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1. 发明公开

KR1020150101191A 탄성력을 갖는 초미세부품 부착용 지그 및 이를 이용한 초미세부품 부착방법 无效
标题翻译：具有弹性的微型元件的JIG和使用其的微型元件搭配方法
公开(公告)号：KR1020150101191A
公开(公告)日：2015-09-03
申请号：KR1020140022577
申请日：2014-02-26
申请人： (주)드림텍
发明人： 정준진 , 주원희 , 김영호
IPC分类号： H05K13/04 , H05K3/32
摘要： 탄성력을 갖는 초미세부품 부착용 지그 및 이를 이용한 초미세부품 부착방법에 관하여 개시한다.
본 발명의 일 측면에 따르면 탄성력을 갖는 초미세부품 부착용 지그로서, 상기 지그의 상면은 평탄하게 형성되며, 적어도 하나의 초미세부품이 상기 지그의 상면을 통해 안착되도록 초미세부품의 단면 형상에 대응하는 안착 홈이 구비되고, 상기 안착 홈의 바닥에는 초미세부품의 배면을 지지하는 탄성체가 구비되며, 상기 안착 홈의 깊이는 초미세부품의 높이와 동일하거나 이보다 크게 형성되며, 상기 탄성체의 길이 복원 시 상기 탄성체가 지지하는 초미세부품의 상단이 상기 지그의 상면보다 상향 돌출되는 탄성력을 갖는 초미세부품 부착용 지그를 제공한다.
摘要翻译：公开了一种用于附加具有弹性的微型部件的夹具以及使用该微型部件附接微型部件的方法。在根据本发明的一个方面的用于安装具有弹性的微型部件的夹具中，夹具的上侧是平坦的。形成对应于微型部件的横截面形状的接收槽，以通过夹具的上侧容纳至少一个微型部件。支撑微型部件后侧的弹性体形成在容纳槽的底部。接收槽的深度等于或大于微型部件的高度。当弹性体的长度恢复时，与夹具的上侧相比，弹性体支撑的微小部件的上端向上突出。

2. 发明授权

KR101317248B1 공정 단순화가 가능한 지문인식 홈키 제조방법 및 지문인식 홈키 有权
标题翻译：制造手指识别方法家用钥匙简化手指识别和指纹识别首页关键词
公开(公告)号：KR101317248B1
公开(公告)日：2013-10-10
申请号：KR1020130075931
申请日：2013-06-28
申请人： (주)드림텍
发明人： 이진성 , 정우람 , 김종화 , 신동욱 , 주원희 , 정호철 , 김영호
IPC分类号： B29C45/13 , B29C45/14
CPC分类号： B29D19/00 , B05D3/007 , B05D3/12 , B05D5/12 , B05D7/56 , B05D2503/00 , B29C45/14778 , B29C45/14819 , B29C2045/0079 , G06K9/00006
摘要： PURPOSE: A method for manufacturing fingerprint recognizing home keys, capable of simplifying processes and a fingerprint recognizing home key are provided to prevent dielectric constant of dielectric members from being changed as the adhesive force between a fingerprint touch area and a fingerprint recognizing sensor comprising FPCB and ASIC is improved so that an air layer or an impurity layer is formed in a gap thereof. CONSTITUTION: A method for manufacturing fingerprint recognizing home keys comprises the following steps: molding a first injection-molded product by fixing the position of a fingerprint recognizing sensor (S100); molding a second injection-molded product in a home key shape in order that the second injection-molded product covers the upper part of FPCB of the fingerprint recognizing sensor (S200); and grinding the second injection-molded product on the upper part of the FPCB in order that the predetermined thickness remains (S300). [Reference numerals] (AA) Start; (BB) End; (S100) First injection molding by fixing the position of a fingerprint recognizing sensor; (S200) Second injection molding in order that the injection-molded product covers the upper part of FPCB of the fingerprint recognizing sensor; (S300) Grinding the injection-molded product on the upper part of the FPCB in order that the predetermined thickness remains
摘要翻译：目的：提供一种用于制造能够简化处理和指纹识别归属键的指纹识别家用键的方法，以防止介电构件的介电常数因指纹触摸区域和包括FPCB的指纹识别传感器之间的粘合力而改变，改进了ASIC，使得在其间隙中形成空气层或杂质层。构成：用于制造指纹识别家庭钥匙的方法包括以下步骤：通过固定指纹识别传感器的位置来模制第一注射成型产品（S100）; 以第二注塑产品覆盖指纹识别传感器的FPCB的上部（S200），将第二注塑产品成型为家用键形状; 并将第二注射成型品研磨在FPCB的上部，以保持预定的厚度（S300）。（附图标记）（AA）开始; （BB）结束; （S100）通过固定指纹识别传感器的位置进行第一注射成型; （S200）第二次注射成型，以便注射成型的产品覆盖指纹识别传感器的FPCB的上部; （S300）在FPCB的上部研磨注射成型品，以保持规定的厚度

