会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明公开
    • 아크 증발기, 아크 증발기 구동방법 및 이온도금 장치
    • ARC蒸发器,驱动ARC蒸发器的方法和离子镀膜设备
    • KR1020020024790A
    • 2002-04-01
    • KR1020010058939
    • 2001-09-24
    • 신메이와 인더스트리즈,리미티드시티즌 도케이 가부시키가이샤
    • 타키가와,시로우노세,코우이치코이주미,야수히로호리,타카노부미야,유키오
    • C23C16/503
    • C23C16/515C23C14/325C23C14/545C23C16/517
    • PURPOSE: An arc evaporator, a method for driving the arc evaporator, and an ion plating apparatus are provided that are capable of preventing a surface of a thin film from being roughened when forming the thin film using a low melting point material as a cathode material. CONSTITUTION: An arc evaporator comprises an anode; an evaporation source electrode(2) as a cathode; and a current control unit(3) for supplying an AC square wave arcing current across the anode and the evaporation source electrode(2). In a method for driving an arc evaporator which has an anode, an evaporation source electrode as a cathode, and a current control unit for supplying an AC square wave arcing current across the anode and the evaporation source electrode, the method comprises controlling: at least one of a frequency of the arcing current, a ratio of a positive value period to a negative value period in a cycle, and a ratio of an absolute value of a positive value to an absolute value of a negative value in the cycle. The ion plating apparatus comprises a vacuum chamber(5); a substrate holder(6) provided in the vacuum chamber(5) for holding a substrate(7); and an arc evaporator(1) that uses an AC square wave arcing current to evaporate a cathode material in the vacuum chamber.
    • 目的:提供一种电弧蒸发器,用于驱动电弧蒸发器的方法和离子镀装置,其能够防止当使用低熔点材料作为阴极材料形成薄膜时薄膜的表面变粗糙 。 构成:电弧蒸发器包括阳极; 作为阴极的蒸发源电极(2) 以及用于在阳极和蒸发源电极(2)上提供AC方波电弧电流的电流控制单元(3)。 在用于驱动具有阳极的电弧蒸发器,作为阴极的蒸发源电极和用于在阳极和蒸发源电极上提供AC方波电弧电流的电流控制单元的方法中,所述方法包括以下步骤:至少控制 电弧电流的频率中的一个,循环中的正值周期与负值周期的比率,以及周期中正值的绝对值与负值的绝对值的比。 离子镀装置包括真空室(5); 设置在所述真空室(5)中用于保持基板(7)的基板保持器(6); 以及使用AC方波电弧电流来蒸发真空室中的阴极材料的电弧蒸发器(1)。
    • 10. 发明公开
    • 진공처리용 챔버
    • 真空处理室
    • KR1020080038271A
    • 2008-05-06
    • KR1020077019717
    • 2006-07-21
    • 신메이와 인더스트리즈,리미티드
    • 이와사키,야스쿠니후쿠다,오시미츠미야자키,오사무
    • C23C14/56C23C16/44
    • C23C14/564B01J3/006
    • A chamber for vacuum treatment enabling the simplification of the arrangement structure of a flow passage for cooling. The chamber for vacuum treatment comprises a plurality of wall members (1, 2, 3, 4, 11, 12, 13). Parts of the surfaces of the wall members (1, 2, 3, 4, 11, 12, 13) form bonded surfaces, and the plurality of wall members (1, 2, 3, 4, 11, 12, 13) are bonded to each other through bonding parts (10) formed by bonding airtight the bonded surfaces to each other to form a chamber body (100). At least parts of the bonding parts (10) are the bonding parts (10) with built-in spaces in which clearances (30, 31) extending along the bonded surfaces are formed in the bonded surfaces, and the peripheries of the bonded surfaces are bonded airtight to each other by welding.
    • 用于真空处理的室,能够简化用于冷却的流动通道的布置结构。 用于真空处理的室包括多个壁构件(1,2,3,4,11,12,13)。 壁构件(1,2,3,4,11,12,13)的表面的一部分形成接合表面,并且多个壁构件(1,2,3,4,11,12,13)被接合 通过将粘合表面彼此密封形成的接合部分(10)彼此形成,以形成室主体(100)。 接合部(10)的至少一部分是具有内置空间的接合部(10),其中,在接合面上形成有沿接合面延伸的间隙(30,31),接合面的周边 通过焊接彼此密封。