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1. 发明公开

KR1020130057714A 발광소자 패키지 및 그를 이용한 조명 장치 无效
标题翻译：使用相同的发光二极管封装和照明设备
公开(公告)号：KR1020130057714A
公开(公告)日：2013-06-03
申请号：KR1020110123595
申请日：2011-11-24
申请人： 삼성전자주식회사
发明人： 송진혁
IPC分类号： H01L33/48 , F21V17/00
CPC分类号： H01L33/486 , H01L33/62
摘要： PURPOSE: A light emitting diode package and a lighting apparatus using the same are provided to facilitate replacement by using a package substrate including an assembly-type connection groove. CONSTITUTION: A light emitting device is mounted in a cavity. An assembly-type connection groove(112) is formed in the side well of a package substrate(110). The connection groove is attached and detached to/from an external electrical connection part. A first electrode(131) and a second electrode are exposed through the connection groove. The connection groove includes a slot structure and a connector structure.
摘要翻译：目的：提供一种发光二极管封装和使用该发光二极管封装的照明装置，以通过使用包括组装型连接槽的封装基板来实现更换。构成：将发光装置安装在空腔中。组装型连接槽（112）形成在封装衬底（110）的侧孔中。连接槽与外部电连接部分连接和拆卸。第一电极（131）和第二电极通过连接槽露出。连接槽包括槽结构和连接器结构。

2. 发明公开

KR1020090016233A 반도체 제조 장치 无效
标题翻译：制造半导体的装置
公开(公告)号：KR1020090016233A
公开(公告)日：2009-02-13
申请号：KR1020070080727
申请日：2007-08-10
申请人： 삼성전자주식회사
发明人： 김영철 , 송진혁 , 태동호 , 임채권 , 장재호 , 김기석 , 김철수 , 백동석
IPC分类号： H01L21/687 , H01L21/68 , H01L21/00 , H01L21/02
CPC分类号： H01L21/67011 , H01L21/67259 , H01L21/68742 , H01L21/68785
摘要： An apparatus for manufacturing semiconductor is provided to suppress sliding and the popping of substrate by controlling lift pin to descend when it is unloaded to for certain time. In an apparatus for manufacturing semiconductor, a supporting member(120) supports a substrate. A lift pin(130) performs the elevating action in order to pass through the supporting member, and unloads or loads the substrate from the supporting member. If the lift pin rises and the substrate is not unloaded for certain hours, the controller(170) controls the driving unit to descend the left pin.
摘要翻译：提供一种用于制造半导体的装置，用于通过控制升降销在卸载一段时间时下降而抑制基板的滑动和弹出。在半导体制造装置中，支撑部件（120）支撑基板。提升销（130）执行升降动作以通过支撑构件，并从支撑构件卸载或加载基板。如果提升销升高并且基板未卸载一定时间，则控制器（170）控制驱动单元向下引导左销。

3. 发明公开

KR1020130078348A 조명 장치 无效
标题翻译：照明设备
公开(公告)号：KR1020130078348A
公开(公告)日：2013-07-10
申请号：KR1020110147248
申请日：2011-12-30
申请人： 삼성전자주식회사
发明人： 홍종파 , 이관수 , 송진혁 , 손중곤
IPC分类号： F21V8/00 , F21V5/00 , F21Y101/02
CPC分类号： G02B6/0001 , G02B6/001 , G02B6/0041 , G02B6/0046 , G02B6/0061 , G02B6/0075
摘要： PURPOSE: A lighting device is provided to obtain a uniform surface light source in a round form using a light emitting element. CONSTITUTION: A lighting device includes a main body (110); a light emitting element (120) which is installed in at least one end part inside the main body; and a light guiding member (130) which is positioned between two ends of the main body in order to uniformly distribute the light emitted from the light emitting element. The refractive index of the light guiding member decreases as the light guiding member gets further away from the light emitting element.
摘要翻译：目的：提供照明装置以使用发光元件以圆形形式获得均匀的表面光源。构成：照明装置包括主体（110）; 发光元件（120），安装在主体内的至少一个端部; 以及位于主体的两端之间的导光构件（130），以便均匀地分布从发光元件发射的光。导光部件的折射率随着导光部件远离发光元件而减小。

4. 实用新型

KR2019980009313U 피엘시(PLC) 无效
标题翻译： 피엘시（PLC）
公开(公告)号：KR2019980009313U
公开(公告)日：1998-04-30
申请号：KR2019960020937
申请日：1996-07-15
申请人： 삼성전자주식회사
发明人： 송진혁
IPC分类号： G05B19/05
摘要： 피엘시(PLC)를개시한다. 이피엘시(PLC)는, 전원공급모듈, CPU 모듈, 네트워크모듈, 및입출력모듈이서로결합된피엘시(PLC)에있어서, 상기입출력모듈은, 그외부연결단자가서로대칭되는두 가지구조로분류되는것을그 특징으로한다. 이에따라전체적점유공간을줄일수 있고, 협소한공장라인상의배치에일조할수 있다.
摘要翻译：公开了当一个PLL（PLC）。 Yipiel时（PLC），电源模块，CPU模块，网络模块，以及输入和输出模块被分成两个结构在PLL时（PLC）耦合到彼此，其中所述输入 - 输出模块，和所述外部连接端子彼此对称并在其功能。 Yiettara可以减少整体所占空间，它可以被布置在一个窄有助于植物系。

5. 发明公开

KR1020130101827A ＬＥＤ 패키지 배광 검사 장치 无效
标题翻译：检测LED封装的光分布的装置
公开(公告)号：KR1020130101827A
公开(公告)日：2013-09-16
申请号：KR1020120022873
申请日：2012-03-06
申请人： 삼성전자주식회사
发明人： 홍종파 , 성재호 , 송진혁
IPC分类号： G01J1/02 , G01J1/08
摘要： PURPOSE: An LED package light distribution inspecting device is provided to measure the lights emitted from a light emitting element device with a light reflection principle, thereby by reducing time required for the light distribution to several seconds a few seconds required for photographing once. CONSTITUTION: An LED package light distribution inspecting device (100) includes a mounting jig (120), a light measuring unit (130), and a light reflecting unit (140). A target light emitting element package (110) is mounted on the mounting jig. The light measuring unit measures the intensity of lights emitted by the light emitting element package. The light reflection unit reflects at least some of the lights emitted by the light emitting element package to the light measuring unit so that the lights emitted by the light emitting element package reach the light measuring unit. The light measuring unit measures the lights emitted by the light emitting element package at the same time, thereby inspecting the light distribution of the light emitting element package.
摘要翻译：目的：提供一种LED封装配光检查装置，用光反射原理测量从发光元件装置发出的光，从而将照明所需的时间减少到需要几秒钟的时间，拍摄一次。构成：LED封装配光检查装置（100）包括安装夹具（120），光测量单元（130）和光反射单元（140）。目标发光元件封装（110）安装在安装夹具上。光测量单元测量由发光元件封装发射的光的强度。光反射单元将由发光元件封装发射的至少一些光反射到光测量单元，使得由发光元件封装发射的光到达光测量单元。光测量单元同时测量由发光元件封装发射的光，从而检查发光元件封装的光分布。

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