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1. 发明公开

KR1020110035257A 발광소자 有权
标题翻译：发光装置
公开(公告)号：KR1020110035257A
公开(公告)日：2011-04-06
申请号：KR1020090092889
申请日：2009-09-30
申请人： 서울반도체 주식회사
发明人： 권유진 , 정정화 , 김도형
IPC分类号： H01L33/50
CPC分类号： H01L2224/48227
摘要： PURPOSE: A light emitting device is provided to adjust power applied to a blue light emitting chip and a red light emitting chip which are individually driven, thereby changing a color. CONSTITUTION: At least one blue light emitting chip(120b) generates blue light. At least one red light emitting chip(120r) generates red light. A power supply terminal unit(130) supplies external power to the blue light emitting chip and the red light emitting chip. A housing(110) supports the blue light emitting chip, the red light emitting chip, and the power supply terminal unit. A wavelength conversion particle(150) converts light generated in the blue light emitting chip into light of another wavelength.
摘要翻译：目的：提供一种发光装置，用于调节单独驱动的蓝色发光芯片和红色发光芯片的功率，从而改变颜色。构成：至少一个蓝色发光芯片（120b）产生蓝色光。至少一个红色发光芯片（120r）产生红色光。电源端子单元（130）向蓝色发光芯片和红色发光芯片提供外部电力。壳体（110）支撑蓝色发光芯片，红色发光芯片和电源端子单元。波长转换粒子（150）将在蓝色发光芯片中产生的光转换为另一波长的光。

2. 发明公开

KR1020110001213A 발광장치 有权
标题翻译：发光装置
公开(公告)号：KR1020110001213A
公开(公告)日：2011-01-06
申请号：KR1020090058632
申请日：2009-06-29
申请人： 서울반도체 주식회사
发明人： 강현구 , 홍승식 , 김원일 , 권유진 , 류승렬 , 배상근
IPC分类号： F21V17/00 , F21V19/00
摘要： PURPOSE: A light emitting device is provided to reduce replacement costs and time by separating only the selected unit lighting module from a main printed circuit board. CONSTITUTION: A socket is arranged on the upper side of a main printed circuit board to apply driving power. A connector which receives the driving power from a light emitting control module(300) is arranged on one side of the main circuit board. A unit lighting module(200) generates light by receiving the driving power from the socket. The unit lighting module is arranged on the upper side of the main printed circuit board in a first direction. An external case(400) receives the unit lighting module and the main printed circuit board.
摘要翻译：目的：提供一种发光装置，通过从主印刷电路板分离所选择的单元照明模块来降低更换成本和时间。规定：主印刷电路板的上侧布置有插座以施加驱动力。从主电路板的一侧配置从发光控制模块（300）接收驱动电力的连接器。单元照明模块（200）通过从插座接收驱动电力来产生光。单元照明模块沿着第一方向布置在主印刷电路板的上侧。外壳（400）接收单元照明模块和主印刷电路板。

