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2. 发明公开

KR1020130137302A 비금속 기판 절단방법 有权
标题翻译：非金属基材切割方法
公开(公告)号：KR1020130137302A
公开(公告)日：2013-12-17
申请号：KR1020120060760
申请日：2012-06-07
申请人： 로체 시스템즈(주)
发明人： 이경원 , 이만진 , 방태원 , 이진화
IPC分类号： C03B33/02 , C03B33/09 , C03B33/037 , B23K26/38
CPC分类号： Y02P40/57 , C03B33/02 , B23K26/38 , C03B33/037 , C03B33/09
摘要： Disclosed is a method for cutting nonmetal substrates to create an initial crack with a uniform length at all times. The method for cutting nonmetal substrates comprises the steps of: aligning a camera to position an aligning mark in the center of the image obtained from the camera; determining whether the center of the image of the aligning mark is identical with the center of the camera image by obtaining the aligning mark image from the camera via a control unit after setting nonmetal substrates on a table; correcting the starting position of the initial crack on the nonmetal substrates by moving an initial cracker via the control unit if the center of the aligning mark image is not identical with the center of the camera image; creating the initial crack using the initial cracker on the part in which cutting of the cutting line of the nonmetal substrates begins; and cutting the nonmetal substrates at the point of the initial crack by forming a scribing line on the nonmetal substrates by irradiating a laser beam on the nonmetal substrates via an optical heating instrument. [Reference numerals] (AA) Start;(BB) Ene;(S110) Camera alignment;(S120) Align mark imaging center matches for an camera imaging center?;(S130) Correct initial cracks start position;(S140) Form initial crack formation on a non-metallic substrate;(S150) Cut non-metallic substrate by forming scribing lines on the non-metallic substrate
摘要翻译：公开了一种用于切割非金属基底以始终产生具有均匀长度的初始裂纹的方法。用于切割非金属基底的方法包括以下步骤：对准相机以将从相机获得的图像的中心的对准标记定位; 通过在将非金属基底设置在桌子上之后经由控制单元获得来自照相机的对准标记图像来确定对准标记的图像的中心是否与照相机图像的中心相同; 如果对准标记图像的中心与相机图像的中心不相同，则通过控制单元移动初始裂纹器来校正非金属基底上的初始裂纹的起始位置; 使用初始裂解器在非金属基底的切割线的切割开始的部分产生初始裂纹; 以及通过在非金属基板上通过光学加热仪对非金属基板照射激光束，在非金属基板上形成划线，来切割初始裂纹点处的非金属基板。（参考号）（AA）开始;（BB）Ene;（S110）相机对准;（S120）相机成像中心的对准标记成像中心匹配;（S130）正确的初始裂纹开始位置;（S140）形成初始裂纹在非金属基材上形成;（S150）通过在非金属基材上形成划线来切割非金属基材

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