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    • 5. 发明公开
    • 레지스트 하층막용 조성물, 이를 이용한 반도체 집적회로 디바이스의 제조방법 및 그로부터 제조된 반도체 집적회로 디바이스
    • 耐冲击组合物,使用其制造集成电路装置的方法和由该方法生产的半导体装置
    • KR1020110075688A
    • 2011-07-06
    • KR1020090132209
    • 2009-12-28
    • 제일모직주식회사
    • 고상란김상균조현모우창수김미영윤희찬이우진김종섭
    • G03F7/11
    • G03F7/0752C07C33/26C08G77/50C08L83/06G03F7/091G03F7/092G03F7/094G03F7/11H01L21/0332
    • PURPOSE: A composition for a resist sub-layer, a method for manufacturing a semiconductor integrated circuit device using the same, and the semiconductor integrated circuit device manufactured by the same are provided to control the refractive index and the absorbance in a wavelength range which is lower than or equal to 250nm. CONSTITUTION: A composition for a resist sub-layer includes organic silane-based polycondensate and a solvent. The organic silane-based polycondensate is generated from a group represented by chemical formulas 1 or 2 under acidic catalyst and alkaline catalyst. In the chemical formulas, the R1 is halogen, hydroxyl group, alkoxy group, carboxylic group, ester group, cyano group, haloalkyl sulfite group, alkylamine group, alkylsilyl amine group, or alkylsilyloxy group. The Ar1 is substituted or non-substituted C6 to C12 arylene group. The Ar2 and the Ar3 are identical or different and substituted or non-substituted C6 to C12 aryl group. The m and the n are identical or different and are respectively 0 or the integer of 1 to 5.
    • 目的:提供一种抗蚀剂子层用组合物,使用该组合物的半导体集成电路器件的制造方法以及由其制造的半导体集成电路器件,以控制折射率和波长范围内的吸光度, 低于或等于250nm。 构成:抗蚀剂亚层的组合物包括有机硅烷基缩聚物和溶剂。 有机硅烷类缩聚物由酸式催化剂和碱性催化剂由化学式1或2表示的基团生成。 在化学式中,R1为卤素,羟基,烷氧基,羧基,酯基,氰基,卤代烷基亚硫酸酯基,烷基胺基,烷基甲硅烷基胺基或烷基甲硅烷氧基。 Ar 1是取代或未取代的C6至C12亚芳基。 Ar2和Ar3是相同或不同的取代或未取代的C6至C12芳基。 m和n相同或不同,分别为0或1〜5的整数。
    • 6. 发明公开
    • 보관안정성이 우수한 레지스트 하층막용 하드마스크 조성물
    • 具有改进的储存稳定性的光电复合材料制成的HARDMASK组合物
    • KR1020100070035A
    • 2010-06-25
    • KR1020080128625
    • 2008-12-17
    • 제일모직주식회사
    • 고상란김상균임상학김미영윤희찬김도현어동선김종섭
    • G03F7/075
    • G03F7/0752C08G77/18C08L83/04C09D183/04H01L21/02126H01L21/02216H01L21/02282H01L21/0332
    • PURPOSE: A hard mask composition for a resist underlayer film is provided to obtain excellent storage stability, to transfer a superior pattern on a material layer due to excellent hard mask properties, and to have excellent etch resistance to plasma. CONSTITUTION: A hard mask composition comprises an organic silane-based polymer and a stabilizer. The stabilizer is selected from a group which is composed of acetic anhydride, methyl acetoactate, propionic anhydride, ethyl-2-methyl acetoacetate, butyric anhydride, ethyl-2-ethyl acetoacetate, valeric anhydride, 2-methylbutyric anhydride, nonanol, decanol, undecanol, dodecanol, propylene glycol propyl ether, propylene glycol ethyl ether, propylene glycol methyl ether propylene glycol, phenyltrimethoxysilane, diphenylhexamethoxydisiloxane, diphenylhexaethoxydisiloxane, dioctyltetramethyldisiloxane, hexamethyltrisiloxane, tetramethyldisiloxane, diphenylhexaethoxydisiloxane, dioctyltetramethyldisiloxane, hexamethyltrisiloxane, tetramethyldisiloxane, decamethyltetrasiloxane, dodecamethylpentasiloxane, and hexamethyldisiloxane.
