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1. 发明授权

KR101228306B1 회로소자 제거장치 및 방법 有权
标题翻译：从基板上去除电子器件的装置和方法
公开(公告)号：KR101228306B1
公开(公告)日：2013-01-31
申请号：KR1020110112880
申请日：2011-11-01
申请人： 주식회사 이오테크닉스
发明人： 이감명 , 박상영
IPC分类号： H05K3/34 , H05K13/00 , B23K3/02
摘要： PURPOSE: A circuit element removing device and a method thereof are provided to reduce the quantity of solder materials remaining on a substrate after a separation process by separating a circuit element through quick heating. CONSTITUTION: A substrate(10) including a circuit element(20) is installed in a stage(200). A clamping device for fixing the substrate is prepared on the stage. A light source device(100) heats a circuit element by emitting light to the circuit element. A solder material is formed between the circuit element and the substrate. The circuit element is removed from the substrate by lifting the circuit element. The light source device is generated as a laser device for emitting laser light having high energy density. A vacuum jig(300) is installed between the light source device and the circuit element. A vacuum detector(420) detects changes of suction force provided to a penetration unit. [Reference numerals] (410) Vacuum pump; (420) Vacuum detector; (700) Control unit
摘要翻译：目的：提供电路元件去除装置及其方法，以通过快速加热分离电路元件来减少分离处理后残留在基板上的焊料材料的量。构成：包括电路元件（20）的基板（10）安装在台（200）中。在台上制备用于固定基板的夹紧装置。光源装置（100）通过向电路元件发射光来加热电路元件。在电路元件和基板之间形成焊料。通过提升电路元件将电路元件从基板上移除。光源装置被生成为用于发射具有高能量密度的激光的激光装置。真空夹具（300）安装在光源装置和电路元件之间。真空检测器（420）检测提供给穿透单元的抽吸力的变化。（附图标记）（410）真空泵; （420）真空检测器; （700）控制单元

2. 发明公开

KR1020120016456A 레이저 가공장치 및 레이저 가공방법 无效
标题翻译：激光加工设备和激光加工方法
公开(公告)号：KR1020120016456A
公开(公告)日：2012-02-24
申请号：KR1020100078826
申请日：2010-08-16
申请人： 주식회사 이오테크닉스
发明人： 정영대 , 성천야 , 김형욱 , 이감명 , 김환
IPC分类号： B23K26/064 , B23K26/364 , G02B26/08
摘要： PURPOSE: A laser processing apparatus and method are provided to reduce the interval between laser spots of a substrate by increasing laser oscillation frequency, thereby improving the speed of laser processing. CONSTITUTION: A laser processing apparatus comprises a light source, a first beam splitter(121), and a path difference generating unit. The light source oscillates a laser beam(L) with a fixed frequency. The first beam splitter divides the laser beam emitted from the light source into first and second laser beams(L1,L2). The path difference generating unit irradiates the first and second laser beams to a substrate with a path difference according to a processing direction.
摘要翻译：目的：提供一种激光加工装置和方法，通过增加激光振荡频率来减小基板的激光点之间的间隔，从而提高激光加工的速度。构成：激光加工装置包括光源，第一分束器（121）和路径差产生单元。光源以固定频率振荡激光束（L）。第一分束器将从光源发射的激光束分成第一和第二激光束（L1，L2）。路径差产生单元根据处理方向将具有路径差的第一和第二激光束照射到基板。

3. 发明公开

KR1020110132138A 레이저 가공장치의 척 테이블 장치, 이를 채용한 레이저 가공 장치, 및 척킹 방법 有权
标题翻译：用于激光加工装置的激光打印机装置，采用其的激光加工装置及其切割方法
公开(公告)号：KR1020110132138A
公开(公告)日：2011-12-07
申请号：KR1020100051979
申请日：2010-06-01
申请人： 주식회사 이오테크닉스
发明人： 이감명 , 박상영
IPC分类号： B23K37/04 , B23Q3/15
摘要： PURPOSE: A laser processing device, a chuck table device of the laser processing device, and a chucking method are provided to remove a need for a separate fixed jig depending on a target since the target is fixed by vacuum pressure and magnetic force even if the size and outer shape of the target change. CONSTITUTION: A chuck table device of a laser processing device comprises a table(110), an absorbing bed(120), a lattice bed(130), a first magnet, and a second magnet. The absorption bed is arranged on the table. The absorption bed comprises a plurality of vacuum absorption parts(140). The lattice bed comprises a plurality of lattices supporting targets. The vacuum absorption parts are located in a plurality of lattices. The first magnet is arranged in the lattices. The target is located between the first and second magnets. The first magnet is detachably arranged in the lattices.
摘要翻译：目的：提供一种激光加工装置，激光加工装置的卡盘装置以及夹持方法，以便由于目标被真空压力和磁力固定，因此，除了目标之外，还需要单独的固定夹具，即使大小和外形的目标变化。构成：激光加工装置的卡盘装置包括台（110），吸收床（120），格子床（130），第一磁体和第二磁体。吸收床布置在桌子上。吸收床包括多个真空吸收部分（140）。网格床包括多个支撑靶的格子。真空吸收部分位于多个格子中。第一个磁体排列在格子中。目标位于第一和第二磁体之间。第一磁体可拆卸地布置在格子中。

