专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

KR1020170019119A 슬림형 전자 장치 审中-实审
标题翻译： SLIM型便携式电子设备
公开(公告)号：KR1020170019119A
公开(公告)日：2017-02-21
申请号：KR1020150113083
申请日：2015-08-11
申请人： 삼성전자주식회사
发明人： 박민영 , 길광민 , 유재준 , 이창열 , 강장훈 , 김태언 , 박영배
IPC分类号： H04M1/02 , H04R1/02 , H04M1/03
CPC分类号： H04R1/028 , H04M1/03 , H04R1/023 , H04R1/025 , H04R2499/11
摘要： 본발명에는슬림형전자장치가개시된다. 개시된전자장치는기판에형성된개구; 상기개구내에수용되어중첩되지않고, 상하면이상기기판상하면과평행하게배치되는음향부품을포함할수 있다.
摘要翻译：提供了一个超薄的电子设备。细长电子器件包括其中形成有开口的基板和容纳在基板的开口中的音频部件，而不与基板重叠，并且被布置成使得其顶部和底部基本上平行于基板的顶部和底部。

2. 发明授权

KR101676672B1 쉴드 캔용 고정 장치 有权
标题翻译：固定装置固定装置
公开(公告)号：KR101676672B1
公开(公告)日：2016-11-16
申请号：KR1020090101571
申请日：2009-10-26
申请人： 삼성전자주식회사
发明人： 김건탁 , 정순완 , 정재우 , 박민영 , 장세영
IPC分类号： H05K9/00
CPC分类号： H05K9/0022
摘要： 본발명은다수의전자부품들(electronic function group)이실장되는기판과, 전자파차폐를위하여상기전자부품들을커버링하도록상기기판상에장착되며, 높이를갖도록테두리를따라측면부가형성되는금속성쉴드캔을포함하는전자기기의쉴드캔 고정장치에관한것으로서, 상기기판의쉴드캔 고정라인에부착되는일정길이를갖는저부와, 상기측면부의삽입을위한일정폭의슬릿을갖도록상기저부에서상방향으로각각절곡형성되는한 쌍의패널과, 상기한 쌍의패널중 어느하나또는양 패널에형성되는적어도하나의개구및 상기개구와상응하는위치의쉴드캔의측면부에돌출형성되어상기개구에삽입됨으로써상기쉴드캔의고정력을도모하는삽입돌기를포함하며, 상기측면부가슬릿에삽입되었을때 가압할수 있는적어도하나의텐션돌기가돌출형성되며, 상기텐션돌기는상기측면부와의접촉면이일정길이를갖는장방형임으로구성됨으로써이중벽사이에쉴드캔의측면부를삽입하는방식으로고정되기때문에제조성, 체결력, 유지보수성및 공간이용성이우수하여제품신뢰도가향상된다.

3. 发明授权

KR101608745B1 인쇄회로기판조립체의 제조방법 有权
标题翻译：印刷电路板组装方法
公开(公告)号：KR101608745B1
公开(公告)日：2016-04-05
申请号：KR1020090133496
申请日：2009-12-30
申请人： 삼성전자주식회사
发明人： 박민영 , 문영준 , 한현주 , 허균 , 장경운 , 홍상일 , 백동석
IPC分类号： H05K3/14 , H05K3/30
CPC分类号： H05K3/321 , H05K3/125 , H05K3/4664 , H05K2201/09436 , H05K2201/09881 , Y10T29/49126 , Y10T29/49128 , Y10T29/49133 , Y10T29/49155 , Y10T29/49165
摘要： 솔더를사용하지않고인쇄회로기판에부품을부착하는인쇄회로기판조립체제조방법을개시한다. 이를위해잉크젯프린팅방식으로도전체를포함하는제1잉크와절연체를포함하는제2잉크를도포하여인쇄회로기판을형성하고, 형성된인쇄회로기판위에부품의전극과도전층이접촉하도록부품을안착하고고온에서경화시킴으로써인쇄회로기판조립체를생성한다.

