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    • 4. 发明公开
    • 유전체 막을 처리하기 위한 방법 및 시스템
    • 用于处理电介质膜的方法和系统
    • KR1020060126933A
    • 2006-12-11
    • KR1020067004979
    • 2004-10-07
    • 도쿄엘렉트론가부시키가이샤
    • 토마도렐이오안쥬지안홍하마모토가즈히로
    • H01L21/316
    • H01L21/02337H01L21/02063H01L21/02126H01L21/02134H01L21/02137H01L21/02203H01L21/02343H01L21/02359H01L21/3105H01L21/31058H01L21/31138H01L21/76826H01L21/76831H01L23/5329H01L2924/0002H01L2924/00
    • A method and system for treating a dielectric film includes exposing at least one surface of the dielectric film to a CXHycontaining material, wherein x and y are each integers greater than or equal to a value of unity. The dielectric film can include a low dielectric constant film with or without pores having an etch feature formed therein following dry etch processing. As a result of the etch processing or ashing, exposed surfaces in the feature formed in the dielectric film can become damaged, or activated, leading to retention of contaminants, absorption of moisture, increase in dielectric constant, etc. Damaged surfaces, such as these, are treated by performing at least one of healing these surfaces to, for example, restore the dielectric constant (i.e., decrease the dielectric constant) and cleaning these surfaces to remove contaminants, moisture, or residue. Moreover, preparation for barrier layer and metallization of features in the film may include treating by performing sealing of sidewall surfaces of the feature to close exposed pores and provide a surface for barrier film deposition.
    • 用于处理电介质膜的方法和系统包括将电介质膜的至少一个表面暴露于含CXHy的材料,其中x和y各自为大于或等于一个值的整数。 介电膜可以包括具有或不具有在干蚀刻处理之后形成的蚀刻特征的孔的低介电常数膜。 作为蚀刻处理或灰化的结果,形成在电介质膜中的特征中的暴露表面可能被损坏或激活,导致污染物的保留,水分的吸收,介电常数的增加等。损坏的表面,例如这些 通过执行愈合这些表面中的至少一个来处理,例如恢复介电常数(即,降低介电常数)并清洁这些表面以去除污染物,水分或残留物。 此外,膜的特征的阻挡层和金属化的制备可以包括通过执行特征的侧壁表面的密封来封闭暴露的孔并提供用于阻挡膜沉积的表面来进行处理。