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    • 8. 发明公开
    • 열전도성 실리콘 고무 조성물
    • 导热硅橡胶组合物
    • KR1020010051681A
    • 2001-06-25
    • KR1020000067482
    • 2000-11-14
    • 다우 코닝 도레이 캄파니 리미티드
    • 에나미히로지오니시마사유키오카와다다시아마코마사아키
    • C08L83/04
    • C08K5/5419C08K9/06Y10T428/2995C08L83/04
    • PURPOSE: To provide a thermally conductive silicone rubber composition having good handling characteristics and moldability even when a large amount of a thermally conductive filler is incorporated to obtain a silicon rubber having high thermal conductivity. CONSTITUTION: The thermally conductive silicone rubber composition comprises at least (A) a curable organopolysiloxane, (B) a curing agent, and (C) a thermally conductive filler, and the surface of the component (C) having been treated with (D) an oligosiloxane represented by the formula: (R1O)aSi(OSiOR23)(4-a) (wherein R1 is an alkyl group; R2 is the same or different aliphatic unsaturated bond-free monovalent hydrocarbon group; and a is 1, 2 or 3) or an oligosiloxane represented by the formula (R1O)aR2(3-a)SiO£R22SiO|nSi(OSiR23)bR2(3-a), wherein R1 is an alkyl group; R2 is the same or different aliphatic unsaturated bond-free monovalent hydrocarbon group; a is an integer of 1-3; b is an integer of 1-3; and n is an integer of >= 0.
    • 目的:为了提供具有良好的处理特性和成型性的导热硅橡胶组合物,即使在引入大量导热填料以获得具有高导热性的硅橡胶的情况下。 构成:导热硅橡胶组合物至少包含(A)可固化的有机聚硅氧烷,(B)固化剂和(C)导热填料,并且组分(C)的表面已经用(D) 由式(R1O)aSi(OSiOR23)(4-a)表示的低聚硅氧烷(其中R1为烷基; R2为相同或不同的不含脂肪族无键键的一价烃基; a为1,2或3 )或由式(R1O)aR2(3-a)表示的低聚硅氧烷SiO 2 R22SiO | nSi(OSiR23)bR2(3-a),其中R1是烷基; R2是相同或不同的不饱和脂肪族的一价烃基; a为1-3的整数; b为1-3的整数; 并且n是> = 0的整数。