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1. 发明授权

KR101514503B1 기판 인쇄 장치 有权
公开(公告)号：KR101514503B1
公开(公告)日：2015-04-22
申请号：KR1020120150780
申请日：2012-12-21
申请人： 삼성전기주식회사
发明人： 무카이노리야키 , 최진원 , 김승완
IPC分类号： B41F15/08 , H05K3/12
摘要： 본 발명에 따른 기판 인쇄장치는, 패턴홀이 형성된 마스크; 상기 마스크의 외곽을 지지하는 마스크지지부; 및 기판의 면적 변화에 따라 상기 마스크 면적을 변화시키도록 상기 마스크의 외곽을 수직방향으로 가압하여 마스크에 수평방향 인장력을 가하는 마스크가압부; 를 포함하되, 상기 마스크가압부는 실린더가 설치된 승강부에 의해 기울어짐이 개별적으로 제어되어 마스크의 면적 변화에 대응할 수 있게 된다.

2. 发明公开

KR1020140081193A 고밀도 및 저밀도 기판 영역을 구비한 하이브리드 기판 및 그 제조방법 无效
标题翻译：具有高密度和低密度基底区域的混合基板及其制造方法
公开(公告)号：KR1020140081193A
公开(公告)日：2014-07-01
申请号：KR1020120150694
申请日：2012-12-21
申请人： 삼성전기주식회사
发明人： 최진원
IPC分类号： H01L23/498 , H05K3/46 , H01L23/00 , H05K1/18 , H05K3/00
CPC分类号： H01L24/80 , H01L23/49822 , H01L23/49833 , H01L24/16 , H01L2224/16225 , H01L2924/12042 , H05K1/183 , H05K1/185 , H05K3/0097 , H05K3/4688 , H05K2201/0187 , H05K2201/09727 , H05K2203/061 , H05K2203/063 , H05K2203/1536 , H01L2924/00
摘要： The present invention relates to a hybrid substrate having high density and low density substrate regions and a manufacturing method thereof. According to an embodiment of the present invention, there is proposed a hybrid substrate having high density and low density substrate regions, comprising a low density substrate layer having a cavity formed in a middle region and a low density region with low pattern density around the cavity; a high density substrate layer embedded in the cavity of the low density substrate layer and including a high density region with pattern density higher than that of the low density region; an insulating support layer including a stacked region above, below, or above and below the high density substrate layer and the low density substrate layer; insulating layer vias penetrating through the stacked region and connected to the patterns of the high density substrate and the low density substrate layer; and an outer pattern layer including circuit patterns connected to the insulating layer vias and formed on the stacked region of the insulating support layer. A method for manufacturing the hybrid substrate is also proposed.
摘要翻译：本发明涉及具有高密度和低密度衬底区域的混合衬底及其制造方法。根据本发明的实施例，提出了一种具有高密度和低密度衬底区域的混合衬底，其包括在中间区域形成有空腔的低密度衬底层和围绕腔体的低图案密度的低密度区域 ; 嵌入低密度衬底层的空腔中的高密度衬底层，并且包括具有高于低密度区域的图案密度的高密度区域; 绝缘支撑层，其包括在高密度基板层和低密度基板层的上方，下方或上方和下方的堆叠区域; 绝缘层通孔穿过堆叠区域并连接到高密度衬底和低密度衬底层的图案; 以及外部图案层，其包括连接到绝缘层通孔并形成在绝缘支撑层的堆叠区域上的电路图案。还提出了制造混合基板的方法。