4. 发明授权

KR101262923B1 레이저를 이용한 스크라이빙 방법 및 스크라이빙 장치 有权
标题翻译：激光划线方法和装置
公开(公告)号：KR101262923B1
公开(公告)日：2013-05-09
申请号：KR1020100079227
申请日：2010-08-17
申请人： 주식회사 이오테크닉스
发明人： 정영대 , 성천야 , 김형욱 , 이감명 , 김환
IPC分类号： C03B33/033 , B23K26/364 , B23K26/38 , C03B33/02
摘要： 개시된레이저를이용한스크라이빙방법은, 제1레이저헤드를이용하여가공대상물에제1레이저빔을조사하여열적스트레스를가하는단계와, 제2레이저헤드를이용하여가공대상물에제2레이저빔을조사하여열적스트레스를증폭시켜가공대상물의표면에절단을위한스크라이빙라인을형성하는단계를포함한다.

5. 发明公开

KR1020120016781A 레이저를 이용한 스크라이빙 방법 및 스크라이빙 장치 有权
标题翻译：激光扫描方法和装置
公开(公告)号：KR1020120016781A
公开(公告)日：2012-02-27
申请号：KR1020100079227
申请日：2010-08-17
申请人： 주식회사 이오테크닉스
发明人： 정영대 , 성천야 , 김형욱 , 이감명 , 김환
IPC分类号： C03B33/033 , B23K26/364 , B23K26/38 , C03B33/02
摘要： PURPOSE: Scribing method and apparatus using laser are provided to easily form scribing lines of crack forms on the surface of a target without excessive energy by amplifying thermal stress on the target based on additional laser beam. CONSTITUTION: A scribing method using laser includes the following: thermal stress is applied to a target(50) by irradiating first laser using a first laser head(100). Scribing lines are formed on the surface of the target by irradiating second laser beam to the target using a second laser head(200) and amplifying thermal stress on the target. When the thermal stress is applied to the target, the first laser beam is focused to the surface or the inside of the target. The scribing apparatus includes the first laser head and a second laser head. The scribing apparatus further includes a condenser lens(40) which focuses the first laser beam on the surface of the target.
摘要翻译：目的：提供使用激光的划线方法和装置，通过基于附加的激光束放大目标物上的热应力，轻松地在目标表面上形成裂纹形式的划线，而不会产生过多的能量。构成：使用激光的划线方法包括以下：通过使用第一激光头（100）照射第一激光来对靶（50）施加热应力。通过使用第二激光头（200）将第二激光束照射到靶上并放大靶上的热应力，在靶的表面上形成刻划线。当对应力施加热应力时，第一激光束被聚焦到靶的表面或内部。划线装置包括第一激光头和第二激光头。划线装置还包括将第一激光束聚焦在靶的表面上的聚光透镜（40）。

6. 发明公开

KR1020120016458A 표면 스크라이빙을 이용한 레이저 가공방법 无效
标题翻译：使用表面切割的激光加工方法
公开(公告)号：KR1020120016458A
公开(公告)日：2012-02-24
申请号：KR1020100078828
申请日：2010-08-16
申请人： 주식회사 이오테크닉스
发明人： 정영대 , 성천야 , 김형욱 , 이감명 , 김환
IPC分类号： B23K26/364 , B23K26/046 , B23K26/08 , B23K26/70
摘要： PURPOSE: A laser processing method using surface scribing is provided to easily cut a work piece without damage to a semiconductor device laminated on the work piece because a scribing line is formed on the surface of the work piece when crack rows are formed inside the work piece. CONSTITUTION: A laser processing method using surface scribing is as follows. A laser beam(L) is focused in a fixed position inside a work piece(100). Either the laser beam or the work piece is moved in a first direction and an inner crack is formed at a predetermined depth from the surface of the work piece and, at the same time, a scribing line(152) corresponding to the inner crack is formed on the surface of the work piece.
摘要翻译：目的：提供使用表面划线的激光加工方法，以便在不损坏层压在工件上的半导体器件的情况下容易地切割工件，因为当在工件内形成裂纹行时，在工件的表面上形成划线。构成：使用表面划线的激光加工方法如下。激光束（L）被聚焦在工件（100）内的固定位置。无论是激光束还是工件沿第一方向移动，并且内部裂纹形成在距离工件的表面的预定深度处，并且同时，与内部裂纹相对应的划线（152）形成在工件的表面上。

