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1. 发明公开

KR1020130120122A 이미지 센서 패키지 审中-实审
标题翻译：图像传感器包装
公开(公告)号：KR1020130120122A
公开(公告)日：2013-11-04
申请号：KR1020120043146
申请日：2012-04-25
申请人： 삼성전자주식회사
发明人： 신효영 , 박태상
IPC分类号： H01L27/146
CPC分类号： H01L27/14636 , H01L27/14618 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： An image sensor package is thinned and the reliability of the image sensor package against physical impact is improved by including an image sensor chip which includes a pixel area on the center of an upper surface thereof; a substrate which is arranged on the upper surface of the image sensor chip; is bonded to the image sensor chip with a flip chip; includes a hole at a position facing the pixel area and is made of inorganic materials; and a solder ball which electrically connects the substrate to a printed circuit board.
摘要翻译：图像传感器封装被减薄，并且通过包括在其上表面的中心上包括像素区域的图像传感器芯片来改善图像传感器封装抵抗物理冲击的可靠性; 布置在图像传感器芯片的上表面上的基板; 用倒装芯片与图像传感器芯片接合; 在面向像素区域的位置处包括孔，并且由无机材料制成; 以及将基板电连接到印刷电路板的焊球。

2. 发明公开

KR1020100106749A 회로기판 접속구조 및 이를 이용한 회로기판 접속방법 无效
标题翻译：电路板连接结构及连接方法
公开(公告)号：KR1020100106749A
公开(公告)日：2010-10-04
申请号：KR1020090024884
申请日：2009-03-24
申请人： 삼성전자주식회사
发明人： 김현태 , 박태상 , 문영준 , 홍순민 , 신효영
IPC分类号： H05K1/14 , H01L21/60
CPC分类号： H05K3/363 , H05K3/3457 , H05K3/3494 , H05K2201/09709 , H05K2201/10666 , H05K2203/0195 , H05K2203/167 , Y10T29/49126 , Y10T29/49213
摘要： PURPOSE: A connecting structure for circuit boards and a connecting method using the same are provided to align circuit boards using solder bumps without additional equipments for a connecting process. CONSTITUTION: A first circuit board(10) includes at least one first connecting terminal. A second circuit board(20) includes at least one second connecting terminal(22). The second connecting terminal includes a connecting part(23) which accepts at least part of solder bumps. The second circuit board includes a through part(26) which accepts at least part of the solder bumps. The solder bumps(30) are arranged in the first connecting terminal.
摘要翻译：目的：提供一种用于电路板的连接结构和使用该连接结构的连接方法，以使用焊料凸块对准电路板，而不需要用于连接工艺的附加设备。构成：第一电路板（10）包括至少一个第一连接端子。第二电路板（20）包括至少一个第二连接端子（22）。第二连接端子包括接受至少一部分焊料凸点的连接部分（23）。第二电路板包括容纳至少一部分焊料凸块的贯通部分（26）。焊料凸块（30）布置在第一连接端子中。

3. 发明授权

KR101963809B1 이미지 센서 패키지 有权
公开(公告)号：KR101963809B1
公开(公告)日：2019-03-29
申请号：KR1020120043146
申请日：2012-04-25
申请人： 삼성전자주식회사
发明人： 신효영 , 박태상
IPC分类号： H01L27/146

4. 发明公开

KR1020130125606A 전자제품 외형케이스와 일체화된 회로필름 无效
标题翻译：电路电影集成电子产品案例
公开(公告)号：KR1020130125606A
公开(公告)日：2013-11-19
申请号：KR1020120049257
申请日：2012-05-09
申请人： 삼성전자주식회사
发明人： 한현주 , 박태상 , 신효영 , 강창선 , 오승희 , 문영준 , 홍순민
IPC分类号： H05K3/46 , B32B27/00 , H05K5/03
摘要： A circuit film integrated with an electronic product case according to the present invention comprises an electronic product case, a circuit having a printed upper surface, a power supply unit prepared in a rear surface to supply power to the circuit, and a transparent film having an electric element prepared in the circuit for an electrical function operation and becomes integrated with the electronic product case by injecting resin between the transparent film and the electronic product case. By doing this, the whole thickness of an electronic product is reduced by integrating the transparent film having the circuit therein with the electronic product case to enable the electronic product case to be electrically operated and to realize the whole thickness of an LED emitting function realizing unit only with the thickness of the electronic product case. Also, in order to prevent reduction of the safety of the electric element by the thin thickness, underfill coating or transparent resin premolding are performed, thereby raising the durability of the electric element and simplifying the number of component parts.
摘要翻译：与根据本发明的电子产品外壳集成的电路膜包括电子产品外壳，具有印刷的上表面的电路，在背面准备的用于向电路供电的电源单元，以及具有用于电功能操作的电路中制备的电元件，并通过在透明膜和电子产品外壳之间注入树脂而与电子产品外壳集成。通过这样做，通过将具有电路的透明膜与电子产品外壳集成来减少电子产品的整体厚度，使得电子产品外壳能够电动操作，并实现LED发射功能实现单元的整体厚度只有电子产品外壳的厚度。此外，为了防止薄膜的电气元件的安全性降低，进行底部填充涂层或透明树脂预成型，从而提高电气元件的耐久性并简化部件数量。