3. 发明授权

KR101376888B1 회로기판의 솔더 볼 범핑을 위한 마스크 및 그를 이용한 솔더 볼 범핑 방법 有权
标题翻译：用于在电路板上保存焊球的掩模和使用其的焊接球保护方法
公开(公告)号：KR101376888B1
公开(公告)日：2014-03-20
申请号：KR1020120112966
申请日：2012-10-11
申请人： 삼성전기주식회사
发明人： 최진원 , 유연호 , 문선재 , 노리아키무카이 , 김승완 , 이기주 , 최정인
IPC分类号： H01L21/60 , H05K3/34
CPC分类号： B23K3/06 , B23K3/0623 , B23K3/082 , H01L24/11
摘要： The present invention relates to a mask for bumping a solder ball on a circuit board and a solder ball bumping method using the same. According to one embodiment of the present invention, the mask for bumping a solder ball on a circuit board includes opening parts which provides a space where a solder ball is inserted and mounted on a solder pad; and a trench which provides an inflow space for the spreading of flux to the mounting part of the solder ball on the solder pad and is extended from at least one side of the circumference of the opening part. Also, a mask for bumping a solder ball on a circuit board and a solder ball bumping method are disclosed.
摘要翻译：本发明涉及一种用于在电路板上焊接焊球的掩模和使用该掩模的焊球凸起方法。根据本发明的一个实施例，用于在电路板上焊接焊球的掩模包括提供焊锡球插入并安装在焊盘上的空间的开口部分; 以及沟槽，其提供用于将焊剂扩散到焊料焊盘上的焊球的安装部分的流入空间，并且从开口部分的圆周的至少一侧延伸。另外，公开了一种用于在电路板上焊接焊球的掩模和焊球凸起方法。

4. 发明公开

KR1020140013838A 자중을 이용한 솔더 볼 실장 장치, 이를 포함한 솔더 볼 실장 시스템 및 이를 이용한 솔더 볼 실장 방법 有权
标题翻译：使用重金属，焊接球安装系统的焊接球安装装置和使用其安装焊接球的方法
公开(公告)号：KR1020140013838A
公开(公告)日：2014-02-05
申请号：KR1020120082659
申请日：2012-07-27
申请人： 삼성전기주식회사
发明人： 최진원 , 유연호
IPC分类号： H05K13/04 , H05K3/34
摘要： A solder ball mounting method according to the present invention includes the following steps of: (A) arranging a printed circuit board in order to mount solder balls; (B) positioning the printed circuit board between a table of a solder ball mounting apparatus and a mask for mounting; (C) supplying multiple solder balls to the mask for mounting, generating a vibration to the table of the solder ball mounting apparatus by the control of a control unit, and respectively tilting the table in a left and right direction at an acute angle; (D) determining whether the control unit fills opening parts of the mask for mounting with the solder balls or not; and (E) generating a vibration to the table and repetitively tilting the table again in the left and right direction respectively at an acute angle by the control unit depending on the determination result. [Reference numerals] (400) Control unit; (500) Display unit
摘要翻译：根据本发明的焊球安装方法包括以下步骤：（A）布置印刷电路板以安装焊球; （B）将印刷电路板定位在焊球安装装置的台面和用于安装的掩模之间; （C）向掩模供给多个焊球用于安装，通过控制单元的控制向焊球安装装置的工作台产生振动，并分别以锐角在左右方向上倾斜工作台; （D）确定控制单元是否填充用于与焊球一起安装的掩模的开口部分; 和（E）根据确定结果，通过控制单元以锐角分别向桌子产生振动并重复地在左右方向上倾斜桌子。（附图标记）（400）控制单元; （500）显示单元

5. 发明公开

KR1020130128678A 솔더볼 공급장치 有权
标题翻译：焊球供应设备
公开(公告)号：KR1020130128678A
公开(公告)日：2013-11-27
申请号：KR1020120052573
申请日：2012-05-17
申请人： 삼성전기주식회사
发明人： 오흥재 , 유연호 , 최진원
IPC分类号： H05K3/34 , H01L21/60
CPC分类号： B23K3/0623
摘要： The present invention relates to a solder ball supplying apparatus. The solder ball supplying apparatus of the present invention includes an enclosure type cartridge having solder balls; a vibration unit combined with the lower part of the cartridge; and a metal mask integrated with the lower part of the vibration unit and having front holes.
摘要翻译：焊球供给装置技术领域本发明涉及焊球供给装置。本发明的焊锡球供给装置包括：具有焊球的外壳型盒; 与盒的下部结合的振动单元; 以及与振动单元的下部结合并具有前孔的金属掩模。

