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1. 发明公开

KR1020090060301A 반도체 칩의 범프를 납땜 플럭스로 웨팅하는 방법 및 장치 无效
标题翻译：用焊锡焊丝浸渍半导体芯片的方法和装置
公开(公告)号：KR1020090060301A
公开(公告)日：2009-06-11
申请号：KR1020097005719
申请日：2007-09-11
申请人： 에섹 아게
发明人： 그뤼터,뤼디 , 베르네,도미니크 , 바우만,다미안
IPC分类号： H01L21/60 , B23K1/20 , B23K3/08
CPC分类号： B23K1/203 , B23K2201/40 , H01L21/6715 , H01L2224/11822 , H01L2924/01068
摘要： The invention relates to a method and a device for wetting the bumps of a semiconductor chip with a soldering flux, in which a container (4) that receives the soldering flux and is open towards the bottom and a baseplate (2) containing at least one cavity (3) are moved relative to one another to and fro from one side of the cavity (3) to the other side of the cavity (3). The front wall (5 or 6) of the container (4) as seen in the direction of movement is raised during the relative movement, such that it is situated at a distance above the baseplate (2). The distance is somewhat greater than the height difference by which the soldering flux projects above the level of the surface of the baseplate (2). This measure has the effect that the front wall (5 or 6) of the container (4) does not convey any soldering flux from the cavity (3) onto the baseplate (2), which has previously meant the loss of said soldering flux.
摘要翻译：本发明涉及一种用助焊剂润湿半导体芯片的凸起的方法和装置，其中容纳焊剂并且向底部开口的容器（4）和底板（2），底板（2）至少包含一个空腔（3）相对于空腔（3）的一侧相对于彼此相对于空腔（3）的另一侧彼此移动。在相对运动期间，在运动方向上看到的容器（4）的前壁（5或6）升高，使得其位于基板（2）上方的距离处。该距离稍大于焊接焊剂突出到基板（2）的表面的高度之上的高度差。该措施具有这样的效果：容器（4）的前壁（5或6）不将任何焊剂从空腔（3）传送到基板（2）上，这已经意味着所述焊剂的损失。

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