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1. 发明公开

KR1020070080828A 반도체 장치 失效
标题翻译：半导体器件
公开(公告)号：KR1020070080828A
公开(公告)日：2007-08-13
申请号：KR1020070011236
申请日：2007-02-02
申请人： 소니 가부시키가이샤
发明人： 스케가와슌이치 , 시게나미켄이치 , 쿠도마모루
IPC分类号： H01L23/12
CPC分类号： H01L24/73 , H01L23/3128 , H01L23/48 , H01L23/538 , H01L23/5385 , H01L25/0652 , H01L25/0657 , H01L2224/16225 , H01L2225/06517 , H01L2225/06527 , H01L2225/06572 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/15311 , H01L2924/157 , H01L2924/19107
摘要： A semiconductor device is provided to perform a communication between communication chips by disposing two silicon interposers in a manner that the back surfaces of the two silicon interposers confront each other and by using an electrostatic induction of flat plates. A first plate-shaped member(101) is made of a material with high resistance wherein a circuit is formed on one surface of the first plate-shaped member. A second plate-shaped member(201) is made of a material with high resistance wherein a circuit is formed on one surface of the second plate-shaped member. A plurality of first flat plates(121-1) are disposed as a communication antenna on the surface of the first plate-shaped member on which the circuit is formed. A first communication part communicates through the first flat plate, disposed on the surface of the first plate-shaped member on which the circuit is formed. A plurality of second flat plates(221-1) are disposed as a communication antenna on the surface of the second plate-shaped member on which the circuit is formed. A second communication part communicates through the second flat plate, disposed on the surface of the second plate-shaped member on which the circuit is formed. The first and second plate-shaped members are disposed in a manner that the surfaces(103,203) of the first and second plate-shaped members on which the circuits are not formed confront each other. The first plate-shaped member has a bonding wire which receives power. The second plate-shaped member has a bump which receives power.
摘要翻译：提供一种半导体器件，以通过以两个硅插入件的背面彼此面对并通过使用平板的静电感应的方式设置两个硅插入件来执行通信芯片之间的通信。第一板状构件（101）由具有高电阻的材料制成，其中电路形成在第一板状构件的一个表面上。第二板状构件（201）由具有高电阻的材料制成，其中电路形成在第二板状构件的一个表面上。多个第一平板（121-1）作为通信天线设置在形成有电路的第一板状构件的表面上。第一通信部分通过第一平板连接，设置在形成电路的第一板状部件的表面上。多个第二平板（221-1）作为通信天线设置在形成有电路的第二板状构件的表面上。第二连通部分通过第二平板连接，设置在形成电路的第二板状部件的表面上。第一和第二板状构件以不形成电路的第一和第二板状构件的表面（103,203）彼此面对的方式设置。第一板状构件具有接合电力的接合线。第二板状构件具有接收动力的凸块。

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