3. 发明授权

KR100765239B1 단결정 실리콘 재질의 발광 다이오드 패키지 有权
标题翻译：使用单晶的发光二极管封装
公开(公告)号：KR100765239B1
公开(公告)日：2007-10-09
申请号：KR1020060096756
申请日：2006-09-30
申请人： 서울반도체 주식회사
发明人： 서정후 , 표병기 , 권유진
IPC分类号： H01L33/60 , H01L33/48
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An LED(Light Emitting Diode) package is provided to reduce the size of the package itself and to improve effectively heat radiation characteristics by using a single crystal silicon structure as a housing. An LED package includes a first electrode, a second electrode, a housing and an LED chip. The first electrode(20) is made of a first conductive material. The first electrode has a first predetermined thickness. The first electrode is supplied with a power source through a first lower surface. The second electrode(30) is spaced apart from the first electrode. The second electrode has a second predetermined thickness. The second electrode is made of a second conductive material. The second electrode is supplied with the power source through a second lower surface. The housing(10) is used for isolating electrically the first and second electrodes from each other. The housing is made of a single crystal silicon material. The LED chip(40) is mounted on the second electrode. The LED chip is connected with the first electrode using wire bonding. The housing is composed of a first electrode installing portion, a second electrode installing portion and a reflective surface for reflecting the light emitted from the LED chip.
摘要翻译：提供LED（发光二极管）封装以减小封装本身的尺寸并通过使用单晶硅结构作为外壳来有效地提高散热特性。 LED封装包括第一电极，第二电极，壳体和LED芯片。第一电极（20）由第一导电材料制成。第一电极具有第一预定厚度。第一电极通过第一下表面供给电源。第二电极（30）与第一电极间隔开。第二电极具有第二预定厚度。第二电极由第二导电材料制成。第二电极通过第二下表面供电。壳体（10）用于将第一和第二电极彼此电隔离。外壳由单晶硅材料制成。 LED芯片（40）安装在第二电极上。 LED芯片使用引线接合与第一电极连接。壳体由第一电极安装部分，第二电极安装部分和用于反射从LED芯片发射的光的反射表面组成。

4. 发明公开

KR1020070098180A 측면 발광 다이오드 패키지 有权
标题翻译：侧视发光二极管封装
公开(公告)号：KR1020070098180A
公开(公告)日：2007-10-05
申请号：KR1020060029500
申请日：2006-03-31
申请人： 서울반도체 주식회사
发明人： 표병기 , 류승렬 , 서정후 , 강석진 , 권유진
IPC分类号： H01L33/62 , H01L33/64
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A side-view light emitting diode package is provided to improve reliability through heat discharging by forming a slug by thickening a part with an LED chip than other part. A side-view light emitting diode package includes a package main body(10), a first lead frame(20), a second lead frame(30), and an LED chip(40). The first lead frame(20) is installed on the package main body(10), and comprises a lead part(22) for supplying the power in a side and a slug(21) for thermal radiation to be thicker than the lead part in the other side. The second lead frame(30) is installed on the package main body(10) having an interval for the first lead frame(20) so that the first lead frame(20) and the second lead frame(30) are separated electrically. The LED chip(40) is mounted on the slug of the first lead frame(20).
摘要翻译：提供了一种侧视发光二极管封装，以通过用其他部分用LED芯片增厚部件来形成块而提高散热的可靠性。侧视发光二极管封装包括封装主体（10），第一引线框架（20），第二引线框架（30）和LED芯片（40）。第一引线框架（20）安装在封装主体（10）上，并且包括用于向侧面提供电力的引线部分（22）和用于热辐射的芯块（21）比引线部分更厚另一边。第二引线框架（30）安装在具有第一引线框架（20）的间隔的封装主体（10）上，使得第一引线框架（20）和第二引线框架（30）电气分离。 LED芯片（40）安装在第一引线框架（20）的芯块上。

5. 发明授权

KR101650920B1 발광장치 有权
标题翻译：发光装置
公开(公告)号：KR101650920B1
公开(公告)日：2016-08-24
申请号：KR1020090058619
申请日：2009-06-29
申请人： 서울반도체 주식회사
发明人： 권유진 , 홍승식 , 김원일 , 강현구 , 류승렬 , 배상근
IPC分类号： H01L33/48
摘要： 조립성을향상시킨발광장치가개시되어있다. 발광장치는바닥지지부재, 발광유닛및 고정부재를포함한다. 발광유닛은인쇄회로기판및 복수의발광소자들을포함한다. 인쇄회로기판은바닥지지부재의상면에배치된다. 발광소자들은인쇄회로기판의상면에소정간격으로이격되어실장된다. 고정부재는인쇄회로기판의단부를감싸도록형성되어탄성을가지고인쇄회로기판을바닥지지부재에고정시키는적어도하나의고정유닛을구비한다. 따라서, 발광장치에서발광유닛은고정부재를이용하여바닥지지부재에용이하게고정되거나분리될수 있다.
摘要翻译：公开了具有改进的组装性的发光器件。发光装置包括底部支撑构件，发光单元和固定构件。发光单元包括印刷电路板和多个发光元件。印刷电路板布置在底部支撑构件的顶表面上。发光元件以预定距离安装在印刷电路板的上表面上。固定构件具有至少一个固定单元，该固定单元被形成为围绕印刷电路板的端部并且具有弹性以将印刷电路板固定到底部支撑构件。因此，在发光装置中，通过使用固定构件，发光单元能够容易地固定到底部支撑构件或从底部支撑构件分离。

