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2. 发明公开

KR1020000048926A 모듈라 반도체 신뢰도 시험 시스템 有权
标题翻译：模块化半导体可靠性测试系统
公开(公告)号：KR1020000048926A
公开(公告)日：2000-07-25
申请号：KR1019997002960
申请日：1997-10-06
申请人： 애트리움,인코포레이티드
发明人： 털라파티베뉴 , 해리브렌트 , 맥멀렌티모시 , 벤자민리차드
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： G01R31/2817
摘要： PURPOSE: A modular semiconductor reliability test system is provided to prevent a life from being short due to a thermal stress by using a material having a low thermal conductivity and to improve confidence in testing a board by making each slot having a same distance from a heat source. CONSTITUTION: A system including an oven having open axial ends for slideably receiving a board. The board includes an oven region which is removably received in the oven and which is located intermediate connection and exterior regions located axially outside of the oven. A temperature sensor is positioned in the oven region and its calibration device is located in the exterior region. Contacts on the axial free edge of the connection region are slideably received in an electrical connector. The board is formed of low heat transfer material so that the connection and exterior regions and the electrical connector is not heated by the oven and includes a handle on the axial free edge of the exterior region. The heat transfer element of the oven has a large thermal mass and is in close and uniform proximity to the DUTs received on the board.
摘要翻译：目的：提供模块化半导体可靠性测试系统，以通过使用具有低热导率的材料来防止由于热应力而引起的寿命短，并且通过使每个槽具有与热相同的距离来提高板测试的置信度资源。构成：包括具有敞开轴向端的烤箱的系统，用于可滑动地接收板。该板包括可烤箱区域，其可移除地容纳在烤箱中，并且位于中间连接处和位于炉外部的外部区域。温度传感器位于烤箱区域中，其校准装置位于外部区域。连接区域的轴向自由边缘上的触点可滑动地容纳在电连接器中。板由低传热材料形成，使得连接和外部区域和电连接器不被烘箱加热，并且在外部区域的轴向自由边缘上包括手柄。烘箱的传热元件具有大的热质量，并且与板上接收的DUT紧密且均匀地接近。

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