(16) is formed on the Mo layer. A silicon layer(18) is then formed on the Sr layer. Preferably, the first thickness rate between the Ru layer and Mo layer is at the range of 20:80-60:40 % and the second thickness rate between the Sr layer and silicon layer is at the range of 30-60:70-40 %. Preferably, the first sum thickness of the Ru layer and Mo layer is at the range of 2.4-3.2 nm and the second sum thickness of the Sr layer and silicon layer is at the range of 3.6-4.4 nm.
    • 目的:提供一种反射型多层薄膜反射镜及其制造方法,其能够通过将反射镜应用于在半导体器件上进行曝光处理的掩模来提高器件的产量。 构成:在半导体衬底(10)上形成Ru层(12)。 在Ru层上形成Mo层(14)。 在Mo层上形成Sr层(16)。 然后在Sr层上形成硅层(18)。 优选地,Ru层和Mo层之间的第一厚度率在20:80-60:40%的范围内,并且Sr层和硅层之间的第二厚度比率在30-60:70-40的范围内 %。 优选地,Ru层和Mo层的第一和厚度在2.4-3.2nm的范围内,并且Sr层和硅层的第二和厚度在3.6-4.4nm的范围内。
    • 5. 发明公开
    • 극자외선 노광 공정용 Ru/Mo/Si 반사형 다층 박막미러
    • 钌/钼/硅反射型多层薄膜曝光工艺使用极端超紫外线
    • KR1020020089613A
    • 2002-11-30
    • KR1020010028385
    • 2001-05-23
    • 학교법인 한양학원
    • 안진호정용재이승윤허성민
    • G02B1/10G02B5/08C03C17/34G03F7/20
    • G02B1/10C03C17/3411G02B5/0833G03F7/70166
    • PURPOSE: A ruthenium/molybdenum/silicon reflection type multi-layered thin film for exposure process using extreme ultraviolet rays is provided to improve a yield of the exposure process using extreme ultraviolet rays by using a reflective multi-layered thin film having high reflexibility. CONSTITUTION: A ruthenium layer(12), a molybdenum layer(13), and a silicon layer(14) are sequentially laminated on a surface of a silicon substrate(11). A multi-layer of three layers is formed by laminating the ruthenium layer(12), the molybdenum layer(13), and the silicon layer(14). A multi-layered thin film is formed by laminating the multi-layer including the ruthenium layer(12), the molybdenum layer(13), and the silicon layer(14) forty times. Accordingly, the multi-layered thin film is formed with 40 multi-layers. The ruthenium layer(12), the molybdenum layer(13), and the silicon layer(14) have thickness of 1.12nm, 1.68nm, and 4nm, respectively.
    • 目的:提供一种用于使用极紫外线的曝光工艺的钌/钼/硅反射型多层薄膜,以通过使用具有高反射性的反射性多层薄膜来提高使用极紫外线的曝光工艺的产量。 构成:在硅衬底(11)的表面上依次层叠钌层(12),钼层(13)和硅层(14)。 通过层叠钌层(12),钼层(13)和硅层(14)来形成多层三层。 通过将包含钌层(12),钼层(13)和硅层(14)的多层层叠四十次来形成多层薄膜。 因此,多层薄膜形成为40多层。 钌层(12),钼层(13)和硅层(14)分别具有1.12nm,1.68nm和4nm的厚度。
    • 6. 发明授权
    • 반사형 다층 박막 미러 및 그 제조 방법
    • 반사형다층박막미러및그제조방법
    • KR100454081B1
    • 2004-10-20
    • KR1020010084340
    • 2001-12-24
    • 학교법인 한양학원
    • 안진호정용재이승윤허성민
    • H01L21/027
    • PURPOSE: A reflective multilayer thin film mirror and a method for manufacturing the same are provided to be capable of improving the yield of a device by applying the mirror to a mask for carrying out an exposure process at a semiconductor device. CONSTITUTION: An Ru layer(12) is formed on a semiconductor substrate(10). An Mo layer(14) is formed on the Ru layer. An Sr layer(16) is formed on the Mo layer. A silicon layer(18) is then formed on the Sr layer. Preferably, the first thickness rate between the Ru layer and Mo layer is at the range of 20:80-60:40 % and the second thickness rate between the Sr layer and silicon layer is at the range of 30-60:70-40 %. Preferably, the first sum thickness of the Ru layer and Mo layer is at the range of 2.4-3.2 nm and the second sum thickness of the Sr layer and silicon layer is at the range of 3.6-4.4 nm.