6. 发明授权

KR101625553B1 발광장치 有权
公开(公告)号：KR101625553B1
公开(公告)日：2016-05-30
申请号：KR1020090058650
申请日：2009-06-29
申请人： 서울반도체 주식회사
发明人： 김원일 , 강현구 , 권유진 , 류승렬 , 배상근 , 홍승식
IPC分类号： H01L33/62
摘要： 생산성이향상된발광장치가개시된다. 발광장치는리드단자, 벌브타입의하우징및 적어도하나의발광소자를포함한다. 리드단자는일 방향으로연장되고, 하우징은리드단자의하단부가돌출되도록리드단자를몰딩하여감싸고, 리드단자의상단부를노출시키는수납홈을갖는다. 발광소자는수납홈내에배치되어리드단자의상단부와전기적으로연결된다. 따라서, 하우징이리드단자의하단부가돌출되도록몰딩하여감싸고, 수납홈를통해노출된리드단자의상단부에발광소자를실장하여발광장치를제조함으로써, 발광장치를제조하는공정이간소화되고, 소요되는비용및 시간이절감되어결과적으로작업생산성이향상될수 있다.

7. 发明授权

KR101136581B1 조명장치 有权
公开(公告)号：KR101136581B1
公开(公告)日：2012-04-18
申请号：KR1020090079327
申请日：2009-08-26
申请人： 서울반도체 주식회사
发明人： 김원일 , 권유진 , 강현구 , 박광일
IPC分类号： H01L33/60
摘要： PURPOSE: A light emitting apparatus is provided to improve the radiation efficiency of the light emitting apparatus by radiating the heat generated from the LED chip to the heat sink and the case. CONSTITUTION: A light emitting unit comprises a printed circuit board and an LED chip which generates the light. A reflector(200) is arranged to surround the printed circuit board along the edge of the printed circuit board. A heat sink(300) is arranged on the lower part of the printed circuit board. The heat sink comprises a body(310) and a plurality of heat radiation fins(320).
摘要翻译：目的：提供一种发光装置，用于通过将LED芯片产生的热量散发到散热器和壳体来提高发光装置的辐射效率。构成：发光单元包括印刷电路板和产生光的LED芯片。反射器（200）被布置为沿印刷电路板的边缘围绕印刷电路板。散热器（300）布置在印刷电路板的下部。散热器包括主体（310）和多个散热翅片（320）。

8. 发明公开

KR1020110080474A 방열기판을 갖는 ＬＥＤ 패키지 有权
标题翻译： LED包装与热辐射基板
公开(公告)号：KR1020110080474A
公开(公告)日：2011-07-13
申请号：KR1020100000724
申请日：2010-01-06
申请人： 서울반도체 주식회사
发明人： 권유진 , 정정화 , 김도형
IPC分类号： H01L33/64 , H01L23/34
CPC分类号： H01L2224/48227 , H01L33/64 , H01L23/34 , H01L33/00 , H01L2224/48091 , H01L2924/00014
摘要： PURPOSE: An LED package having a heat radiation substrate suitable for effectively discharging the heat of an LED chip are provided to prevent conductive patterns from being damaged by restricting regions of upper conductive patterns and lower conductive patterns. CONSTITUTION: An upper insulating substrate has a plurality of upper conductive patterns on an upper side. A lower insulating substrate has a plurality of lower conductive patterns on a lower side. A plurality of intermediate conductive patterns are positioned between the upper insulating substrate and the lower insulating substrate. Upper vias(16a,16b) are formed in the upper insulating substrate in order to interlink the upper conductive patterns to the intermediate conductive patterns. Lower vias(17a,17b) are formed in the lower insulating substrate in order to interlink the intermediate conductive patterns to the lower conductive patterns.
摘要翻译：目的：提供一种具有适合于有效排放LED芯片的热量的散热基板的LED封装件，以防止导电图案受到限制上导电图案区域和较低导电图案的损坏。构成：上绝缘基板在上侧具有多个上导电图案。下绝缘基板在下侧具有多个下导电图案。多个中间导电图案位于上绝缘基板和下绝缘基板之间。上绝缘基板中形成上通孔16a，16b，以便将上导电图案与中间导电图案相互连接。下通孔（17a，17b）形成在下绝缘基板中，以便将中间导电图案互连到下导电图案。

