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1. 发明授权

KR101991965B1 반도체 칩을 실장하기 위한 장치 有权
公开(公告)号：KR101991965B1
公开(公告)日：2019-06-21
申请号：KR1020120133579
申请日：2012-11-23
申请人： 에섹 아게
发明人： 그뤼터뤼디 , 주터구이도
IPC分类号： H01L21/58

2. 发明公开

KR1020090027625A 압축 공기가 인가되고 원의 원호에 위치되는 다수의 채널을포함하는 와이어 본더의 와이어 이송 장치 无效
标题翻译：用于在线束上输送线路的装置，包含受压缩空气和循环弧线的多个通道
公开(公告)号：KR1020090027625A
公开(公告)日：2009-03-17
申请号：KR1020087029962
申请日：2007-06-04
申请人： 에섹 아게
发明人： 펠버,아르민
IPC分类号： H01L23/48 , H01L21/60 , H01L21/00
CPC分类号： B23K20/005 , B23K2201/36 , B65H59/105 , B65H59/387 , B65H2701/361 , H01L21/67138 , H01L24/78 , H01L24/80 , H01L2224/78301 , H01L2224/851 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2224/48 , H01L2224/45099
摘要： An apparatus for feeding a wire (8) from a wire reel (3) to a capillary (14) of a wire bonder comprises a holder (2), which is driven by a motor, for a wire reel (3) and a wire store (4). The wire store (4) has a plurality of channels (9.1 to 9.n), to which compressed air can be applied and whose outlet openings lie on an arc of a circle and span a predetermined angular range (4) and which run in the substantially radial direction with respect to the midpoint of the arc of the circle, in order that the wire (8) runs within the predetermined angular range (4) substantially along an orbit.
摘要翻译：用于将线（8）从线卷（3）馈送到引线接合器的毛细管（14）的装置包括由马达驱动用于线卷（3）和线（3）的保持器（2）商店（4）。电线存储器（4）具有多个通道（9.1至9.n），压缩空气可被施加到其上，并且其出口开口位于圆弧上并且跨越预定的角度范围（4）并且运行在相对于圆弧的中点的大致径向方向，以便线（8）基本上沿着轨道在预定角度范围（4）内延伸。

3. 发明公开

KR1020040034429A 와이어본더로 접합할 때 최적의 접합 파라미터들을결정하기 위한 방법 无效
标题翻译：使用绕线器确定易于使用的最佳接合参数的方法
公开(公告)号：KR1020040034429A
公开(公告)日：2004-04-28
申请号：KR1020030071125
申请日：2003-10-13
申请人： 에섹 아게
发明人： 마이어,미카엘 , 메딩,조나단
IPC分类号： H01L21/60
CPC分类号： H01L24/85 , B23K20/004 , B23K2201/32 , H01L24/48 , H01L24/78 , H01L2224/05599 , H01L2224/4807 , H01L2224/48091 , H01L2224/48227 , H01L2224/4845 , H01L2224/48455 , H01L2224/48465 , H01L2224/4847 , H01L2224/78301 , H01L2224/78302 , H01L2224/85181 , H01L2224/85205 , H01L2224/85399 , H01L2224/859 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01039 , H01L2924/01051 , H01L2924/01075 , H01L2224/45099 , H01L2924/00
摘要： PURPOSE: A method is provided to determine easily optimum bonding parameters in ball bonding as well as wedge bonding. CONSTITUTION: A wire ball is attached on a connection point(4) of a semiconductor chip(5). Predetermined bonding force F81 is applied to the resultant structure. A capillary(1) is moved from the connection position to a predetermined direction. A current In(t) flowing through a driving part is monitored for a desired time t. The driving part is used for moving the capillary. The capillary is stopped as soon as the current In(t) reduces. The maximum value In,max(FB,N, PB,N, GB,N) of the current In(t) is determined from the monitored results. At this time, the FB,N, PB,N, and GB,N are determined as optimum bonding parameters.
摘要翻译：目的：提供一种方法来确定球形接合中的容易最佳的接合参数以及楔形接合。构成：将线球连接在半导体芯片（5）的连接点（4）上。对所得到的结构施加预定的结合力F81。毛细管（1）从连接位置移动到预定方向。流过驱动部件的电流In（t）被监视期望的时间t。驱动部分用于移动毛细管。一旦电流In（t）减小，毛细管就停止。从监视结果确定当前In（t）的最大值In，max（FB，N，PB，N，GB，N）。此时，FB，N，PB，N和GB，N被确定为最佳结合参数。

