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    • 3. 发明授权
    • 저장 셀 장치 및 그 제조 방법
    • 저장셀장치및그제조방법
    • KR100396387B1
    • 2003-09-03
    • KR1020007010545
    • 1999-03-23
    • 인피니언 테크놀로지스 아게
    • 라이징어,한스슈텡글,라인하르트빌러,요제프호프만,프란쯔크라우트슈나이더,볼프강폰바쎄,파울-베르너
    • H01L27/115
    • H01L27/11568H01L21/76224H01L27/115
    • The invention relates to a storage cell arrangement. According to the invention several storage cells are present in the area of a main surface of a semiconductor substrate (10), the storage cells are arranged in substantially parallel storage cell rows and adjacent storage cell rows are insulated in relation to each other by means of at least one insulating trench (85). The storage cell arrangement comprises at least one gate dielectric containing a material with charge carrier traps and the storage cell rows each present at least one doped area. According to the invention the storage cell arrangement is configured in such a way that the storage cell rows are embodied as segments which protrude from a plane of the semiconductor substrate (10). In addition, the storage cell rows are divided into several parts in such a way that in their upper area they contain at least one bit line (86), in that the gate dielectric is positioned above the bit line (86) and in that the insulating trench (85) penetrates more deeply into the semiconductor substrate than the bit line (86). The invention also relates to a method for producing said storage cell arrangement.
    • 本发明涉及一种存储单元装置。 根据本发明,几个存储​​单元存在于半导体衬底(10)的主表面的区域中,存储单元布置成基本上平行的存储单元行,并且相邻的存储单元行通过 至少一个绝缘沟槽(85)。 存储单元布置包括至少一个栅极电介质,该栅极电介质包含具有电荷载流子陷阱的材料,并且存储单元行每个呈现至少一个掺杂区域。 根据本发明,存储单元布置以这样的方式配置,即,存储单元行被实施为从半导体衬底(10)的平面突出的区段。 此外,存储单元行以这样的方式被分成几个部分,即在其上部区域中它们包含至少一个位线(86),因为栅极电介质位于位线(86)上方,并且其中 与位线(86)相比,绝缘沟槽(85)更深入地穿透半导体衬底。 本发明还涉及一种用于制造所述存储单元装置的方法。