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    • 34. 发明公开
    • 반도체 소자
    • 半导体器件
    • KR1020130021771A
    • 2013-03-06
    • KR1020110084234
    • 2011-08-23
    • 현대자동차주식회사
    • 이용성홍경국이종석
    • H01L29/78H01L21/336
    • H01L29/66287H01L21/02293H01L21/20H01L29/7802
    • PURPOSE: A semiconductor device is provided to reduce the on resistance of a device by preventing the diffusion of a depletion layer generated in a pn junction through a depletion diffusion preventing layer on the side of a trench gate. CONSTITUTION: An electric field dispersion layer(61) is formed on the lower side of a trench source(60). The electric field dispersion layer is formed by implanting P-type ions and disperses electric field concentrated on a lower oxidation layer(59). A depletion diffusion preventing layer(62) is formed on the upper side of an N- epitaxial layer(3). The depletion diffusion preventing layer prevents the diffusion of the depletion layer in a pn junction on the lower side of a trench source to affect a current flow. The depletion diffusion preventing layer forms an N+ region by an epitaxial growth method. [Reference numerals] (2) N+ substrate; (3) N- epitaxial layer
    • 目的:提供一种半导体器件,以通过防止在pn结中产生的耗尽层扩散通过沟槽栅极侧的耗尽扩散防止层来降低器件的导通电阻。 构成:在沟槽源(60)的下侧形成电场分散层(61)。 通过注入P型离子并将电场分散在下部氧化层(59)上形成电场分散层。 耗尽扩散防止层(62)形成在N-外延层(3)的上侧。 耗尽扩散防止层防止在沟槽源的下侧的pn结中的耗尽层的扩散以影响电流。 耗尽扩散防止层通过外延生长法形成N +区域。 (附图标记)(2)N +基板; (3)N-外延层
    • 35. 发明公开
    • 압전체를 이용하는 전원발생장치
    • 发电机使用压电材料
    • KR1020080051526A
    • 2008-06-11
    • KR1020060122827
    • 2006-12-06
    • 현대자동차주식회사
    • 이용성
    • H02N2/00H02N2/10
    • H02N2/18H01L41/1136
    • A power generator using a piezoelectric body is provided to improve durability by including receiving units to prevent damage of the piezoelectric bodies through restriction of movement of mass bodies. A power generator includes a positive terminal(102), a negative terminal(104), a plurality of piezoelectric bodies(100), and a plurality of mass bodies(106). The negative terminal surrounds the positive terminal without the contact with the positive terminal. The plurality of piezoelectric bodies are radially formed around the positive and negative terminals. One ends of the piezoelectric bodies are connected to the positive and negative terminals, and the other ends of the piezoelectric bodies are not connected to the positive and negative terminals. The plurality of mass bodies are connected to the other ends of the plurality of piezoelectric bodies respectively. The power generator further includes a case(110) with receiving units(108) to receive the mass bodies.
    • 提供一种使用压电体的发电机,通过包括接收单元来提高耐久性,以通过限制质量体的运动来防止压电体损坏。 发电机包括正极端子(102),负极端子(104),多个压电体(100)和多个质量体(106)。 负极端子围绕正极端子而不与正极端子接触。 多个压电体围绕正端子和负端子径向地形成。 压电体的一端与正极端子和负极端子连接,压电体的另一端不与正极端子和负极端子连接。 多个质量体分别连接到多个压电体的另一端。 发电机还包括具有用于接收质量体的接收单元(108)的壳体(110)。
    • 36. 发明公开
    • 교차 접합된 SOI 웨이퍼를 이용한 실리콘 부양구조물의제조방법
    • 在绝缘体上使用硅制造硅离子结构的方法
    • KR1020070014290A
    • 2007-02-01
    • KR1020050068786
    • 2005-07-28
    • 현대자동차주식회사
    • 이용성
    • H01L27/12
    • B81C1/0015B81C1/00349B81C1/00388B81C1/00436
    • A method for fabricating a silicon floating structure using a cross-bonded SOI wafer is provided to guarantee a gap of at least 50 microns between a silicon structure and a lower handling wafer by embodying a silicon structure by a DRIE(deep reactive ion etching) process performed on a process wafer and by protecting the sidewall surface of the silicon structure by an oxide layer. Each oxide layer is grown on a process wafer(11) and a handling wafer(12). The process wafer is bonded to the handling wafer. The process wafer is adjusted in thickness according to the thickness of a silicon structure to be fabricated. A mask is deposited on the upper surface of the process wafer. A photolithography process is performed to generalize a pattern. A PR(photoresist) pattern is used to pattern a mask. The process wafer is etched by the patterned mask to define the silicon structure. An oxide layer is grown to protect the sidewall surface of the silicon structure. A silicon oxide layer(14) exposed by etching the silicon structure is removed. The handling wafer is etched to float the silicon structure. The oxide layer surrounding the silicon structure is removed. The mask has sufficient selectivity and thickness so that the process wafer and the silicon oxide layer can be etched by a DRIE process.
