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    • 4. 发明公开
    • 기판 세정 방법
    • 清洗基板的方法
    • KR1020120134348A
    • 2012-12-12
    • KR1020110053199
    • 2011-06-02
    • 세메스 주식회사
    • 이강석최종수
    • H01L21/02H01L21/67C11D3/12
    • H01L21/02052C11D3/1213C11D3/122H01L21/02057H01L21/6704
    • PURPOSE: A substrate cleaning method is provided to clean a substrate by spraying a medicinal fluid or deionized water on the substrate. CONSTITUTION: A mixture including sulfuric acid and hydrogen peroxide is supplied to a substrate. The substrate is medicinally processed by the mixture(S10). The substrate is medicinally processed by supplying diluted ammonia water to the substrate(S20). The substrate is rinsed after the medicinal process(S30). The substrate is dried after rinse(S40). [Reference numerals] (S10) SPM processing on a substrate; (S20) Diluted ammonia water processing on the substrate; (S30) Rinsing the substrate; (S40) Drying the substrate
    • 目的:提供基材清洗方法,通过在基材上喷涂药液或去离子水来清洗基材。 构成:将含有硫酸和过氧化氢的混合物供给至基材。 基板由混合物进行药物处理(S10)。 通过向基板供给稀释的氨水,对基板进行医疗处理(S20)。 药物处理后冲洗底物(S30)。 冲洗后将基材干燥(S40)。 (附图标记)(S10)在基板上的SPM处理; (S20)在基板上稀释氨水处理; (S30)冲洗基材; (S40)干燥基板
    • 5. 发明公开
    • 기판 세정 장치 및 그 장치에서의 기판 세정 방법
    • 用于清洁基板的装置和用于在装置中清洁基板的方法
    • KR1020110131707A
    • 2011-12-07
    • KR1020100051283
    • 2010-05-31
    • 세메스 주식회사
    • 이복규최종수
    • H01L21/302
    • H01L21/67034
    • PURPOSE: A substrate cleaning apparatus and a substrate cleaning method thereof are provided to completely eliminate a drying fluid used in a drying process from the surface of a substrate, thereby suppressing water stain generation. CONSTITUTION: A substrate is cleaned with a cleaning fluid(S100). The substrate is rinsed with a rinse fluid(S110). The substrate is dried with a first drying fluid for the first time(S120). The substrate is dried with a second drying fluid for the second time(S130). The substrate is finally dried with a nitrogen gas(S140). A support member supports and rotates the substrate.
    • 目的:提供一种基板清洗装置及其基板清洗方法,从基板表面完全消除干燥工序中使用的干燥流体,抑制产生水渍。 构成:用清洁液清洗基材(S100)。 用冲洗液冲洗底物(S110)。 首先用第一干燥流体干燥基板(S120)。 用第二干燥液第二次干燥基板(S130)。 最后用氮气干燥底物(S140)。 支撑构件支撑并旋转衬底。
    • 7. 发明公开
    • 스핀 코터 장치 및 스핀 코터 장치를 이용하여 감광액을 도포하는 방법
    • 旋转涂布机装置和使用其的涂料照相机的方法
    • KR1020100102951A
    • 2010-09-27
    • KR1020090021282
    • 2009-03-12
    • 세메스 주식회사
    • 정영헌조수현최종수
    • G03F7/16H01L21/027
    • G03F7/162G03F7/168H01L21/67017H01L21/6715
    • PURPOSE: A spin coater apparatus and a method for coating a photoresist using the same are provided to prevent bubbles from being generated on a wafer when a highly viscous photoresist is coated and to evenly coat the highly viscous photoresist. CONSTITUTION: A method for coating a photoresist using a spin coater which coats the photoresist while rotating a wafer comprises the following steps: performing a first coating process of coating a wafer(110) with the photoresist using a nozzle(130) for spraying the photoresist from the edge of the wafer to the center of the wafer; firstly baking the firstly coated photoresist; secondarily coating the photoresist on the wafer by moving the nozzle; and secondarily baking the secondarily coated photoresist.
    • 目的:提供旋涂机装置和使用其的涂覆光致抗蚀剂的方法,以防止在涂覆高粘度光致抗蚀剂时在晶片上产生气泡并均匀地涂覆高粘度光致抗蚀剂。 构成:使用旋转涂布机在旋转晶片时涂覆光致抗蚀剂的方法,包括以下步骤:使用用于喷涂光致抗蚀剂的喷嘴(130)执行用光致抗蚀剂涂覆晶片(110)的第一涂覆工艺, 从晶片的边缘到晶片的中心; 首先烘烤第一次涂覆的光致抗蚀剂; 通过移动喷嘴二次在晶片上涂覆光致抗蚀剂; 并二次烘烤二次涂覆的光致抗蚀剂。