3. 发明授权

KR101317246B1 휴대용 장치의 지문인식 홈키 제조방법 有权
标题翻译：手机设备制作手指识别方法
公开(公告)号：KR101317246B1
公开(公告)日：2013-10-10
申请号：KR1020130065114
申请日：2013-06-07
申请人： (주)드림텍
发明人： 이진성 , 김영호 , 정호철 , 정우람 , 신동욱 , 주원희
IPC分类号： B29C45/16 , B29C45/14
CPC分类号： B29D19/00 , B05D7/02 , B05D7/56 , B29C45/0001 , B29C45/0053 , B29C45/14065 , B29C45/14819 , B29C45/1671 , B29C2045/0079 , C09D175/04 , G06K9/00006
摘要： PURPOSE: A method for manufacturing home keys recognizing fingerprints of portable devices is provided to improve the quality when the home keys are manufactured by preventing primer coated in a gap between a first injection-molded product and a fingerprint recognizing sensor from being penetrated. CONSTITUTION: A method for manufacturing home keys recognizing fingerprints of portable devices comprises the following steps: preparing a fingerprint recognizing sensor (S100); molding a first injection-molded product equipped with an accommodating groove in which the fingerprint recognizing sensor is settled and forming holes vertically penetrating through the inner part of the accommodating groove (S200); settling the fingerprint recognizing sensor in the accommodating groove of the first injection-molded product (S300); and molding the home keys by using the first injection-molded product in which the fingerprint recognizing sensor is settled (S400). [Reference numerals] (AA) Start; (BB) End; (S100) Preparing a fingerprint recognizing sensor; (S200) Molding a first injection-molded product; (S300) Settling the fingerprint recognizing sensor in the accommodating groove of the first injection-molded product; (S400) Molding fingerprint recognizing home keys by second injection
摘要翻译：目的：提供一种识别便携式设备的指纹的家用键的制造方法，以通过防止第一注塑产品和指纹识别传感器之间的间隙中涂覆的底漆被穿透来制造家用键来提高质量。构成：用于制造识别便携式设备的指纹的家用键的方法包括以下步骤：制备指纹识别传感器（S100）; 对配备有指纹识别传感器的容纳槽的第一注射成型品进行成形，并形成垂直贯通所述容纳槽的内部的孔（S200）。在第一注塑产品的容纳槽中沉淀指纹识别传感器（S300）; 并通过使用其中指纹识别传感器稳定的第一注射成型产品来模制家用键（S400）。（附图标记）（AA）开始; （BB）结束; （S100）准备指纹识别传感器; （S200）成型第一注塑产品; （S300）将指纹识别传感器安置在第一注塑产品的容纳槽中; （S400）通过第二次注射成型指纹识别家庭钥匙

