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    • 2. 发明授权
    • 절단방법
    • 切割方法
    • KR101362864B1
    • 2014-02-14
    • KR1020097005660
    • 2007-08-22
    • 신에쯔 한도타이 가부시키가이샤
    • 오이시히로시나카마타다이스케
    • H01L21/304H01L21/302
    • B28D5/045B28D5/0064B28D5/007
    • 본 발명은 와이어를 복수의 홈부착 롤러에 감고 이 홈부착 롤러에 절단용 슬러리를 공급하면서, 상기 와이어를 주행시키면서 잉곳에 눌러 웨이퍼 형상으로 절단하는 방법으로서, 상기 절단용 슬러리의 공급온도를 제어하여 적어도 상기 잉곳의 절단 종료 시에 상기 절단용 슬러리의 공급온도 및 잉곳 온도를 30℃ 이상이 되도록 하여 절단하는 절단방법을 제공한다. 이에 의해, 와이어쏘를 이용하여 잉곳을 절단할 때 잉곳의 절단 종료시 부근에서의 잉곳의 급격한 냉각이 경감하고, 그 결과 나노토포그래피의 발생을 억제할 수 있는 절단방법이 제공된다.
      와이어, 쏘, 롤러, 슬러리, 공급온도, 잉곳온도,
    • 一种通过在多个带槽滚筒周围缠绕金属丝而将金属丝切割成晶片形状的方法,并且在运行金属锭的同时驱动金属丝的同时将该浆液供应到带槽滚筒, 并且,在切割晶锭时,切割浆料使得切割用浆料的进料温度和晶锭温度为30℃以上。 其结果是,通过使用线锯来切割锭减轻晶棒的急冷中的晶棒的切断的端部附近,并且作为结果,提供了一种切削方法,其可以抑制纳米形貌的发生。
    • 3. 发明公开
    • 절단방법
    • 切割方法
    • KR1020090074739A
    • 2009-07-07
    • KR1020097005760
    • 2007-08-08
    • 신에쯔 한도타이 가부시키가이샤
    • 오이시히로시나카마타다이스케
    • B24B57/02B24B27/06B28D5/04B82Y99/00
    • B28D5/0076
    • A method for cutting an ingot into wafers by winding a wire around a plurality of grooved rollers and pressing the traveling wire against the ingot while supplying cutting slurry to the grooved rollers. Only during a period after the cutting depth of the ingot has reached at least 2/3 of the diameter before the cutting is ended, slurry for adjusting ingot temperature is supplied to the ingot independently from the cutting slurry while controlling the supply temperature and the ingot is cut while controlling the cooling rate at a cutting depth of 2/3 of the diameter or more. When the ingot is cut by using a wire saw, sudden cooling of the ingot is lessened in the vicinity of the end of cutting of the ingot, and as a result, a method for cutting a high quality wafer having a uniform thickness with suppressed occurrence of nano-topography is provided.
    • 通过将线缠绕在多个开槽辊上并将行进线压在锭上同时向槽形滚筒供应切割浆料而将锭切割成晶片的方法。 只有在切割深度达到切割结束的直径的至少2/3之后的期间内,用于调节锭温度的浆料独立于切割浆料供应到锭,同时控制供应温度和锭 在切割深度为2/3以上的切割深度的同时切割冷却速度。 当通过使用线锯切割锭时,在锭的切割结束附近,铸块的突然冷却减少,结果,可以抑制发生具有均匀厚度的高品质晶片的切割方法 提供了纳米形貌。
    • 5. 发明公开
    • 절단방법 및 에피택셜 웨이퍼의 제조방법
    • 切割方法和外延波形制造方法
    • KR1020090057029A
    • 2009-06-03
    • KR1020097005661
    • 2007-08-22
    • 신에쯔 한도타이 가부시키가이샤
    • 오이시히로시나카마타다이스케
    • H01L21/301B24B27/06B28D5/04
    • B28D5/0064B24B27/0633B28D5/007B28D5/045Y10T83/0443Y10T83/9292Y10T117/10Y10T117/1004
    • In a cutting method, a wire is wound and hooked on a roller having a plurality of grooves, the wire is permitted to run to press an ingot while the roller is being supplied with a cutting slurry, and the ingot is cut into wafers. A test of cutting the ingot by supplying the roller with the cutting slurry at a controlled feeding temperature is previously performed, and relation between the axial displacement of the roller and the feeding temperature of the cutting slurry is examined. Based on the relation between the axial displacement of the roller and the feeding temperature of the cutting slurry, a feeding temperature profile of the cutting slurry is set, and based on the feeding temperature profile, the cutting slurry is fed. Thus, the ingot is cut by controlling the axial displacement of the roller, and warping of all the cut wafers is permitted to be in one direction. Thus, at the time of cutting the ingot by using a wire saw, the ingot can be cut easily with excellent repeatability by having warping of all the wafers in one direction.
    • 在切割方法中,将线缠绕并钩在具有多个凹槽的滚子上,当滚筒被供给切割浆料时,允许线材运行以压制锭,并将锭切成晶片。 预先进行通过在受控进料温度下向辊子供给切割浆料来切割锭的试验,并且检查辊的轴向位移和切割浆料的进料温度之间的关系。 基于辊的轴向位移与切割浆料的进料温度之间的关系,设定切割浆料的进料温度曲线,并且基于进料温度曲线,进料切割浆料。 因此,通过控制辊的轴向位移来切割锭,并且允许所有切割的晶片的翘曲在一个方向上。 因此,在通过使用线锯切割锭时,通过使所有晶片在一个方向上翘曲,可以容易地切割锭,并具有优异的重复性。
    • 6. 发明公开
    • 절단방법
    • 切割方法
    • KR1020090055003A
    • 2009-06-01
    • KR1020097005660
    • 2007-08-22
    • 신에쯔 한도타이 가부시키가이샤
    • 오이시히로시나카마타다이스케
    • H01L21/304H01L21/302
    • B28D5/045B28D5/0064B28D5/007
    • In a cutting method, a wire is wound and hooked on a roller having a plurality of grooves, the wire is permitted to run to press an ingot while the roller is being supplied with a cutting slurry, and the ingot is cut into wafers. In the cutting method, the feed temperature of the cutting slurry is controlled, and cutting is performed by having at least the feeding temperature of the cutting slurry and the temperature of the ingot at 30°C or higher when cutting of the ingot is completed. Thus, when a wire saw is used for cutting the ingot, rapid cooling of the ingot around the completion of ingot cutting is suppressed, and as a result, generation of nano-topography can be suppressed.
    • 在切割方法中,将线缠绕并钩在具有多个凹槽的滚子上,当滚筒被供给切割浆料时,允许线材运行以压制锭,并将锭切成晶片。 在切割方法中,控制切割浆料的进料温度,并且在切割锭完成时,至少切割浆料的进料温度和锭的温度为30℃以上,进行切割。 因此,当使用线锯来切割锭时,可以抑制在锭切割完成时锭子的快速冷却,从而能够抑制纳米形貌的产生。