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    • 1. 发明授权
    • 발광 장치
    • 发光装置
    • KR100952044B1
    • 2010-04-07
    • KR1020080097254
    • 2008-10-02
    • 엘지이노텍 주식회사
    • 김등관
    • G09G3/32G02F1/133G09G3/36
    • PURPOSE: A light emitting apparatus is provided to extend an emitting module by connecting a connector between emitting modules. CONSTITUTION: A light emitting apparatus includes a plurality of light emitting modules(110~113), an emitting device and a connector substrate(130). A plurality of light emitting modules comprises a first light emitting module and a second light emitting module. The first light emitting module and the second light emitting module comprise a first polarity line pattern, a roof line pattern, and a second polarity line pattern. The roof line pattern comprises the first polarity terminal and the second polarity terminal. The emitting device is connected to the roof line pattern. The connector substrate is loaded on the first and the second light emitting module. The connector substrate connects the first and the second polarity line pattern to the first and the second polarity terminal of the second emitting module.
    • 目的:提供一种发光装置,通过连接发射模块之间的连接器来扩展发射模块。 构成:发光装置包括多个发光模块(110〜113),发光装置和连接器基板(130)。 多个发光模块包括第一发光模块和第二发光模块。 第一发光模块和第二发光模块包括第一极性线图案,屋顶线图案和第二极性线图案。 屋顶线图案包括第一极性端子和第二极性端子。 发射装置连接到屋顶线图案。 连接器基板被装载在第一和第二发光模块上。 连接器基板将第一和第二极性线图案连接到第二发射模块的第一极性端子和第二极性端子。
    • 2. 发明公开
    • 라이트 유닛 및 이를 구비한 디스플레이장치
    • 光单元及其显示设备
    • KR1020090026841A
    • 2009-03-16
    • KR1020070091870
    • 2007-09-11
    • 엘지이노텍 주식회사
    • 김등관
    • G02F1/13357
    • G02F1/133608G02F1/133603G02F2001/133612G02F2201/46Y10S362/80
    • A light unit and a display apparatus with the same are provided to arrange a connection member between a light emitting module and a bottom cover, thereby physically contacting a light emitting module with the connection member. A write unit(100) is a light emitting device applying light in a lower part of a display panel like an LCD panel. The write unit comprises a bottom cover(110), a light emitting module(120) and a connection member(140). The bottom cover is shaped in a container shape. A groove(114) is formed in the bottom cover. An inclined side(112) is formed in the circumference of the bottom cover. The bottom cover can be made of metal material having good heat protection characteristics. Material or sheet having good reflectivity is formed in an internal bottom surface or/and a side of the bottom cover. A protrusion(118) is formed on the bottom surface of the bottom cover. The protrusion is formed in an area corresponding to the second connect terminal(144,146) of the connection member. One or more light emitting modules are arranged inside the bottom cover. The N light emitting modules are connected to one driving group.
    • 提供了一种灯单元及其显示装置,用于在发光模块和底盖之间布置连接构件,从而使发光模块与连接构件物理接触。 写单元(100)是如LCD面板在显示面板的下部施加光的发光器件。 写入单元包括底盖(110),发光模块(120)和连接构件(140)。 底盖成形为容器形状。 在底盖中形成有凹槽(114)。 在底盖的圆周上形成倾斜面(112)。 底盖可以由具有良好热保护特性的金属材料制成。 具有良好反射率的材料或片材形成在底盖的内底面或/或侧面。 在底盖的底面形成突起(118)。 突起形成在与连接构件的第二连接端子(144,146)相对应的区域中。 一个或多个发光模块布置在底盖内。 N个发光模块连接到一个驱动组。
    • 5. 发明公开
    • 발광 다이오드 및 그 제조방법. 그리고 발광 소자 및 그발광 소자 제조방법
    • 用于制造发光二极管的发光二极管和方法,以及发光装置和用于制造发光器件的方法
    • KR1020100009689A
    • 2010-01-29
    • KR1020080070431
    • 2008-07-21
    • 엘지이노텍 주식회사
    • 박준석김등관신한
    • H01L33/52
    • H01L33/405H01L33/0079H01L33/20H01L33/38H01L33/50H01L33/54H01L2224/48091H01L2924/181H01L2924/00014H01L2924/00012
    • PURPOSE: A light emitting diode and a manufacturing method thereof, a light-emitting device and a light-emitting device manufacturing method are provided to simultaneously process the shape of a molding member of light-emitting devices. CONSTITUTION: A light-emitting device comprises a circuit board(10) with a conductive pattern and a light emitting diode(100) electrically connected to a circuit board through a wire(21). The light-emitting device comprises a guide ring(11) arranged around the light emitting diode. The light-emitting device comprises a first molding material(30) and a second molding material(40). The first molding material is supported by the guide ring. The first molding material comprises a fluorescent substance(31). The second molding material is formed on the first molding material. The conductive support substrate of the light emitting diode is electrically connected to the first conductive pattern.