4. 发明公开

KR1020150101190A 초미세부품 부착용 지그 및 이를 이용한 초미세부품 부착방법 无效
标题翻译：用于微型组件的JIG和使用其的微型组件测试方法
公开(公告)号：KR1020150101190A
公开(公告)日：2015-09-03
申请号：KR1020140022576
申请日：2014-02-26
申请人： (주)드림텍
发明人： 정준진 , 주원희 , 김영호
IPC分类号： H05K13/04 , H05K3/30
摘要： 초미세부품 부착용 지그 및 이를 이용한 초미세부품 부착방법에 관하여 개시한다.
본 발명의 일 측면에 따르면 초미세부품을 기판 또는 기타 부착 대상체에 부착시키기 위해 이용되는 초미세부품 부착용 지그로서, 지그의 상면은 평탄하게 형성되며, 적어도 하나의 초미세부품이 지그의 상면을 통해 안착되도록 초미세부품에 대응하는 안착 홈을 구비하고, 안착 홈은 초미세부품의 부착부위 반대편 형상에 대응하여 형성되어 안착 홈 내부로 안착된 초미세부품의 부착부위가 지그의 상방을 향해 노출되도록 해주는 초미세부품 부착용 지그를 제공한다.
摘要翻译：公开了一种用于附着微型部件的夹具和使用其的微型部件的附接方法。根据本发明的一个方面，提供了用于附接微型部件的夹具。夹具的上侧是平的。形成与微型部件相对应的接收槽，以通过夹具的上侧容纳至少一个微型部件。接收凹槽通过对应于微组件的附接部分的相反形状而形成。由此，容纳在容纳槽中的微型部件的安装部露出于夹具的上侧。

5. 发明授权

KR101438796B1 모바일 기기의 하우징 일체형 ＵＳＢ 및 전원연결단자 모듈 제조 방법 有权
标题翻译： USB和连接终端用于移动设备的方法
公开(公告)号：KR101438796B1
公开(公告)日：2014-09-05
申请号：KR1020140034612
申请日：2014-03-25
申请人： (주)드림텍
发明人： 주원희 , 김영호
IPC分类号： H01R43/20 , H01R13/648
CPC分类号： H01R43/005 , H01R13/5216 , H01R2201/20
摘要： Disclosed are a method for manufacturing a housing integrated USB and power connection terminal module of a mobile device and a module structure thereof. Provided is the method for manufacturing the housing integrated USB and power connection terminal module according to an embodiment of the present invention which includes: a line open step of forming a cut line on the upper side of the housing to expose a connection part between a terminal formed on a printed circuit board (PCB) of the module and a terminal formed on the housing to the outside; a bonding step to spray bond on the connection part between the terminals by injecting the bond through the cut line; and a cover attaching step of attaching the cover to the upper side of the cut line after the bonding is completed.
摘要翻译：公开了一种用于制造移动设备的壳体集成USB和电源连接终端模块的方法及其模块结构。提供根据本发明的实施例的用于制造壳体集成USB和电源连接端子模块的方法，其包括：线路打开步骤，在壳体的上侧形成切割线，以暴露端子之间的连接部分形成在模块的印刷电路板（PCB）上，以及在外壳上形成的端子到外部; 键合步骤，通过将切割线注入粘合剂来喷射端子之间的连接部分上的粘结; 以及在接合完成之后将盖附接到切割线的上侧的盖附接步骤。