4. 发明公开

KR1020040055575A 진동하는 모세관의 팁의 진폭을 측정하기 위한 장치 无效
标题翻译：用于测量振荡波动幅度的装置，包括安装在光源和光接收单元之间的透镜
公开(公告)号：KR1020040055575A
公开(公告)日：2004-06-26
申请号：KR1020030086655
申请日：2003-12-02
申请人： 에섹 아게
发明人： 멜체르,마르틴
IPC分类号： G01H9/00
CPC分类号： H01L24/78 , G01H9/00 , H01L2224/78 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01068 , H01L2924/01074 , H01L2924/01082 , H01L2924/12041 , H01L2924/12042 , H01L2224/48 , H01L2224/45099 , H01L2924/00
摘要： PURPOSE: An apparatus is provided to measure amplitude of a tip of a freely oscillating capillary. CONSTITUTION: An intensity of a light beam is adjusted by an oscillation of a tip of a capillary. An apparatus measures an amplitude of a tip of a capillary(1) having a light source(5) and a light receiving device(11). Only two apertured diaphragms(8,10), which are coaxially aligned, are disposed between the light source(5) and the light receiving device(11). A diameter of the light beam is identical to that of the apertured diaphragms(8,10). The apertured diaphragms(8,10) are formed by drill holes aligned on a common axis in sidewalls of a channel formed in a body. The diameter of the apertured diaphragms(8,10) is less than 100 micrometer.
摘要翻译：目的：提供一种用于测量自由振荡毛细管尖端的振幅的装置。构成：通过毛细管尖端的振荡来调节光束的强度。一种装置测量具有光源（5）和光接收装置（11）的毛细管（1）的尖端的振幅。只有两个同轴对准的有孔隔膜（8,10）设置在光源（5）和光接收装置（11）之间。光束的直径与有孔隔膜（8,10）的直径相同。多孔隔膜（8,10）由在主体中形成的通道的侧壁中的公共轴上对准的钻孔形成。有孔隔膜（8,10）的直径小于100微米。

5. 发明公开

KR1020030071623A 와이어 본더의 자유 진동하는 모세관의 진폭을 측정하기위한 방법 및 장치 失效
标题翻译：用于测量引线接合器的自由振动毛细管振幅的方法和设备
公开(公告)号：KR1020030071623A
公开(公告)日：2003-09-06
申请号：KR1020030010081
申请日：2003-02-18
申请人： 에섹 아게
发明人： 그레버,알렉산더 , 헤스,페터 , 미힐러,마르쿠스 , 온다,니콜리노
IPC分类号： G01H9/00
CPC分类号： G01N29/11 , B06B3/02 , G01N29/2418 , G01N2291/015 , H01L24/78 , H01L2224/78925 , H01L2924/00014 , H01L2924/12042 , H01L2224/45099 , H01L2924/00
摘要： 측정이 모세관에 의한 광빔(6)의 차광에 기초를 두며, 그리고 상기 광빔의 강도는 수광자(14)에 의해 측정되는, 초음파가 초음파 변환기(2)로부터 가해질 수 있는 호온(3)에 고정되는 모세관(1)의 팁 진동의 진폭의 성분 A
y 의 측정시에, 상기 모세관은 그것이 광빔을 차광함없이 광빔의 일측에 위치되며 초음파가 그것에 가해진다. 상기 모세관은 그 다음에 단계들 내에서 광빔을 통과하여 이동되는데, 여기서, i = 1 내지 n 단계들의 각각에 대하여, 좌표 y
i 뿐만 아니라 수광자의 출력 신호의 직류 전압부 U
DC (y
i ) 및 교류 전압부 U
AC (y
i )가 결정되고, 여기서 좌표 y
i 는 광빔에 수직으로 연장되는 좌표축 y에 대한 모세관의 위치를 나타내다. 진폭 A
y 는 그 다음에 상기 측정값들로부터 산출된다.