6. 发明公开

KR1020130085646A 용융솔더 사출헤드 无效
标题翻译：喷枪注射头
公开(公告)号：KR1020130085646A
公开(公告)日：2013-07-30
申请号：KR1020120006554
申请日：2012-01-20
申请人： 삼성전기주식회사
发明人： 무카이노리야키 , 오흥재 , 최진원 , 이근하
IPC分类号： H01L21/60 , H05K3/34
CPC分类号： H01L24/742 , H01L2224/742 , H01L2924/40
摘要： PURPOSE: A molten solder injection head is provided to prevent damage on a mask by minimizing thermal fatigue that is delivered through molten solders. CONSTITUTION: Bulk solders are injected to an upper part of a body (110), and an injection port is formed at a lower part of the body. A first heater (120) is located in the body and melts the bulk solders. A second heater (125) is located around the injection port and operates at a temperature lower than that of the first heater. A pad (130) of a polymer material is located at the lower part of the body and contacts a mask.
摘要翻译：目的：提供熔融焊料注射头，以通过最小化通过熔融焊料传递的热疲劳来防止对面罩的损害。构成：将大量焊料注入到主体（110）的上部，并且在主体的下部形成注射口。第一加热器（120）位于主体中并熔化散装焊料。第二加热器（125）位于注入口周围，并在低于第一加热器的温度下操作。聚合物材料的垫（130）位于身体的下部并与面罩接触。

7. 发明授权

KR101167805B1 패키지 기판 및 이의 제조방법 失效
标题翻译：包装基材及其制造方法
公开(公告)号：KR101167805B1
公开(公告)日：2012-07-25
申请号：KR1020110038602
申请日：2011-04-25
申请人： 삼성전기주식회사
发明人： 이동규 , 최진원 , 정승원 , 이대영 , 이기섭 , 김진호
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0346 , H01L2224/0347 , H01L2224/0401 , H01L2224/05572 , H01L2224/05647 , H01L2224/10145 , H01L2224/1146 , H01L2224/11849 , H01L2224/13022 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/014 , Y10T29/49165 , H01L2924/00012 , H01L2924/01028 , H01L2924/01046 , H01L2924/01083 , H01L2224/05552
摘要： PURPOSE: A package substrate and a manufacturing method thereof are provided to prevent the oxidation of a metal post by forming a thermal diffusion preventing film at the upper side of the metal post. CONSTITUTION: An insulating layer(120) is formed on a substrate(110). The insulating layer has an opening for exposing a conductive pad(111). An excitation prevention layer(130) is formed on the conductive pad and the insulating layer. The excitation prevention layer is composed of an alloy of Cu and Sn. The height of the excitation prevention layer is formed higher than the height of the upper surface of the insulating layer. A metal post(140) is formed on the excitation prevention layer. A thermal diffusion preventing film(150) is formed on the metal post. A solder bump(160) is formed on the thermal diffusion preventing film.
摘要翻译：目的：提供一种封装基板及其制造方法，以通过在金属柱的上侧形成热扩散防止膜来防止金属柱的氧化。构成：在衬底（110）上形成绝缘层（120）。绝缘层具有用于使导电焊盘（111）露出的开口。在导电焊盘和绝缘层上形成激励防止层（130）。励磁防止层由Cu和Sn的合金构成。激发防止层的高度形成为高于绝缘层的上表面的高度。金属柱（140）形成在激发防止层上。在金属柱上形成热扩散防止膜（150）。在热扩散防止膜上形成焊料凸块（160）。