6. 发明授权

KR101317250B1 프라이머 침투 방지를 위한 휴대용 장치의 지문인식 홈키 제조방법 有权
标题翻译：制造手指识别手机的方法手机防止初始渗透
公开(公告)号：KR101317250B1
公开(公告)日：2013-10-10
申请号：KR1020130066421
申请日：2013-06-11
申请人： (주)드림텍
发明人： 이진성 , 김영호 , 정호철 , 정우람 , 신동욱 , 주원희
IPC分类号： B29C45/14 , B29C45/16
CPC分类号： B29D19/00 , B29C45/0001 , B29C45/14065 , B29C45/14819 , B29C45/1671 , B29C2045/14114 , B29K2023/12 , B29K2055/02 , B29K2067/003 , B29K2069/00 , G06K9/00006
摘要： PURPOSE: A method for manufacturing home keys recognizing fingerprints of portable devices is provided to prevent primer coated on an injection-molded product formed in a home key shape from overflowing to the outside and to prevent a primer layer from being partially dented by permeating into the injection-molded product. CONSTITUTION: A method for manufacturing home keys recognizing fingerprints of portable devices comprises the following steps: preparing a fingerprint recognizing sensor; molding a first injection-molded product equipped with an accommodating groove in which the fingerprint recognizing sensor is settled and molding holds vertically penetrating through the inner part of the accommodating groove of the first injection-molded product (S100); settling the fingerprint recognizing sensor in the accommodating groove; and secondly injecting the home key recognizing the fingerprints by using the first injection-molded product in which the fingerprint recognizing sensor is attached and forming the center of the upper surface of a second injection-molded product to be recessed in comparison with the circumference (S200). [Reference numerals] (AA) Start; (BB) End; (S100) First injection; (S200) Secondly injecting the home key recognizing the fingerprints so that the shape of the upper surface of a final injection-molded product where the fingerprint recognizing sensor is attached is recessed in comparison with the circumference; (S300) Spreading a primer; (S400) Forming a shielding layer; (S500) Painting; (S550) Urethane coating; (S600) UV top coating
摘要翻译：目的：提供一种识别便携式设备的指纹的家用键的制造方法，以防止涂覆在以家用钥匙形状形成的注射成型产品的底漆溢出到外部，并且通过渗透到底部层中来防止底漆层部分凹陷注塑产品。构成：用于制造识别便携式设备的指纹的家用键的方法包括以下步骤：准备指纹识别传感器; 模制第一注射成型产品，其中装备有指纹识别传感器沉降的容纳槽，并且模制件垂直地穿过第一注射成型产品的容纳槽的内部部分（S100）; 将所述指纹识别传感器固定在所述容纳槽中; 并且通过使用其中附着有指纹识别传感器的第一注射成型产品来识别指纹的家用键，并且与圆周相比形成凹陷的第二注塑产品的上表面的中心（S200 ）。（附图标记）（AA）开始; （BB）结束; （S100）第一次注射; （S200）第二，注意识别指纹的归属钥，使得附着有指纹识别传感器的最终注塑产品的上表面的形状与圆周相比凹陷; （S300）撒布底漆; （S400）形成屏蔽层; （S500）绘画; （S550）聚氨酯涂层; （S600）UV顶涂