    • 目的:提供用于抗蚀剂下层膜的硬掩模组合物以获得优异的储存稳定性,由于优异的硬掩模性能而在材料层上转印优异的图案,并且具有优异的耐等离子体耐蚀刻性。 构成:硬掩模组合物包含有机硅烷基聚合物和稳定剂。 稳定剂选自由乙酸酐,乙酰丙酸甲酯,丙酸酐,乙酰乙酸乙酯,丁酸酐,乙酰乙酸乙酯,戊酸酐,2-甲基丁酸酐,壬醇,癸醇,十一烷醇组成的组 十二烷醇,丙二醇丙醚,丙二醇乙醚,丙二醇甲醚丙二醇,苯基三甲氧基硅烷,二苯基六甲氧基二硅氧烷,二苯基六乙氧基二硅氧烷,二辛基四甲基二硅氧烷,六甲基三硅氧烷,四甲基二硅氧烷,二苯基六乙氧基二硅氧烷,二辛基四甲基二硅氧烷,六甲基三硅氧烷,四甲基二硅氧烷,十甲基四硅氧烷,十二甲基五硅氧烷和六甲基二硅氧烷。
    • 7. 发明公开
    • 포토레지스트 하층막용 하드마스크 조성물 및 이를 이용한반도체 집적회로 디바이스의 제조방법
    • 根据光刻胶涂覆的HARDMASK组合物及其制备半导体器件的方法
    • KR1020090016355A
    • 2009-02-13
    • KR1020070080920
    • 2007-08-10
    • 제일모직주식회사
    • 임상학김상균김미영고상란윤희찬어동선김종섭김도현
    • G03F7/11G03F7/075
    • G03F7/11C07C47/57C07D487/04C08G77/50C08L83/06G02B5/045G03F7/0752G03F7/0757G03F7/091H01L21/31144
    • A hard mask composition for a photoresist under layer, and a method for preparing a semiconductor integrated circuit device by using the composition are provided to improve film characteristics and storage stability and to enhance the solvent resistance against a resist developer. A hard mask composition for a photoresist under layer comprises a silane condensate which is a condensation polymer of the hydrolyzate formed from at least one compound represented by the formula 1; an ammonium salt; and a solvent, wherein R1 is H, a substituted or unsubstituted C1-C30 aliphatic hydrocarbon group, a substituted or unsubstituted C1-C30 aromatic hydrocarbon group, a substituted or unsubstituted C1-C30 alicyclic hydrocarbon group, a substituted or unsubstituted C1-C30 silyl group, a substituted or unsubstituted C1-C30 allyl group, a substituted or unsubstituted C1-C30 acyl group, a vinyl group, an amine group, an acetate group, or an alkali metal; x is 0-2; and R2 is H, a substituted or unsubstituted C1-C4 aliphatic hydrocarbon group, an acetate group, Na, or K.
    • 提供了用于光致抗蚀剂层的硬掩模组合物,以及通过使用该组合物制备半导体集成电路器件的方法,以改善膜特性和存储稳定性,并提高对抗蚀剂显影剂的耐溶剂性。 用于光致抗蚀剂底层的硬掩模组合物包括硅烷缩合物,其是由至少一种由式1表示的化合物形成的水解产物的缩聚物; 铵盐; 和其中R 1为H,取代或未取代的C 1 -C 30脂族烃基,取代或未取代的C 1 -C 30芳族烃基,取代或未取代的C 1 -C 30脂环族烃基,取代或未取代的C 1 -C 30甲硅烷基 取代或未取代的C 1 -C 30烯丙基,取代或未取代的C 1 -C 30酰基,乙烯基,胺基,乙酸酯基或碱金属; x是0-2; R 2为H,取代或未取代的C 1 -C 4脂族烃基,乙酸基,Na或K.