7. 发明公开

KR1020140066864A 레이저 가공 방법 및 이를 적용하는 장치 无效
标题翻译：激光加工方法和采用该方法的装置
公开(公告)号：KR1020140066864A
公开(公告)日：2014-06-03
申请号：KR1020120133150
申请日：2012-11-22
申请人： 주식회사 이오테크닉스
发明人： 이동준 , 현동원 , 정회민 , 이감명
IPC分类号： B23K26/06 , H01L21/301
摘要： Provided are a laser processing method and a device thereof. The laser processing method includes a step of forming a laser beam which travels along a traveling axis; a step of forming a long horizontal laser beam having a long horizontal rectangular cross section, which has different widths in a first direction and a second direction different from the first direction, by controlling the shape of the cross section of the laser beam; and a step of processing a workpiece by concentrating the long horizontal laser beam on the workpiece and forming a beam spot with a certain size.
摘要翻译：提供了一种激光加工方法及其装置。激光加工方法包括形成沿行进轴行进的激光束的步骤; 通过控制激光束的横截面的形状，形成具有长的水平矩形横截面的长水平激光束的步骤，其具有在第一方向和与第一方向不同的第二方向上的不同宽度; 以及通过将长水平激光束集中在工件上并形成具有一定尺寸的光束点来处理工件的步骤。

8. 发明授权

KR101309807B1 레이저 어닐링 장치 및 레이저 어닐링 방법 有权
标题翻译：激光退火设备和激光退火方法
公开(公告)号：KR101309807B1
公开(公告)日：2013-09-23
申请号：KR1020120034251
申请日：2012-04-03
申请人： 주식회사 이오테크닉스
发明人： 이감명 , 박상영
IPC分类号： H01L21/324
CPC分类号： H01L21/67098 , H01L21/02675 , H01L21/268 , H01L21/324 , H01L21/67242
摘要： PURPOSE: A laser annealing apparatus and a laser annealing method are provided to form a high quality silicon layer by controlling the power of a laser beam emitted from a laser generator. CONSTITUTION: A laser generator irradiates a laser beam to a processing object. The laser generator performs an annealing process. A temperature measurement unit (190) measures temperature in real time. A control unit (200) controls the power of the laser beam. A photo diode (181) detects a change in the reflectivity of the processing object. [Reference numerals] (AA) Temperature; (BB) Time; (CC) User-desiring time-temperature graph
摘要翻译：目的：提供激光退火装置和激光退火方法，以通过控制从激光发生器发射的激光束的功率来形成高质量的硅层。构成：激光发生器将激光束照射到加工对象。激光发生器执行退火处理。温度测量单元（190）实时测量温度。控制单元（200）控制激光束的功率。光电二极管（181）检测处理对象的反射率的变化。（标号）（AA）温度; （BB）时间; （CC）用户期望的时间 - 温度图

9. 发明授权

KR101217697B1 웨이퍼 가공방법 有权
标题翻译：晶圆处理方法
公开(公告)号：KR101217697B1
公开(公告)日：2013-01-02
申请号：KR1020100078825
申请日：2010-08-16
申请人： 주식회사 이오테크닉스
发明人： 정영대 , 성천야 , 김형욱 , 이감명 , 김환
IPC分类号： H01L21/301 , H01L21/78
摘要： 웨이퍼의휘어짐을방지할수 있는웨이퍼가공방법이개시된다. 개시된웨이퍼가공방법은, 스테이지상에웨이퍼를적재하는단계; 웨이퍼의상면에플레이트를압착시키는단계; 및상기플레이트에압착된상기웨이퍼를레이저가공하는단계;를포함한다.

10. 发明公开

KR1020120016782A 레이저 가공장치 및 가공 방법 无效
标题翻译：激光加工设备和方法
公开(公告)号：KR1020120016782A
公开(公告)日：2012-02-27
申请号：KR1020100079228
申请日：2010-08-17
申请人： 주식회사 이오테크닉스
发明人： 정영대 , 성천야 , 김형욱 , 이감명 , 김환
IPC分类号： B23K26/046 , B23K26/064
摘要： PURPOSE: A laser processing apparatus and method are provided to maintain constant energy of a laser beam irradiated on a work piece and reduce the output of an oscillator, thereby reducing power consumption. CONSTITUTION: A laser processing method is as follows. An oscillated laser beam is irradiated on a transparent work piece(50) through a first optical path(101). The laser beam passing through the work piece is collected through a second optical path(102). The collected laser beam is joined to the first optical path and irradiated on the work piece again.
摘要翻译：目的：提供一种激光加工装置和方法，以保持照射在工件上的激光束的恒定能量并减少振荡器的输出，从而降低功耗。构成：激光加工方法如下。振荡的激光束通过第一光路（101）照射在透明工件（50）上。穿过工件的激光束通过第二光路（102）收集。收集的激光束被连接到第一光路并再次照射在工件上。

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