7. 发明授权

KR101301063B1 고유전율 재료를 이용한 지문인식 홈키 제조방법 및 지문인식 홈키 구조 有权
标题翻译：使用高介电常数材料和指纹识别制造指纹识别家用键的方法首页其主要结构
公开(公告)号：KR101301063B1
公开(公告)日：2013-08-28
申请号：KR1020130079246
申请日：2013-07-05
申请人： (주)드림텍
发明人： 이진성 , 정우람 , 김종화 , 신동욱 , 주원희 , 정호철 , 김영호
IPC分类号： G06K9/00 , G06K9/20
CPC分类号： G06K9/0004 , G01R33/093
摘要： PURPOSE: A high-permittivity material-using fingerprint recognition home key producing method and a fingerprint recognition home key structure protect data stored in a mobile device from being leaked by securing a user authentication and security features for the mobile device. CONSTITUTION: A first injecting molded body is shaped with a fingerprint recognition sensor fixed (S100). A second injecting molded body with a home key shape is shaped to cover the upper part of a flexible printed circuit board (FPCB) of the fingerprint recognition sensor (S200). The second injecting molded body on the FPCB is grinded to a certain thickness (S300). A high-permittivity material is mixed with the second injecting molded body. The material is ceramic powder including at least one out of Al2O3, SiO2, BaO2, BaO, and TiO2 or an oxide with a perovskite structure including at least one out of a PA system, a PB system, and a potential metal. [Reference numerals] (AA) Start; (BB) End; (S100) Firstly inject with a fingerprint recognition sensor fixed; (S200) Secondly inject with a jetted material mixed with a high-permittivity material covering the upper part of an FPCB of the fingerprint recognition sensor; (S300) Grind the injection results on the FPCB to a certain thickness
摘要翻译：目的：通过确保移动设备的用户认证和安全功能，高介电常数材料使用指纹识别家庭密钥生成方法和指纹识别家庭密钥结构保护存储在移动设备中的数据不被泄漏。构成：第一注射成型体成形为具有固定的指纹识别传感器（S100）。具有主键形状的第二注射成型体被成形为覆盖指纹识别传感器的柔性印刷电路板（FPCB）的上部（S200）。将FPCB上的第二注射成型体研磨至一定厚度（S300）。将高介电常数材料与第二注射成型体混合。该材料是包括Al 2 O 3，SiO 2，BaO 2，BaO和TiO 2中的至少一种或具有包括PA系统，PB系统和潜在金属中的至少一种的钙钛矿结构的氧化物的陶瓷粉末。（附图标记）（AA）开始; （BB）结束; （S100）首先注入固定的指纹识别传感器; （S200）其次，以覆盖指纹识别传感器的FPCB的上部的高介电常数材料混合的喷射材料注入; （S300）将FPCB上的注射结果研磨到一定厚度

8. 发明授权

KR101454312B1 모바일 기기의 서브 기판 고정방법 및 그 고정구조 有权
标题翻译：连接子PCB的方法及其连接结构
公开(公告)号：KR101454312B1
公开(公告)日：2014-10-23
申请号：KR1020140033212
申请日：2014-03-21
申请人： (주)드림텍
发明人： 신기수 , 주원희 , 서정윤 , 임정욱 , 황대위 , 장은지 , 김영호
IPC分类号： H05K1/14
摘要： Disclosed are a method of fixing a sub printed circuit board (PCB) for a mobile device and a fixing structure thereof. According to one embodiment of the present invention, provided is a method of fixing a sub PCB for a mobile which includes: a main PCB preparing step of preparing a main PCB to at least one sub PCB; a reinforcement plate surface mounting step of surface mounting a reinforcement plate on a position on which the sub PCB is fixed; and a sub PCB fixing step of fixing the sub PCB to the main PCB while interposing the reinforcement plate. Additionally, in accordance to another embodiment of the present invention, there is a structure to fix a sub PCB for a mobile device which includes a reinforcement plate provided to a main PCB to at least one sub PCB. The reinforcement plate is surface mounted on a position on which the sub PCB is fixed, and the main PCB has a first screw through-hole formed on the position to which the sub PCB is fixed into which a coupling screw is inserted. The reinforcement plate is provided with a second screw through-hole which has a size and shape corresponding to those of the first screw through-hole and into which the coupling screw is inserted. The coupling screw sequentially passes through the sub PCB, the reinforcement plate, and the main substrate to couple the sub PCB, the reinforcement plate, and the main substrate to each other.
摘要翻译：公开了一种固定用于移动设备的副印刷电路板（PCB）及其固定结构的方法。根据本发明的一个实施例，提供了一种固定用于移动设备的子PCB的方法，其包括：主PCB准备步骤，用于将主PCB准备到至少一个子PCB; 加强板表面安装步骤，其将辅助板表面安装在所述辅助PCB固定的位置上; 以及子PCB固定步骤，在插入加强板的同时将副PCB固定到主PCB。另外，根据本发明的另一实施例，存在固定用于移动设备的子PCB的结构，该移动设备包括设置在主PCB上的加强板至少一个子PCB。加强板表面安装在子PCB固定的位置上，主PCB具有形成在固定有辅助PCB的位置上的第一螺钉通孔，其中插入有联接螺钉。加强板设置有第二螺钉通孔，其具有与第一螺钉通孔相对应的尺寸和形状，并且联接螺钉插入该第二螺钉通孔中。联接螺钉依次通过副PCB，加强板和主基板，以将副PCB，加强板和主基板彼此连接。

