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    • 3. 发明公开
    • 가열 처리장치
    • 热处理装置
    • KR1020120052871A
    • 2012-05-24
    • KR1020110118431
    • 2011-11-14
    • 도쿄엘렉트론가부시키가이샤
    • 소마야스타카나카무라아키히로
    • G02F1/13H01L21/324
    • G02F1/1313H01L21/324H01L21/67098
    • PURPOSE: A heating device is provided to increase a processing speed without damage of a substrate even though the substrate is a large glass substrate. CONSTITUTION: A plurality of upper planar heating units(81) are arranged on a return route. A plurality of lower planar heating units are arranged on a lower part of the return route. Some upper and lower planar heating units are classified according to the return direction of the return route. Some upper and lower planar heating units are classified into a central part and both ends in the width direction of the return route. Both ends are controlled at a lower temperature than the temperature of the classified central part.
    • 目的:提供一种加热装置,以增加处理速度而不损坏基板,即使基板是大玻璃基板。 构成:在返回路线上布置有多个上平面加热单元(81)。 多个下平面加热单元布置在返回路线的下部。 一些上下平面加热单元根据返回路线的返回方向进行分类。 一些上下平面加热单元被分为在返回路线的宽度方向上的中心部分和两端。 两端控制在比分类的中央部分的温度低的温度。
    • 4. 发明公开
    • 기판가열처리장치 및 온도제어방법
    • 基板加热装置及控制温度的方法
    • KR1020010015371A
    • 2001-02-26
    • KR1020000041330
    • 2000-07-19
    • 도쿄엘렉트론가부시키가이샤
    • 소마야스타카야노카즈토시오오쿠라준사타케마사노리
    • H01L21/324
    • PURPOSE: A substrate heating device and a method for controlling a temperature are provided to change rapidly a temperature of a heating plate by improving a structure of a substrate heating device. CONSTITUTION: A heating plate(51) performs an operation for heating a substrate. A heater(52) is installed within the heating plate(51). The heater(52) performs a heating process for the substrate. A cooling plate(55) performs a cooling process for the heating plate(51). The cooling plate(55) is formed with a coolant path(56,57) and a coolant supply portion(60). A control portion(66) controls the heater and the cooling plate. The control portion(66) controls a temperature of the heating plate according to a predetermined temperature.
    • 目的:提供一种基板加热装置和控制温度的方法,通过改善基板加热装置的结构来快速改变加热板的温度。 构成:加热板(51)进行加热基板的动作。 加热器(52)安装在加热板(51)内。 加热器(52)对基板进行加热处理。 冷却板(55)对加热板(51)进行冷却处理。 冷却板(55)形成有冷却剂路径(56,57)和冷却剂供应部分(60)。 控制部分(66)控制加热器和冷却板。 控制部(66)根据预定温度控制加热板的温度。
    • 5. 发明公开
    • 기판 받아넘김 장치 및 기판 받아넘김 방법
    • 基板传输装置和基板传输方法
    • KR1020120026457A
    • 2012-03-19
    • KR1020110091125
    • 2011-09-08
    • 도쿄엘렉트론가부시키가이샤
    • 소마야스타카이모토나오키
    • H01L21/677B65G49/06G02F1/13
    • H01L21/67706B65G49/061B65G49/067G02F1/1303H01L21/67715
    • PURPOSE: A substrate transfer apparatus and a substrate transfer method are provided to transfer a substrate in stable by supporting a substrate by a drive roller row and a free roller row in transferring the substrate. CONSTITUTION: The drive shaft(55) revolves with the drive of the drive motor(51) at the sending direction of substrate. A drive shaft(55) rotates a substrate in transferring direction of a substrate by the drive motor. A rotation shaft is connected to the drive motor in parallel with the transfer direction of the substrate. A gear comprised of a bevel gear is mounted in the rotation shaft. A gear(54) consisting of the bevel gear is installed in one end of the drive shaft. A free roller shaft(57) is connected to a cylinder for driving the free roller.
    • 目的:提供基板转印装置和基板转印方法,以通过驱动辊排和自由辊排支撑基板来稳定地转印基板,从而转印基板。 构成:驱动轴(55)随着驱动电动机(51)的驱动沿基板的发送方向旋转。 驱动轴(55)通过驱动马达在基板的传送方向上旋转基板。 旋转轴与基板的传送方向平行地连接到驱动马达。 由伞齿轮构成的齿轮安装在旋转轴中。 由伞齿轮构成的齿轮(54)安装在驱动轴的一端。 自由辊轴(57)连接到用于驱动自由辊的气缸。
    • 6. 发明公开
    • 가열 처리 장치
    • 热处理单元
    • KR1020070061418A
    • 2007-06-13
    • KR1020060123948
    • 2006-12-07
    • 도쿄엘렉트론가부시키가이샤
    • 소마야스타카와다노리오야히로슌이치
    • H01L21/027H01L21/324
    • H01L21/67109H01L21/67173H01L21/67207
    • A heat treatment apparatus is provided to restrain the damage of a large sized substrate and to reduce the size of the apparatus by using a transfer path enclosed with a casing and first/second sheet type heaters. A heat treatment apparatus includes a transfer path for transferring a substrate to one way, a casing, and first and second sheet type heaters. The casing(6) is used for enclosing the transfer path. The first and second sheet type heaters(71a to 71r, 72a to 72r) are arranged along the transfer path in the casing. The first and second sheet type heaters are installed adjacent to both sides of the substrate. The transfer path is composed of a plurality of rotator members spaced apart from each other. The first and second sheet type heaters are installed at portions between the rotator members.
    • 提供一种热处理装置,用于限制大尺寸基板的损坏,并且通过使用由壳体和第一/第二片式加热器封装的传送路径来减小设备的尺寸。 热处理设备包括用于将衬底转移到单向的传送路径,壳体以及第一和第二片状加热器。 壳体(6)用于封闭传送路径。 第一和第二片式加热器(71a至71r,72a至72r)沿壳体中的传送路径布置。 第一和第二片式加热器安装在基片的两侧附近。 传送路径由彼此间隔开的多个旋转体构件构成。 第一和第二片式加热器安装在旋转件之间的部分。