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    • 8. 发明公开
    • 도전성 향상제용 유기산 금속염
    • 有机酸作为电导促进剂的金属盐
    • KR1020060134831A
    • 2006-12-28
    • KR1020060056011
    • 2006-06-21
    • 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션
    • 에머슨고든티.쿠더해리리차드무사오사마엠.
    • H01B1/22
    • C08K5/098C09J9/02C09J11/06H05K3/321
    • Provided is a conductive resin composition which is improved in electrical conductivity without deterioration of rheology and work lifetime by using a metal salt of carboxylic acid. The conductive resin composition comprises a resin; a conductive filler; and a metal salt of an organic acid except a metal acrylate and a metal methacrylate. Preferably the organic acid is a carboxylic acid of the metal salt of an organic acid; the metal is selected from the group consisting of Li, Na, Mg, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Pd, Pt, Ag, Au, Hg, Al and Sn; and the conductive filler is selected from the group consisting of gold, silver, copper, cobalt, silver-coated graphite, a copper alloy, platinum, palladium, nickel, aluminum, silver-coated copper, an alloy of silver and platinum, bronze, and brass alloy.
    • 提供一种导电树脂组合物,其通过使用羧酸的金属盐而导致导电性的改善而不会降低流变性和使用寿命。 导电树脂组合物包含树脂; 导电填料; 以及金属丙烯酸酯和金属甲基丙烯酸酯以外的有机酸的金属盐。 有机酸优选为有机酸金属盐的羧酸; 该金属选自Li,Na,Mg,K,Ca,Sc,Ti,V,Cr,Mn,Fe,Co,Ni,Cu,Zn,Pd,Pt,Ag,Au,Hg,Al 和锡; 导电填料选自金,银,铜,钴,银涂层石墨,铜合金,铂,钯,镍,铝,银涂铜,银和铂的合金,青铜, 和黄铜合金。
    • 9. 发明公开
    • 열경화성 접착 필름
    • 使用不含具有优异粘合强度的环氧官能团的聚合物体系的热固膜胶
    • KR1020040030203A
    • 2004-04-09
    • KR1020030029801
    • 2003-05-12
    • 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션
    • 니콜릭니콜라에이.짱루즈무사오사마엠.진화일우빙셴필드데이빗
    • C09J7/00
    • C08F267/10C08L25/00C08L33/00C08L55/00C09J5/10C09J11/06C09J2205/114C09J2425/00C09J2433/00C09J2455/00
    • PURPOSE: A thermosetting film adhesive used in semiconductor package is provided, to improve adhesive strength by using a polymer system which comprises a base polymer, an electron donor functional group and an electron acceptor functional group and contains no epoxy functional group. CONSTITUTION: The film adhesive comprises a polymer which has a molecular weight of 2,000-1,000,000 and contains no functional group of an electron donor and an electron acceptor; an independent electron donor compound; and an independent electron acceptor compound. Also the film adhesive comprises a polymer which has a molecular weight of 2,000-1,000,000 and contains a pendant electron acceptor functional group and/or a pendant electron donor functional group; optionally an independent electron donor compound; and optionally an independent electron acceptor compound. Preferably the polymer is prepared from an acryl monomer, a vinyl monomer or a conjugated diene monomer; the independent electron donor compound is selected from the group consisting of a vinyl ether, a vinyl silane and compound adhered to an aromatic ring and containing a C-C double bond conjugated with the unsaturated bond on the ring; and the independent electron acceptor compound is selected from the group consisting of fumarate, maleate, acrylate and maleimide.
    • 目的:提供半导体封装中使用的热固性膜粘合剂,通过使用包含基础聚合物,电子给体官能团和电子受体官能团并且不含环氧官能团的聚合物体系来提高粘合强度。 构成:胶粘剂包含分子量为2,000-1,000,000并且不含电子给体和电子受体的官能团的聚合物; 独立的电子给体化合物; 和独立的电子受体化合物。 胶粘剂也包含分子量为2,000-1,000,000的聚合物,并且包含侧电子受体官能团和/或侧电子给体官能团; 任选的独立的电子给体化合物; 和任选的独立的电子受体化合物。 优选地,聚合物由丙烯酸单体,乙烯基单体或共轭二烯单体制备; 独立的电子给体化合物选自乙烯基醚,乙烯基硅烷和附着在芳环上并含有与环上的不饱和键共轭的C-C双键的化合物; 独立的电子受体化合物选自富马酸盐,马来酸盐,丙烯酸酯和马来酰亚胺。