8. 发明公开

KR1020120017606A 패키지 기판용 리드핀 및 이를 이용한 패키지 기판의 제조 방법 无效
标题翻译：用于包装衬底的引线，以及用于制造包装衬底的方法
公开(公告)号：KR1020120017606A
公开(公告)日：2012-02-29
申请号：KR1020100080303
申请日：2010-08-19
申请人： 삼성전기주식회사
发明人： 오흥재 , 최진원 , 이기택
IPC分类号： H01L23/48 , H01L21/60 , H01L23/498
CPC分类号： H05K3/4015 , H01L2924/15312 , H05K3/3426 , H05K2201/10318 , H05K2201/10704
摘要： PURPOSE: A lead pin for a package substrate and a package substrate manufacturing method using the same are provided to improve junction reliability with the package substrate by including a head part which has a dent for increasing junction area with a solder structure. CONSTITUTION: A lead pin(100) for a package substrate comprises a head part(110) and a pin shaped connection pin. One surface of the head part faces the package substrate. The connection pin is welded on the other surface of the head part. The head part includes a dent which has a convex shape towards the other surface of the head part. The dent has a dimple shape. The package substrate includes a pad part in which a solder bump is formed.
摘要翻译：目的：提供一种用于封装基板的引脚和使用其的封装基板制造方法，以通过包括具有用于增加与焊料结构的结合面积的凹陷的头部来提高与封装基板的结可靠性。构成：用于封装衬底的引脚（100）包括头部（110）和销形连接销。头部的一个表面面向封装基板。连接销焊接在头部的另一个表面上。头部包括朝向头部的另一表面具有凸形的凹陷。凹痕具有凹痕形状。封装衬底包括其中形成焊料凸块的焊盘部分。

9. 发明授权

KR101102512B1 도금조 및 이를 이용한 도금방법 失效
标题翻译：电镀浴和电镀方法使用
公开(公告)号：KR101102512B1
公开(公告)日：2012-01-04
申请号：KR1020090051458
申请日：2009-06-10
申请人： 삼성전기주식회사
发明人： 이동규 , 최진원 , 오흥재 , 문선재 , 정태준
IPC分类号： C23C18/31
摘要： 도금조 및 이를 이용한 도금방법이 개시된다. 기판의 표면에 도금층을 형성하기 위한 장치로서, 상기 기판 및 도금액을 수용하는 바스켓; 및 상기 바스켓의 내측에 마련되어, 상기 기판의 일면이 밀착되는 밀착보드를 포함하는 도금조는, 기판에 대한 선택적 단면 도금을 용이하게 실시할 수 있으며, 비용 및 시간을 절감할 수 있다.
도금조, 일면, 흡착노즐

10. 发明公开

KR1020110133525A 핀 그리드 어레이 기판의 제조방법 无效
标题翻译：制造基板阵列基板的方法
公开(公告)号：KR1020110133525A
公开(公告)日：2011-12-13
申请号：KR1020110111593
申请日：2011-10-28
申请人： 삼성전기주식회사
发明人： 백용호 , 최창규 , 최현식 , 최영식 , 최진원
IPC分类号： H01L21/60 , H01L23/48
摘要： PURPOSE: A method for manufacturing a pin grid array substrate is provided to form a solder layer using a micro solder ball or a pre-solder, thereby suppressing voids in the solder layer. CONSTITUTION: A substrate(10) has an electrode pad(20). A solder resist(30) exposes the top of the electrode pad onto the substrate. Flux is applied onto the electrode pad. A solder ball is formed on the electrode pad onto which the flux is applied. A lead pin(100) is mounted on a micro solder ball. The lead pin is made of a head(110) and a connection pin(120). The connection pin is formed on the upper center of the head.
摘要翻译：目的：提供一种用于制造针栅阵列基板的方法，以使用微焊球或预焊料形成焊料层，从而抑制焊料层中的空隙。构成：衬底（10）具有电极焊盘（20）。阻焊剂（30）将电极焊盘的顶部暴露在衬底上。焊剂被施加到电极焊盘上。在其上施加焊剂的电极焊盘上形成焊球。引脚（100）安装在微焊球上。引脚由头部（110）和连接销（120）制成。连接销形成在头部的上部中心。

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