9. 发明公开

KR1020110002898A 발광장치 有权
标题翻译：发光装置
公开(公告)号：KR1020110002898A
公开(公告)日：2011-01-11
申请号：KR1020090058656
申请日：2009-06-29
申请人： 서울반도체 주식회사
发明人： 김원일 , 강현구 , 류승렬 , 홍승식 , 권유진 , 배상근
IPC分类号： H01L33/48
摘要： PURPOSE: A light emitting apparatus is provided to improve the degree of combination between a light emitting unit and a bottom supporting part by forming the bottom supporting part into a round shape. CONSTITUTION: A light emitting unit(100) includes a printed circuit board(110) and at least one light emitting element(120) which is mounted on the upper side of the printed circuit board. A bottom supporting part(200) is arranged at the lower side of the printed circuit board. The upper side of the bottom supporting part is formed into a convex shaped toward the lower side of the printed circuit board. A fixing part fixes the printed circuit board to the bottom supporting part. The fixing part includes a first fixing unit(310) and a second fixing unit(320).
摘要翻译：目的：提供一种发光装置，通过将底部支撑部形成为圆形来提高发光单元和底部支撑部之间的组合度。构成：发光单元（100）包括印刷电路板（110）和安装在印刷电路板的上侧上的至少一个发光元件（120）。底部支撑部分（200）布置在印刷电路板的下侧。底部支撑部分的上侧形成为朝向印刷电路板的下侧的凸形。固定部分将印刷电路板固定到底部支撑部分。固定部包括第一固定单元（310）和第二固定单元（320）。

10. 发明公开

KR1020110002897A 발광장치 无效
标题翻译：发光装置
公开(公告)号：KR1020110002897A
公开(公告)日：2011-01-11
申请号：KR1020090058646
申请日：2009-06-29
申请人： 서울반도체 주식회사
发明人： 홍승식 , 류승렬 , 김원일 , 권유진 , 배상근 , 강현구
IPC分类号： G02F1/13357 , H01L33/48
CPC分类号： H01L33/486 , G02F1/133615 , H01L25/0753 , H01L33/60
摘要： PURPOSE: A light emitting device is provided to form exit surface of the light guiding plates, thereby preventing female unit to be formed on both end part of an exit surface and unifying the luminance of light photographed to the light guiding plates. CONSTITUTION: A printed circuit board(112) is expanded to a first direction. A plurality of emitting light device(114) generates light, which is amounted along the first direction on one side of the printed circuit board. A lower surface is faced with photographed surface of each light guiding plate. The surface of a photographed surface includes a plurality of concave parts formed concavely to an inner direction of light guiding plate.
摘要翻译：目的：提供发光装置以形成导光板的出射表面，从而防止阴单元形成在出射表面的两端，并将照射的光的亮度统一到导光板。构成：将印刷电路板（112）扩展到第一方向。多个发光装置（114）产生沿着印刷电路板一侧的第一方向的光。下表面面对每个导光板的拍摄表面。拍摄表面的表面包括在导光板的内侧凹入地形成的多个凹部。

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