6. 发明公开

KR1020130058628A 반도체 칩을 실장하기 위한 장치 审中-实审
标题翻译：安装半导体芯片的装置
公开(公告)号：KR1020130058628A
公开(公告)日：2013-06-04
申请号：KR1020120133579
申请日：2012-11-23
申请人： 에섹 아게
发明人： 그뤼터뤼디 , 주터구이도
IPC分类号： H01L21/58
CPC分类号： H05K13/0404 , H01L21/67144 , H01L24/75 , H01L2224/75701 , H01L2224/75702 , H01L2224/75804 , H01L2224/75822 , Y10T29/53178
摘要： PURPOSE: An apparatus for mounting semiconductor chips are provided to be easily controllable according to various conditions. CONSTITUTION: A pick and place system(4) includes a single bonding head(5). A pickup head(7) and a support table(8) are mounted on a carriage(6). The carriage reciprocates between a first position and a second position. A first camera(10) photographs a semiconductor chip(12) arranged on a wafer table(1). A second camera(11) photographs the semiconductor chip arranged on the support table. A control unit(9) adjusts the pick and place system to align the semiconductor chip on a substrate(2).
摘要翻译：目的：提供一种用于安装半导体芯片的装置，以便根据各种条件容易地控制。构成：拾取和放置系统（4）包括单个粘合头（5）。拾取头（7）和支撑台（8）安装在托架（6）上。托架在第一位置和第二位置之间往复运动。第一照相机（10）拍摄布置在晶片台（1）上的半导体芯片（12）。第二相机（11）拍摄布置在支撑台上的半导体芯片。控制单元（9）调整拾取和放置系统以使半导体芯片对准衬底（2）。

7. 发明公开

KR1020130006324A 반도체 칩을 실장하기 위한 방법 및 장치 无效
标题翻译：用于安装半导体芯片的方法和装置
公开(公告)号：KR1020130006324A
公开(公告)日：2013-01-16
申请号：KR1020120072786
申请日：2012-07-04
申请人： 에섹 아게
发明人： 그라프,마르코 , 하르트만,도미니크 , 스튀르너,위르겐
IPC分类号： H01L21/58
CPC分类号： H01L24/75 , H01L24/32 , H01L24/83 , H01L2224/32225 , H01L2224/7565 , H01L2224/7598 , H01L2224/83192 , H05K13/0469 , Y10T156/1089 , Y10T156/17 , H01L2924/00
摘要： PURPOSE: A semiconductor chip mounting method and a semiconductor chip mounting apparatus are provided to reduce time of arranging a semiconductor chip and coating adhesive by closely arranging a distribution station and a boding station. CONSTITUTION: A distribution station(1) distributes adhesive to a substrate location. A bonding station(3) arranges a semiconductor chip in the substrate location with the adhesive. A buffer station(2) is located between the distribution station and the bonding station. The buffer station includes a first guide rail(8) and a second guide rail(9). A transport device transports the substrate along a transport path and includes a guide rail(5) and at least two clamps(6).
摘要翻译：目的：提供一种半导体芯片安装方法和半导体芯片安装装置，以通过紧密配置分配站和封装站来减少布置半导体芯片和涂布粘合剂的时间。配方：分配站（1）将粘合剂分配到基材位置。接合台（3）用粘合剂将半导体芯片布置在基板位置。缓冲站（2）位于分配站和粘结站之间。缓冲站包括第一导轨（8）和第二导轨（9）。输送装置沿着输送路径输送基板，并且包括导轨（5）和至少两个夹具（6）。

8. 发明公开

KR1020090060301A 반도체 칩의 범프를 납땜 플럭스로 웨팅하는 방법 및 장치 无效
标题翻译：用焊锡焊丝浸渍半导体芯片的方法和装置
公开(公告)号：KR1020090060301A
公开(公告)日：2009-06-11
申请号：KR1020097005719
申请日：2007-09-11
申请人： 에섹 아게
发明人： 그뤼터,뤼디 , 베르네,도미니크 , 바우만,다미안
IPC分类号： H01L21/60 , B23K1/20 , B23K3/08
CPC分类号： B23K1/203 , B23K2201/40 , H01L21/6715 , H01L2224/11822 , H01L2924/01068
摘要： The invention relates to a method and a device for wetting the bumps of a semiconductor chip with a soldering flux, in which a container (4) that receives the soldering flux and is open towards the bottom and a baseplate (2) containing at least one cavity (3) are moved relative to one another to and fro from one side of the cavity (3) to the other side of the cavity (3). The front wall (5 or 6) of the container (4) as seen in the direction of movement is raised during the relative movement, such that it is situated at a distance above the baseplate (2). The distance is somewhat greater than the height difference by which the soldering flux projects above the level of the surface of the baseplate (2). This measure has the effect that the front wall (5 or 6) of the container (4) does not convey any soldering flux from the cavity (3) onto the baseplate (2), which has previously meant the loss of said soldering flux.
摘要翻译：本发明涉及一种用助焊剂润湿半导体芯片的凸起的方法和装置，其中容纳焊剂并且向底部开口的容器（4）和底板（2），底板（2）至少包含一个空腔（3）相对于空腔（3）的一侧相对于彼此相对于空腔（3）的另一侧彼此移动。在相对运动期间，在运动方向上看到的容器（4）的前壁（5或6）升高，使得其位于基板（2）上方的距离处。该距离稍大于焊接焊剂突出到基板（2）的表面的高度之上的高度差。该措施具有这样的效果：容器（4）的前壁（5或6）不将任何焊剂从空腔（3）传送到基板（2）上，这已经意味着所述焊剂的损失。

