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    • 53. 发明授权
    • 도전입자 및 그 제조방법
    • 导电颗粒及其制造方法相同
    • KR101443347B1
    • 2014-10-02
    • KR1020130140447
    • 2013-11-19
    • 덕산하이메탈(주)
    • 김철희송재형손원일추용철
    • H01B5/00H01B13/00
    • The present invention relates to a conductive particle including: a resin particle; a first plating layer provided on a surface of the resin particle; and a second plating layer provided on the first plating layer having a protrusion on an outer surface thereof, wherein the protrusion covers 93-100% of an area of the second plating layer, and includes: a first layer having a length of 100-300 nm and a second protrusion having a length less than 100 nm; the first protrusion covers 70-90% of the area of the second plating layer; and the second protrusion covers 10-30% of the area of the second plating layer. The protrusion is equally divided in a longitudinal direction into a base part, an intermediate part, and an end part; and if A is an average diameter of the base part, B is an average diameter of the intermediate part, and C is an average diameter of the end part, the relationship between A, B and C is A > B > C.
    • 导电颗粒本发明涉及一种导电颗粒,包括:树脂颗粒; 设置在树脂颗粒的表面上的第一镀层; 以及设置在所述第一镀层上的在其外表面上具有突起的第二镀层,其中所述突起覆盖所述第二镀层的面积的93-100%,并且包括:第一层,其长度为100-300 nm和长度小于100nm的第二突起; 第一突起覆盖第二镀层的面积的70-90%; 并且第二突起覆盖第二镀层的面积的10-30%。 突起在纵向上等分成基部,中间部和端部; 如果A是基部的平均直径,B是中间部的平均直径,C是端部的平均直径,则A,B和C之间的关系为A> B> C。
    • 56. 发明授权
    • 도전입자, 이를 포함하는 도전 재료
    • 导电颗粒,其制造方法和包括其的导电材料
    • KR101298101B1
    • 2013-08-20
    • KR1020120153166
    • 2012-12-26
    • 덕산하이메탈(주)
    • 추용철김경흠정순호박경용손현종이진호김종태
    • H01B1/22H01B5/00
    • PURPOSE: A conducting particle is provided to prevent the malfunction of a circuit due to the sudden increase of resistance and the connection failure of the circuit by controlling fracture strain and compression strain when an external force is applied to the conducting particle. CONSTITUTION: A conducting particle has a resin particle and a coating layer which is located on the resin particle and has protrusions on the surface thereof. The conducting particle satisfies formula 1: 20
    • 目的:提供导电颗粒,以防止当外力施加到导电颗粒时通过控制断裂应变和压缩应变由于电阻的突然增加和电路的连接故障而导致电路的故障。 构成:导电粒子具有树脂粒子和位于树脂粒子上并在其表面上具有突起的涂层。 导电粒子满足式1:20 <=(Sf / Sc)/ D * 100 <= 50。 在公式1中,Sf表示施加引发导电粒子的断裂的力(F2,mN)时的应变(微米) 当施加与导电颗粒的直径相同的力(F1,mN)时,Sc是应变(微米); D是导电粒子的平均粒径(微米)。 涂层的厚度为30〜300nm,突出部的高度为50〜500nm。 (附图标记)(AA)断裂起点; (BB)压缩变形(S_c); (CC)断裂变形(S_f); (F1)压缩变形载荷(mN); (F2)断裂变形载荷(mN)