9. 发明授权

KR101344221B1 베젤링의 표면실장이 가능한 지문인식 홈키 제조방법 有权
标题翻译：制造指纹识别的方法主要是表面加工贝克尔环
公开(公告)号：KR101344221B1
公开(公告)日：2013-12-23
申请号：KR1020130106976
申请日：2013-09-06
申请人： (주)드림텍
发明人： 주원희 , 김영호
IPC分类号： G06K9/00 , H04B1/40
CPC分类号： H04M1/23 , G06K9/00006
摘要： The manufacturing method for fingerprint recognition home key capable of mounting a bezel ring on the surface according to the embodiment of the present invention includes a step of preparing for a printed circuit board, a step of mounting a finger print recognition sensor of a home key shape on the surface to the upper portion of the printed circuit board, a step of preparing for coating of the bezel ring forming a functional plating layer in the rear side of the bezel ring equipped in the finger print recognition sensor, and a step of mounting the bezel ring to the functional plating layer which is made to face opposite to the printed circuit board in order to mount the bezel ring on the surface. [Reference numerals] (S100) Plate bezel ring and prepare;(S200) Bezel ring surface mounting
摘要翻译：根据本发明的实施例的能够将表圈安装在表面上的指纹识别家用键的制造方法包括：准备印刷电路板的步骤，安装家用键形状的指纹识别传感器的步骤在印刷电路板的上表面的表面上，准备在配备在指纹识别传感器中的边框环的后侧形成功能性镀层的表圈环的涂布步骤，以及安装表圈环到功能镀层，其形成为与印刷电路板相对，以将表圈安装在表面上。（附图标记）（S100）挡板环准备;（S200）挡板环表面安装

10. 发明授权

KR101324135B1 돔 시트 및 테이프 부재의 부착 정밀도가 향상된 홈키 모듈 제조방법 有权
标题翻译：制造家用模块的方法，用于改善圆顶片和胶带的精度
公开(公告)号：KR101324135B1
公开(公告)日：2013-11-01
申请号：KR1020130113738
申请日：2013-09-25
申请人： (주)드림텍
发明人： 정준진 , 주원희 , 김영호
IPC分类号： H01H11/00 , H01H13/14
摘要： PURPOSE: A dome sheet and a manufacturing method of a home key module with precision improvement in a tape material are provided to reduce work deviation by automating a process. CONSTITUTION: A jig, which is equipped with an accommodating chamber, is prepared (S100). A first array tape adheres to the jig (S300). Multiple home key modules are mounted on multiple tape members (S400). Multiple dome sheets adhere to the multiple home key modules (S600). The multiple home key modules and the multiple dome sheets are compressed at the same time (S700). [Reference numerals] (S100) Jig is prepared; (S200) First array tape is produced; (S300) First array tape is attached to the jig; (S400) Home key module is mounted on the upper part of the attached first array tape; (S500) Second array tape is produced; (S600) Dome sheets is attached; (S700) Home key module and the dome sheet are compressed; (S800) Protection tape is removed
摘要翻译：目的：提供一种具有精密改善带状材料的圆顶板和家用键模块的制造方法，以通过自动化工艺来减少工作偏差。构成：配备有容纳室的夹具（S100）。第一阵列带粘附到夹具上（S300）。多个主键模块安装在多个磁带组件上（S400）。多个穹顶板粘贴到多个家用键模块（S600）。同时压缩多个主键模块和多个圆顶表（S700）。 [附图标记]（S100）准备夹具; （S200）生产第一阵列胶带; （S300）第一阵列带附接到夹具; （S400）家用键模块安装在所附接的第一阵列带的上部; （S500）生产第二阵列胶带; （S600）连接圆顶片; （S700）主键模块和圆顶表压缩; （S800）保护带被拆除

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