4. 发明授权

KR101575812B1 자가전원 반도체 장치를 갖는 데이터 저장장치 有权
标题翻译：具有自供电半导体器件的数据存储装置
公开(公告)号：KR101575812B1
公开(公告)日：2015-12-09
申请号：KR1020090005174
申请日：2009-01-21
申请人： 삼성전자주식회사
发明人： 마야수브라마냐 , 김희석 , 김익수 , 박민영 , 권현숙
IPC分类号： H01L21/8247 , H01M10/02
CPC分类号： H01L27/10897 , H01L23/58 , H01L25/0657 , H01L25/16 , H01L27/10876 , H01L27/10894 , H01L2225/06513 , H01L2225/06541 , H01L2225/06572 , H01L2924/0002 , H01L2924/00
摘要： 데이터저장장치를제공한다. 상기데이터저장장치는인터페이스, 버퍼제어기, 메모리제어기, 비휘발성메모리, 및상기버퍼제어기에인접하고전기적으로접속된자가전원반도체장치로구성된다. 상기자가전원반도체장치는반도체칩 및상기반도체칩에부착된충전마이크로배터리를구비한다. 상기충전마이크로배터리는서로마주보도록형성된제 1 집전전극및 제 2 집전전극, 상기제 1 집전전극에접촉되고상기제 2 집전전극과마주보는제 1 분극전극(first polarizing electrode), 상기제 2 집전전극에접촉되고상기제 1 분극전극과마주보는제 2 분극전극(second polarizing electrode), 및상기제 1 분극전극및 상기제 2 분극전극사이에형성된전해질층을구비한다.

5. 发明授权

KR101534678B1 텅스텐 콘택 플러그를 산소 분위기에서 ＲＴＡ 처리하고, ＲＴＯ 처리된 텅스텐 플러그를 수소 분위기에서 환원시키는 반도체 소자의 제조방법 有权
标题翻译：通过在氧气氛下快速退火钨接触塞并在氢气氛下还原RTO脉冲来制造半导体器件的方法
公开(公告)号：KR101534678B1
公开(公告)日：2015-07-08
申请号：KR1020090011506
申请日：2009-02-12
申请人： 삼성전자주식회사
发明人： 최석헌 , 홍창기 , 최재형 , 손윤호 , 박민영 , 탁용석
IPC分类号： H01L21/28 , H01L21/324
CPC分类号： H01L21/76877 , H01L21/321 , H01L21/3212 , H01L21/7684 , H01L21/76883
摘要： 콘택홀에텅스텐을증착할때 텅스텐의그레인이 3방향에서진행되기때문에, 삼중점에서씸(Seam) 기타국부단차가발생한다. 콘택플러그에씸이존재하면, 텅스텐이열화되고수율이감소한다. 국부단차를개선하기위하여, 텅스텐이산소분위기에서고온으로가열되면부피가 2∼3배로팽창되는특성을이용한다. 텅스텐콘택플러그를고온의산소분위기에서히팅(Heating) 혹은플라즈마(Plasma) 방식으로급속열처리(RTA)하고, 층간절연막의표면위로부피팽창된텅스텐을버핑 CMP 공정을통하여제거한다. 또한, 텅스텐의산화공정에서콘택저항이증가되는점을개선하기위하여, 급속열산화(RTO) 및버핑연마처리된텅스텐콘택플러그를수소가스분위기에서급속열환원(RTH)시키며, 환원반응에의하여텅스텐옥사이드(WO)는순수텅스텐(W)으로전환된다.

6. 发明公开

KR1020110077042A 인쇄회로기판조립체의 제조방법 有权
标题翻译：印刷电路板组装方法
公开(公告)号：KR1020110077042A
公开(公告)日：2011-07-07
申请号：KR1020090133496
申请日：2009-12-30
申请人： 삼성전자주식회사
发明人： 박민영 , 문영준 , 한현주 , 허균 , 장경운 , 홍상일 , 백동석
IPC分类号： H05K3/14 , H05K3/30
CPC分类号： H05K3/321 , H05K3/125 , H05K3/4664 , H05K2201/09436 , H05K2201/09881 , Y10T29/49126 , Y10T29/49128 , Y10T29/49133 , Y10T29/49155 , Y10T29/49165 , H05K3/14 , H05K3/30
摘要： PURPOSE: A method of making printed circuit board assembly is provided to attach a component to the printed circuit board without using solder, thereby saving expenses by simplifying a process. CONSTITUTION: A conductive layer is formed by applying a first ink(30) including an electric conductor. The component is settled in order to touch the conductive layer with an electrode(50) of a component(60) on a base board which is formed the conductive layer. The component is bonded on the base board which is formed the conductive layer by solidifying the conductive layer. The conductive layer is formed by applying the first ink on the base board in an ink-jet printer method. Solidifying the conductive layer is performed by adding high temperature heat to the conductive layer.
摘要翻译：目的：提供一种制造印刷电路板组件的方法，以将组件附接到印刷电路板而不使用焊料，从而通过简化工艺节省费用。构成：通过施加包括电导体的第一墨（30）形成导电层。为了在形成导电层的基板上的部件（60）的电极（50）与导电层接触来构成部件。该部件通过使导电层固化而结合在形成导电层的基板上。导电层通过在喷墨打印机方法中在基板上施加第一墨水而形成。通过向导电层添加高温热来进行导电层的固化。

