基本信息:
- 专利标题： 비금속 기판 절단방법
- 专利标题（英）：Method for cutting of nonmetal-substrate
- 专利标题（中）：非金属基材切割方法
- 申请号：KR1020120060760 申请日：2012-06-07
- 公开(公告)号：KR101400708B1 公开(公告)日：2014-05-30
- 发明人： 이경원 , 이만진 , 방태원 , 이진화
- 申请人： 로체 시스템즈(주)
- 申请人地址： 경기도 용인시 처인구 경안천로 *** (고림동)
- 专利权人： 로체 시스템즈(주)
- 当前专利权人： 로체 시스템즈(주)
- 当前专利权人地址： 경기도 용인시 처인구 경안천로 *** (고림동)
- 代理人： 특허법인청맥
- 主分类号： C03B33/02
- IPC分类号： C03B33/02 ; C03B33/09 ; C03B33/037 ; B23K26/38
The non-metal substrate cutting method which can form an initial crack always of constant length on the non-metallic substrate to be cut is provided. The non-metal substrate cutting method comprises obtaining an image of the alignment mark by the camera then sets the comprising the steps of aligning the camera so that the alignment mark position on the center of the image obtained through the camera, a metal substrate on the table control the step of determining for a match with the alignment mark image of the center and the camera image centers and, and if the alignment mark image of the center and the camera image center determines that the inconsistent by the control unit the initial cracker through the controller move to the step of correcting the initial crack start position of the non-metallic substrate, forming an initial crack using the initial cracker at a portion where the cutting of the cutting line of the non-metal substrate starting and, for heating the optical mechanism to the non-metal substrate a point in time the initial crack by irradiation with a laser beam to form a scribing line on the non-metal substrate through a step that the non-metal substrate cutting.
公开/授权文献:
- KR1020130137302A 비금속 기판 절단방법 公开/授权日：2013-12-17
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C03 | 玻璃；矿棉或渣棉 |
| ----C03B | 制造、成型或辅助工艺 |
| ------C03B33/00 | 冷玻璃的裁割 |
| --------C03B33/02 | .板玻璃的切割或分割；所用设备或机器 |