5. 发明公开

KR1020130034310A 인쇄회로기판 어셈블리 有权
标题翻译：印刷电路板组装
公开(公告)号：KR1020130034310A
公开(公告)日：2013-04-05
申请号：KR1020110098254
申请日：2011-09-28
申请人： 삼성전자주식회사
发明人： 이용원 , 박태상 , 신효영 , 장지영 , 문영준 , 홍순민
IPC分类号： H05K7/10 , H05K1/18 , H05K1/02
CPC分类号： H05K1/147 , H01L2224/16225 , H01L2924/181 , H05K1/148 , H05K1/189 , H05K3/284 , H05K3/323 , H05K3/361 , H05K5/065 , H05K2201/055 , H05K2203/1316 , H01L2924/00012 , H05K7/1015 , H05K1/02 , H05K1/18 , H05K7/1053
摘要： PURPOSE: A printed circuit board assembly is provided to mount an electrical component in a printed circuit board with a wafer level and to directly bond a flexible printed circuit board to the printed circuit board, and to secure a thin printed circuit board assembly. CONSTITUTION: An electronic component(111,112) is mounted on a printed circuit board(100). The printed circuit board includes a wafer printed circuit board. The electronic component includes a semiconductor chip of a wafer level. The one end of a flexible printed circuit board(20) is directly boned to one side of the printed circuit board. A protection material(120) covers the printed circuit board to protect the electronic component.
摘要翻译：目的：提供印刷电路板组件以将电气部件安装在具有晶片级的印刷电路板中，并将柔性印刷电路板直接接合到印刷电路板，并且固定薄的印刷电路板组件。构成：电子元件（111,112）安装在印刷电路板（100）上。印刷电路板包括晶片印刷电路板。电子部件包括晶片级的半导体芯片。柔性印刷电路板（20）的一端被直接粘结到印刷电路板的一侧。保护材料（120）覆盖印刷电路板以保护电子部件。

6. 发明授权

KR101920434B1 인쇄회로기판 및 그 제조방법 有权
公开(公告)号：KR101920434B1
公开(公告)日：2018-11-20
申请号：KR1020120029918
申请日：2012-03-23
申请人： 삼성전자주식회사
发明人： 오승희 , 박태상 , 신효영 , 문영준
IPC分类号： H05K3/46 , H01L23/12 , H05K3/28 , H01L23/495
CPC分类号： H01L2224/16225
摘要： 미세패턴을가진인쇄회로기판을제조함에있어서기존의일반기판을그대로사용하면서최외각에재배선층을추가함으로써회로상의파워와그라운드의배선은기존기판내에서진행을하고반도체칩의신호배선은재배선층을이용함으로써비교적저렴한비용으로미세피치의반도체칩의실장이가능하고, 메모리모듈의소형화가가능한인쇄회로기판및 그제조방법을개시한다.

7. 发明公开

KR1020110086202A 인쇄회로기판용 지그 无效
标题翻译：打印电路板
公开(公告)号：KR1020110086202A
公开(公告)日：2011-07-28
申请号：KR1020100005802
申请日：2010-01-22
申请人： 삼성전자주식회사
发明人： 이용원 , 장지영 , 박태상 , 신효영 , 문영준 , 홍순민
IPC分类号： H05K13/04 , H05K13/02
摘要： PURPOSE: A jig for a printed circuit board is provided to prevent the defect and damage to a printed circuit board which is generated in a printing process and a process of mounting a component by enabling the substrate to be aligned accurately. CONSTITUTION: In a jig for a printed circuit board, a substrate mounting groove(110) is formed on the top side of a palette. At least one sliding guide grooves(120) is formed on one side of a substrate mounting groove. A sliding member(140) makes a PCB closely contact to the other side the substrate mounting groove. An elastic member(150) applies elastic force to the sliding member. The elastic member is received into an elastic member receiving groove which is formed in a sliding guide groove.
摘要翻译：目的：提供一种用于印刷电路板的夹具，以防止在印刷过程中产生的印刷电路板的缺陷和损坏以及通过使基板准确地对准而安装部件的过程。构成：在印刷电路板的夹具中，在调色板的上侧形成有基板安装槽（110）。至少一个滑动导向槽（120）形成在基板安装槽的一侧上。滑动构件（140）使得PCB与衬底安装槽的另一侧紧密接触。弹性构件（150）向滑动构件施加弹性力。弹性构件被容纳在形成在滑动导向槽中的弹性构件容纳槽中。

