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1. 发明公开

KR1020070027189A 덮개를 갖는 반도체 모듈 无效
标题翻译：包含封装的半导体模块
公开(公告)号：KR1020070027189A
公开(公告)日：2007-03-09
申请号：KR1020050082557
申请日：2005-09-06
申请人： 삼성전자주식회사
发明人： 윤상한 , 이배기 , 박병호 , 이형연
IPC分类号： H01L29/40
摘要： A semiconductor module having a cover is provided to reduce damages and cracks at a solder bonding by preventing mechanical stress applied from the outside to semiconductor devices directly. A printed circuit board(120) is a flat type wiring board and is provided with connection terminals(124) along a long side of a lower section where a semiconductor device(130) is mounted. The semiconductor device has a solder ball(132) as an external connection terminal. A cover(150) is a rectangular can type and as an accommodation space for accommodating the semiconductor devices. The cover entirely covers the semiconductor devices connected to an upper surface of the printed circuit board. The cover is attached to the upper surface of the printed circuit board through a non-conductive adhesive.
摘要翻译：提供具有盖的半导体模块，通过防止从外部直接向半导体器件施加的机械应力来减少焊接时的损伤和裂纹。印刷电路板（120）是扁平型布线板，并且沿着安装有半导体器件（130）的下部的长边设置有连接端子（124）。半导体器件具有作为外部连接端子的焊球（132）。盖（150）是矩形罐型，并且作为用于容纳半导体器件的容置空间。盖子完全覆盖连接到印刷电路板的上表面的半导体器件。盖通过非导电粘合剂附着到印刷电路板的上表面。

2. 发明公开

KR1020140078015A 반도체 모듈 검사 시스템 审中-实审
标题翻译：用于测试半导体模块的系统
公开(公告)号：KR1020140078015A
公开(公告)日：2014-06-25
申请号：KR1020120145862
申请日：2012-12-14
申请人： 삼성전자주식회사
发明人： 김민우 , 이배기 , 이영수 , 이형연
IPC分类号： G01R31/26 , H01L21/677
CPC分类号： G01R31/2868 , G01R31/18 , G01R31/26 , G01R31/2601 , G01R31/2806 , G01R31/2893 , H01L21/67271 , H01L22/30
摘要： A semiconductor module inspection system includes: a first inspection unit; a second inspection unit; a sorting unit; and a transfer unit. The first inspection unit checks the functionality of the semiconductor modules mounted on a main board. The second inspection unit inspects the semiconductor modules inspected by the first inspection unit using a terminal. The sorting unit sorts the semiconductor modules inspected by the second inspection unit. The transfer unit connects the first inspection unit and the second inspection unit, and the second inspection unit and the sorting unit on an in-line basis to transfer the semiconductor modules from the first inspection unit to the second inspection unit and to the sorting unit. Accordingly, the semiconductor modules can be automatically transferred to each unit, thereby significantly shortening the inspection time.
摘要翻译：半导体模块检查系统包括：第一检查单元; 第二检查单位; 分拣单元; 和转移单元。第一检查单元检查安装在主板上的半导体模块的功能。第二检查单元使用终端检查由第一检查单元检查的半导体模块。排序单元对由第二检查单元检查的半导体模块进行排序。传送单元将第一检查单元和第二检查单元以及第二检查单元和分类单元串联连接，以将半导体模块从第一检查单元传送到第二检查单元和分类单元。因此，可以将半导体模块自动转移到每个单元，从而显着缩短检查时间。

3. 发明授权

KR102021819B1 반도체 모듈 검사 시스템 有权
公开(公告)号：KR102021819B1
公开(公告)日：2019-09-17
申请号：KR1020120145862
申请日：2012-12-14
申请人： 삼성전자주식회사
发明人： 김민우 , 이배기 , 이영수 , 이형연
IPC分类号： G01R31/26 , H01L21/677

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