7. 发明公开

KR1020110015256A 가변 저항 메모리 장치 및 그것의 프로그램 방법 无效
标题翻译：可变电阻存储器件及其程序方法
公开(公告)号：KR1020110015256A
公开(公告)日：2011-02-15
申请号：KR1020090072889
申请日：2009-08-07
申请人： 삼성전자주식회사
发明人： 윤홍식 , 조금석 , 백인규 , 심현준 , 박민영
IPC分类号： G11C16/00 , G11C16/34 , G11C16/12
CPC分类号： G11C13/0069 , G11C13/0007 , G11C13/0064 , G11C2013/0066
摘要： PURPOSE: A variable resistance memory device and a programming method thereof are provided to increase the lifetime of a device by reducing a switching current inputted to a variable resistance device. CONSTITUTION: A bypass circuit(130) bypasses a switching current inputted to a variable resistance memory cell. A voltage sensor outputs a control signal according to the set state of the variable resistance memory cell. A bypass transistor is connected in parallel to a variable resistance memory cell(120). An inverter inverts the voltage of an input terminal of the pulse and provides the inverted signal as a control signal. A delay circuit(110) outputs a control signal by delaying the set pulse.
摘要翻译：目的：提供可变电阻存储器件及其编程方法，以通过减少输入到可变电阻器件的开关电流来增加器件的寿命。构成：旁路电路（130）绕过输入到可变电阻存储单元的开关电流。电压传感器根据可变电阻存储单元的设定状态输出控制信号。旁路晶体管与可变电阻存储单元（120）并联连接。反相器将脉冲的输入端的电压反相，并提供反相信号作为控制信号。延迟电路（110）通过延迟设定脉冲来输出控制信号。

8. 发明公开

KR1020100083402A 저항 메모리 장치의 제조방법 有权
标题翻译：电阻随机访问存储器件及其制造方法
公开(公告)号：KR1020100083402A
公开(公告)日：2010-07-22
申请号：KR1020090002756
申请日：2009-01-13
申请人： 삼성전자주식회사
发明人： 윤홍식 , 조금석 , 백인규 , 심현준 , 박민영
IPC分类号： G11C11/15
CPC分类号： H01L27/2409 , G11C2213/71 , G11C2213/72 , G11C2213/77 , H01L27/249 , H01L45/04 , H01L45/1226 , H01L45/146
摘要： PURPOSE: A resistive random access memory device and a method for fabricating the same are provided to implement a high integration array with a plurality of laminated memory layers by forming a 3D cross point architecture with a process step by which one memory cell is formed. CONSTITUTION: A resistance memory device(1) includes 3D-cross point architectures, which are formed by arranging memory cell blocks in 3D. The memory cell block defines a cross point of a bit line and a word line. The resistance memory device comprises a plurality of the word line(W1,W2,W3,W4) and a plurality of the bit line(B1,B2,B3). The word lines and bit lines are functioned as an electrode.
摘要翻译：目的：提供一种电阻随机存取存储器件及其制造方法，通过在形成一个存储单元的工艺步骤中形成3D交叉点结构来实现具有多个层压存储器层的高集成阵列。构成：电阻存储器件（1）包括通过以3D形式布置存储器单元块而形成的3D交叉点架构。存储单元块定义位线和字线的交叉点。电阻存储装置包括多个字线（W1，W2，W3，W4）和多个位线（B1，B2，B3）。字线和位线用作电极。