8. 发明授权

KR101772490B1 인쇄회로기판 어셈블리 有权
公开(公告)号：KR101772490B1
公开(公告)日：2017-08-30
申请号：KR1020110098254
申请日：2011-09-28
申请人： 삼성전자주식회사
发明人： 이용원 , 박태상 , 신효영 , 장지영 , 문영준 , 홍순민
IPC分类号： H05K7/10 , H05K1/18 , H05K1/02
CPC分类号： H05K1/147 , H01L2224/16225 , H01L2924/181 , H05K1/148 , H05K1/189 , H05K3/284 , H05K3/323 , H05K3/361 , H05K5/065 , H05K2201/055 , H05K2203/1316 , H01L2924/00012
摘要： 본발명의일 측면은웨이퍼자체를인쇄회로기판으로사용하여전기부품을웨이퍼레벨로실장할수 있도록한 인쇄회로기판어셈블리를개시한다. 인쇄회로기판어셈블리는복수의전자부품과, 복수의전자부품이실장되는인쇄회로기판과, 인쇄회로기판전체를덮는보호체와, 일단이상기보호체의외부로노출되어인쇄회로기판이보호체외부의서브기판과전기적으로연결될수 있도록구성된연결유닛을포함하고, 인쇄회로기판은웨이퍼로형성되는웨이퍼인쇄회로기판을포함하는것을특징으로한다.

9. 发明公开

KR1020130107819A 인쇄회로기판 및 그 제조방법 审中-实审
标题翻译：印刷电路板及其制造方法
公开(公告)号：KR1020130107819A
公开(公告)日：2013-10-02
申请号：KR1020120029918
申请日：2012-03-23
申请人： 삼성전자주식회사
发明人： 오승희 , 박태상 , 신효영 , 문영준
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H01L2224/16225
摘要： PURPOSE: A printed circuit board and a manufacturing method thereof are provided to facilitate the mounting of a chip by making the signaling wiring of a semiconductor use a redistribution layer. CONSTITUTION: An insulation layer is formed on a substrate. A redistribution layer (20) is formed on the substrate. A diffusion blocking layer is formed on the redistribution layer. A protection insulation layer (30) is formed on the insulation layer and the diffusion blocking layer. A solder bump (40) is formed at the opening of the protection insulation layer.
摘要翻译：目的：提供一种印刷电路板及其制造方法，以通过使半导体的信令布线使用再分布层来促进芯片的安装。构成：在基板上形成绝缘层。在衬底上形成再分布层（20）。在再分布层上形成扩散阻挡层。在绝缘层和扩散阻挡层上形成保护绝缘层（30）。在保护绝缘层的开口处形成焊料凸块（40）。

10. 发明公开

KR1020120096754A 인터포저를 이용한 웨이퍼 칩의 3차원 스택 구조 无效
标题翻译：使用插销器的三维矩形堆叠结构
公开(公告)号：KR1020120096754A
公开(公告)日：2012-08-31
申请号：KR1020110016038
申请日：2011-02-23
申请人： 삼성전자주식회사
发明人： 신효영 , 박태상 , 문영준 , 홍순민
IPC分类号： H01L23/48 , H01L23/12
CPC分类号： H01L25/0657 , H01L2224/131 , H01L2224/16227 , H01L2224/16235 , H01L2225/06517 , H01L2225/06572 , H01L2924/014
摘要： PURPOSE: A three-dimensional stack structure of a wafer chip using an interposer is provided to reduce the size of a PBA(Printed Board Assembly) without separately packaging each wafer chip. CONSTITUTION: A first wafer chip(110) is mounted on a printed circuit board. A second wafer chip(120) is stacked on an upper side of the first wafer chip. A first interposer(140) is interposed between the second wafer chip and a printed circuit board in order to electrically connect the second wafer chip and the printed circuit board. The first wafer chip is electrically connected to the printed circuit board by a solder joint.
摘要翻译：目的：提供使用插入器的晶片芯片的三维堆叠结构，以在不分开封装每个晶片芯片的情况下减小PBA（印刷电路板组件）的尺寸。构成：将第一晶片芯片（110）安装在印刷电路板上。第二晶片芯片（120）堆叠在第一晶片芯片的上侧。为了电连接第二晶片芯片和印刷电路板，第一插入件（140）插入在第二晶片芯片和印刷电路板之间。第一晶片芯片通过焊接点与印刷电路板电连接。

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