9. 发明授权

KR100896828B1 와이어 본더를 보정하는 방법 失效
标题翻译：用于校准线束的方法
公开(公告)号：KR100896828B1
公开(公告)日：2009-05-12
申请号：KR1020020029330
申请日：2002-05-27
申请人： 에섹 아게
发明人： 마이어,미카엘 , 슈비처,위르그
IPC分类号： H01L21/60 , B23K20/10
CPC分类号： H01L24/78 , B23K20/004 , B23K20/10 , H01L24/45 , H01L2224/45124 , H01L2224/78301 , H01L2224/789 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/10253 , H01L2924/00 , H01L2224/48
摘要： 와이어 본더는 혼에 클램핑된 모세관(10)을 구비한다. 초음파 변환기는 혼에 초음파를 인가하고, 여기서 초음파 변환기는 파라미터 P에 의해 제어된다. 파라미터 P의 보정을 위해, 반도체 칩에 집적된 압전 저항 센서(1)가 사용된다. 모세관(10)은 반도체 칩 상으로 하강되고, 결합력이 모세관에 인가된다. 그 후, 파라미터 P의 P
1 값은 초음파 변환기에 인가되고, 센서(1)의 출력 신호는 과도 전류 반응이 종결되자마자 기준값 U
Ref 로서 저장된다. 결합력은 모세관(10)이 전후로 활주되지 않게 하기에 충분하도록 크게 선택된다.
와이어 본더는, 예를 들면 모세관이 교체된 후, 초음파 변환기가 P
2 = ×P
1 값을 가지고 작동될 때 센서 신호의 진폭이 U
Ref 값을 갖도록 보정 인자 가 유사하게 결정됨으로써 재보정된다.

10. 发明公开

KR1020030035792A 와이어 본더를 보정하는 방법 失效
标题翻译：校准线焊接方法
公开(公告)号：KR1020030035792A
公开(公告)日：2003-05-09
申请号：KR1020020029330
申请日：2002-05-27
申请人： 에섹 아게
发明人： 마이어,미카엘 , 슈비처,위르그
IPC分类号： H01L21/60 , B23K20/10
CPC分类号： H01L24/78 , B23K20/004 , B23K20/10 , H01L24/45 , H01L2224/45124 , H01L2224/78301 , H01L2224/789 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/10253 , H01L2924/00 , H01L2224/48
摘要： PURPOSE: A method for calibrating a wire bonder is provided to more effectively calibrate the wire bonder by wire-bonding a semiconductor chip by a mass production method under the same process condition before and after a capillary is replaced. CONSTITUTION: A wire bonder has a capillary clamped to a horn. An ultrasonic transducer applies ultrasonic to the horn whereby the ultrasonic transducer is controlled by a parameter P. A piezoresistive sensor integrated into a semiconductor chip is used. The capillary is lowered onto the semiconductor chip and a bond force is applied to it. A value P1 of the parameter P is applied to the ultrasonic transducer and the output signal of the sensor is stored as the reference value URef as soon as the transient reaction is concluded. The bond force is selected great enough so that the capillary does not slide back and forth. The wire bonder, for example after changing the capillary, is then recalibrated in that a correction factor gamma is analogously determined so that the amplitude of the sensor signal assumes the value URef when the ultrasonic transducer is operated with the value P2=gamma*P1.
摘要翻译：目的：提供一种用于校准引线接合器的方法，以通过在毛细管更换之前和之后的相同工艺条件下通过大规模生产方法将半导体芯片引线接合来更有效地校准引线接合器。构成：引线接合器具有夹在喇叭上的毛细管。超声波换能器将超声波施加到喇叭，由此通过参数P控制超声换能器。使用集成到半导体芯片中的压阻式传感器。毛细管被降低到半导体芯片上，并且向其施加结合力。参数P的值P1被施加到超声波换能器，并且一旦瞬态反应结束，传感器的输出信号被存储为参考值URef。接合力选择得足够大，毛细管不会前后滑动。然后，例如在更换毛细管之后，引线接合器被重新校准，其中类似地确定校正因子γ，使得当超声波换能器以值P2 =γ* P1操作时，传感器信号的幅度呈现值URef。

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