    • 目的:提供一种发光二极管及其制造方法,发光装置和发光装置的制造方法,以同时处理发光装置的成型体的形状。 构成:发光装置包括具有导电图案的电路板(10)和通过导线(21)电连接到电路板的发光二极管(100)。 发光装置包括布置在发光二极管周围的引导环(11)。 发光装置包括第一成型材料(30)和第二成型材料(40)。 第一成型材料由导向环支撑。 第一成型材料包括荧光物质(31)。 第二成型材料形成在第一成型材料上。 发光二极管的导电支撑基板电连接到第一导电图案。
    • 6. 发明授权
    • 백라이트 유닛 및 이를 포함하는 표시 장치
    • 背光单元和包括其的显示装置
    • KR101836119B1
    • 2018-03-08
    • KR1020110082618
    • 2011-08-19
    • 엘지이노텍 주식회사
    • 윤병욱김등관
    • G02F1/1333G02F1/13357
    • 본발명은바닥면및 측면을가지는도광판; 및상기도광판의측면을향하여빛을조사하는복수의발광칩; 상기복수의발광칩을지지하는모듈기판; 및상기모듈기판과끼움결합하여전기적으로연결되어전원을인가하는커넥터를포함하며, 상기모듈기판은상기발광칩이배치되는영역에형성되며상기커넥터와접촉하여전원을받는전원패드를포함하는라이트유닛을제공한다. 따라서, 커넥터와패드의연결을위한별도의기판및 솔러딩리플로우를수행하지않고, 물리적인결합으로전기적인통전을수행함으로써공정을줄일수 있다.
    • 本发明涉及一种具有底面和侧面的导光板, 以及多个发光芯片,用于朝向导光板的侧表面发射光; 支撑所述多个发光芯片的模块基板; 和用于将模块基板和通过包括一个连接器以将电力提供电连接装配件的写单元中,形成在其被布置在发光芯片的区域中的模块基板包括电源焊垫以接收电源与所述连接器接触 Lt。 因此,可以通过利用物理耦合进行电激励而不用执行单独的基板和用于连接连接器和焊盘的焊接回流来减少处理。
    • 8. 发明公开
    • 라이트 유닛 및 그를 이용한 조명 시스템
    • 光单元和照明系统
    • KR1020140039752A
    • 2014-04-02
    • KR1020120106379
    • 2012-09-25
    • 엘지이노텍 주식회사
    • 김등관
    • G02F1/13357G02F1/1333
    • G02B6/009G02B6/0085G02F1/133308G02F1/133615
    • The present invention relates to a light unit and a lighting system using the same which comprises: a bottom cover; a light guide plate disposed on the upper part of the bottom cover; and a power source module disposed on one side of the light guide plate. The light source module comprises: a first substrate disposed on a first direction to face a side of the light guide plate; a second substrate which is extended from the first substrate and disposed in a second direction to face a part of the lower surface of the light guide plate; and a power source disposed on the first substrate, wherein an angle between the first substrate and the second substrate can be an acute angle. Here, the first substrate is inclined against the side of the light guide plate, and the second substrate can be inclined against the lower surface of the light guide plate. [Reference numerals] (AA, BB) Bezel area
    • 本发明涉及一种光单元和使用该单元的照明系统,该系统包括:底盖; 设置在所述底盖的上部的导光板; 以及设置在导光板一侧的电源模块。 光源模块包括:第一基板,设置在第一方向上以面对导光板的一侧; 第二基板,其从所述第一基板延伸并且设置在与所述导光板的所述下表面的一部分相对的第二方向上; 以及设置在所述第一基板上的电源,其中所述第一基板和所述第二基板之间的角度可以是锐角。 这里,第一基板相对于导光板侧倾斜,第二基板能够相对于导光板的下表面倾斜。 (参考号)(AA,BB)挡板区域
    • 10. 发明公开
    • 질화물 반도체 발광소자 및 그 제조 방법
    • 氮化物半导体发光器件及其制造方法
    • KR1020080024788A
    • 2008-03-19
    • KR1020060089392
    • 2006-09-15
    • 엘지이노텍 주식회사
    • 김등관
    • H01L33/08H01L33/22
    • A nitride semiconductor light emitting device and a manufacturing method thereof are provided to prevent the back drift of a dopant in a p-type semiconductor layer to an active layer by forming a supper lattice layer on the active layer. An n-type semiconductor layer(120) is formed on a substrate(105). An active layer(125) is formed over the n-type semiconductor layer. An LD(Low Doped) p-type semiconductor layer and an un-doped semiconductor layer are alternatively laminated to form a super lattice layer(130) over the active layer. A p-type semiconductor layer(140) is formed on the super lattice layer. The un-doped semiconductor layer of the super lattice layer is alternatively laminated with a super lattice structure under the temperature change of 500 ‹C to 1000 ‹C. The supper lattice layer has an amorphous shape. The un-doped semiconductor layer of the supper lattice layer is Um-GaN layer.
    • 提供一种氮化物半导体发光器件及其制造方法,以通过在有源层上形成超级晶格层来防止p型半导体层中的掺杂剂向有源层的背漂移。 在衬底(105)上形成n型半导体层(120)。 在n型半导体层上形成有源层(125)。 替代地层叠LD(低掺杂)p型半导体层和未掺杂半导体层以在有源层上形成超晶格层(130)。 在超晶格层上形成p型半导体层(140)。 在500℃〜1000℃的温度变化下,超晶格层的未掺杂半导体层交替地层叠有超晶格结构。 超晶格层具有非晶形状。 超级晶格层的未掺杂半导体层是Um-GaN层。