    • 目的:提供一种反射多层薄膜反射镜及其制造方法,通过将反射镜应用于在半导体器件上进行曝光处理的掩模,能够提高器件的成品率。 构成:Ru半导体层(12)形成在半导体衬底(10)上。 Mo层(14)形成在Ru层上。 在Mo层上形成Sr层(16)。 然后在Sr层上形成硅层(18)。 优选地,Ru层和Mo层之间的第一厚度比率在20:80-60:40%的范围内,并且Sr层和硅层之间的第二厚度比率在30-60:70-40的范围内 %。 优选地,Ru层和Mo层的第一总和厚度在2.4-3.2nm的范围内,并且Sr层和硅层的第二总和厚度在3.6-4.4nm的范围内。
    • 8. 发明授权
    • 구조인자 조절을 통한 극자외선 노광공정용 Mo/Si반사형 다층박막
    • 인극극극Mo Mo
    • KR100412069B1
    • 2003-12-18
    • KR1020020009057
    • 2002-02-20
    • 학교법인 한양학원
    • 안진호정용재이승윤허성민손영수
    • H01L21/027
    • PURPOSE: A molybdenum-silicon reflection type multilayered thin film for an ultraviolet exposure process by controlling a structure factor is provided to increase yield by forming a multilayered thin film mirror having high reflectivity regarding the light of an ultraviolet region. CONSTITUTION: A dual structure of a molybdenum layer and a silicon layer is repeatedly stacked on a semiconductor substrate in a period of 40. At least one of the lowermost molybdenum layers in the first to fifth periods of the stack structure is 2.9-3.3 nanometer in thickness. The molybdenum layer of the stack structure in the period of sixth or higher is 2.7-2.9 nanometer in thickness and the silicon layer is 3.9-4.1 nanometer in thickness.
    • 目的:通过控制结构因素来提供用于紫外曝光工艺的钼 - 硅反射型多层薄膜,以通过形成对紫外区域的光具有高反射率的多层薄膜镜来提高产量。 构成:钼层和硅层的双重结构在40周期内重复堆叠在半导体衬底上。在堆叠结构的第一到第五周期中的最下面的钼层中的至少一层是2.9-3.3纳米 厚度。 堆叠结构在六分之一或更高阶段中的钼层的厚度为2.7-2.9纳米,并且硅层的厚度为3.9-4.1纳米。
    • 10. 发明公开
    • 마스크 멤브레인의 제조방법
    • 用于制备掩膜的方法
    • KR1020020083730A
    • 2002-11-04
    • KR1020010023327
    • 2001-04-30
    • 학교법인 한양학원
    • 안진호박창모
    • H01L21/027
    • PURPOSE: A method for fabricating a mask membrane is provided to compensate the disadvantage of as a mask membrane for LIGA by using synthesized by ECR plasma CVD. CONSTITUTION: The first process is that gases of 5 percent SiH4, CH4 and N2 mixing Ar are deposited on a p-type silicon substrate while changing microwave power from 300W to 600W and the temperature of substrate from 400 to 700 with the pressure fixed 10m Torr. The second process is that on the back side is made to form window opening which is dry-etched to expose Si after and is deposited respectively on each side of Si wafer. The sheet is etched to be membrane by using KOH liquid at temperature 85.
    • 目的:提供一种制造掩模膜的方法,以通过使用ECR等离子体CVD合成来补偿作为LIGA的掩模膜的缺点。 构成:第一个过程是将5%SiH4,CH4和N2混合Ar的气体沉积在p型硅衬底上,同时将微波功率从300W改变到600W,衬底温度从400到700,压力固定在10m Torr 。 第二个过程是在背面上形成窗口,其被干蚀刻以在Si晶片的每一侧分别沉积Si并分别沉积。 在85℃下用KOH液将该片材蚀刻成膜。