9. 发明公开

KR1020080064741A 광대역 무선 접속 시스템에서 단말의 멀티캐스트 및브로드캐스트 서비스 채널 신청과 삭제 및 변경을 위한장치 및 방법 失效
标题翻译：宽带无线接入系统中打开，缩放和更改MCBCS通道的设备和方法
公开(公告)号：KR1020080064741A
公开(公告)日：2008-07-09
申请号：KR1020080001266
申请日：2008-01-04
申请人： 삼성전자주식회사
发明人： 김기백 , 오준환 , 박성범 , 김성민 , 박민영 , 김경진
IPC分类号： H04W4/06 , H04W72/00 , H04H20/71
CPC分类号： H04W72/005
摘要： An apparatus and a method for requesting, deleting and changing an MCBCS(Multicast and Broadcast Service) channel in a broadband wireless access system are provided to reduce an overall transmission delay for processing an MCBCS call and effectively utilize a processing capacity. A terminal transmits a channel select request message to an MCBCS server(130) in order to request a channel. The MCBCS server searches a mapping table to extract an MBS(Multicast and Broadcast Service) zone identifier mapped to a base station identifier and a broadcast channel identifier included in the channel select request message, generates a new channel select request message including the extracted MBS zone identifier, and transmits it to a policy server. When a DSA(Dynamic Service Addition) trigger request message is received from the policy server, a BSC(Base Station Controller)(120) searches the mapping table to extract a MAC layer name tag mapped to a broadcast channel identifier included in the DSA trigger request message, generates a DSA request message including the extracted MAC layer name tag, and transmits it to the terminal.
摘要翻译：提供了一种用于在宽带无线接入系统中请求，删除和改变MCBCS（组播和广播业务）信道的装置和方法，以减少用于处理MCBCS呼叫并有效利用处理能力的整体传输延迟。终端向MCBCS服务器（130）发送频道选择请求消息以请求频道。 MCBCS服务器搜索映射表以提取映射到包括在频道选择请求消息中的基站标识符和广播信道标识符的MBS（组播和广播服务）区标识符，生成包括所提取的MBS区的新信道选择请求消息标识符，并将其发送到策略服务器。当从策略服务器接收到DSA（动态服务添加）触发请求消息时，BSC（基站控制器）（120）搜索映射表以提取映射到包括在DSA触发器中的广播信道标识符的MAC层名称标签请求消息，生成包含提取的MAC层名称标签的DSA请求消息，并将其发送到终端。

10. 发明公开

KR1020050010268A 반도체칩 표면실장방법 失效
标题翻译：半导体芯片的表面安装方法，用于简化不包装材料的安装工艺
公开(公告)号：KR1020050010268A
公开(公告)日：2005-01-27
申请号：KR1020030049311
申请日：2003-07-18
申请人： 삼성전자주식회사
发明人： 장세영 , 박민영 , 홍순민
IPC分类号： H01L21/52
CPC分类号： H01L24/81 , H01L21/563 , H01L24/29 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/274 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83102 , H01L2224/83104 , H01L2224/83191 , H01L2224/83856 , H01L2224/92125 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/1579 , H01L2924/00 , H01L2924/00014 , H01L2924/0665
摘要： PURPOSE: A surface mounting method of a semiconductor chip is provided to simplify mounting processes without packing materials necessary to transfer a semi-finished semiconductor chip structure to a predetermined position. CONSTITUTION: A plurality of semiconductor chips are arranged on a semiconductor wafer. A plurality of solder bumps are formed on a backside of the wafer corresponding to conductive contact portions of each semiconductor chip(S1). An under-fill material is coated on the entire backside of the wafer(S2). The under-fill material is partially cured to obtain adhesiveness from the under-fill material(S3). The wafer is cut into a plurality of semiconductor chips and the chips are directly arranged on a PCB(Printed Circuit Board)(S4,S5). The resultant structure is heated at a predetermined temperature range(S6).
摘要翻译：目的：提供半导体芯片的表面安装方法，以简化安装过程，而不需要将半成品半导体芯片结构传送到预定位置所需的材料。构成：半导体晶片上布置有多个半导体芯片。在对应于每个半导体芯片（S1）的导电接触部分的晶片的背面上形成多个焊料凸块。底部填充材料涂覆在晶片的整个背面（S2）上。底部填充材料被部分固化以获得来自底部填充材料的粘合性（S3）。将晶片切割成多个半导体芯片，并将芯片直接布置在PCB（印刷电路板）（S4，S5）上。所得结构在预定温度范围内被加热（S6）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式