    • 提供使用交叉键合的SOI晶片制造硅浮动结构的方法,以通过DRIE(深反应离子蚀刻)工艺来体现硅结构来确保硅结构和下处理晶片之间的至少50微米的间隙 并且通过氧化物层保护硅结构的侧壁表面。 每个氧化物层在处理晶片(11)和处理晶片(12)上生长。 处理晶片结合到处理晶片。 根据要制造的硅结构的厚度来调整工艺晶片的厚度。 掩模沉积在处理晶片的上表面上。 执行光刻处理以概括图案。 PR(光致抗蚀剂)图案用于对掩模进行图案化。 通过图案化掩模蚀刻工艺晶片以限定硅结构。 生长氧化物层以保护硅结构的侧壁表面。 去除通过蚀刻硅结构而暴露的氧化硅层(14)。 蚀刻处理晶片以漂浮硅结构。 去除围绕硅结构的氧化物层。 掩模具有足够的选择性和厚度,使得可以通过DRIE工艺来蚀刻工艺晶片和氧化硅层。
    • 37. 发明公开
    • SOI 기판상에서 실리콘 부양구조물의 제조방법
    • 在绝缘体上使用硅制造硅离子结构的方法
    • KR1020070014288A
    • 2007-02-01
    • KR1020050068782
    • 2005-07-28
    • 현대자동차주식회사
    • 이용성
    • H01L27/12
    • B81C1/0015B81C1/00349B81C1/00388B81C1/00436
    • A method for fabricating a silicon floating structure on an SOI substrate is provided to guarantee a gap of at least 50 microns between a silicon structure and a lower handling wafer by preventing an upper vibration structure from being etched and by etching only the lower handling wafer. An SOI wafer is prepared. A photolithography process is performed to generalize a pattern. A PR(photoresist) pattern is used to pattern a mask. A process wafer(11) is etched by using the patterned mask to define a silicon structure. A polymer layer deposited on the wall of the silicon structure is eliminated in a DRIE(deep reactive ion etching) process for forming a smooth uniform oxide layer. An oxide layer is formed to protect the lateral surface of the silicon structure. A silicon oxide layer(14) exposed by etching the silicon structure is removed. A part of a handling wafer(12) to which the same shape as the silicon structure is projected is eliminated. The oxide layer surrounding the silicon structure is removed.
    • 提供了一种在SOI衬底上制造硅浮动结构的方法,以通过防止上部振动结构被蚀刻并且仅蚀刻下部处理晶片来确保硅结构和下部处理晶片之间的至少50微米的间隙。 准备SOI晶片。 执行光刻处理以概括图案。 PR(光致抗蚀剂)图案用于对掩模进行图案化。 通过使用图案化掩模蚀刻工艺晶片(11)以限定硅结构。 沉积在硅结构的壁上的聚合物层在用于形成平滑的均匀氧化物层的DRIE(深反应离子蚀刻)工艺中被消除。 形成氧化物层以保护硅结构的侧表面。 去除通过蚀刻硅结构而暴露的氧化硅层(14)。 消除与硅结构相同形状的处理晶片(12)的一部分。 去除围绕硅结构的氧化物层。
    • 38. 发明公开
    • 저 전기비 저항을 갖는 세라믹 PTC 조성물
    • 具有低电阻率的陶瓷PTC(积极温度系数)组成
    • KR1020030092720A
    • 2003-12-06
    • KR1020020030494
    • 2002-05-31
    • 현대자동차주식회사
    • 이용성
    • C04B35/468H01C7/02
    • C04B35/468C04B2111/90C04B2235/3236H01C7/02H05B3/141
    • PURPOSE: Provided is a ceramic PTC composition having a low electrical resistivity at a room temperature and a decreased initial inrush current suitable to be used in a material for automobile heater. CONSTITUTION: The ceramic PTC composition having a low electrical resistivity is characterized by comprising 64-82 mol% of BaTiO3, 0.25-0.4 mol% of Y2O3, 10-15 mol% of CaTiO3, 0.01-0.05 mol% of MnO2, 1-1.5 mol% of SiO2, 5-10 mol% of SrTiO3 and 0.5-2.5 mol% of PbTiO3 to which 0.5-2.5 mol% of MoSi2 is added. Alternatively, the ceramic PTC composition comprises 3-5 mol% of MoSi2 instead of 0.5-2.5 mol% of PbTiO3 and 0.5-2.5 mol% of MoSi2.
    • 目的:提供一种在室温下具有低电阻率和适用于汽车加热器材料的初始浪涌电流降低的陶瓷PTC组合物。 构成:具有低电阻率的陶瓷PTC组合物的特征在于包含64-82mol%的BaTiO 3,0.25-0.4mol%的Y 2 O 3,10-15mol%的CaTiO 3,0.01-0.05mol%的MnO 2,1-1.5 SiO 2的摩尔%,SrTiO 3的5-10摩尔%和添加0.5〜2.5摩尔%的MoSi 2的0.5〜2.5摩尔%的PbTiO 3。 或者,陶瓷PTC组合物包含3-5mol%的MoSi 2代替0.5-2.5mol%的PbTiO 3和0.5-2.5mol%的MoSi 2。
    • 40. 发明公开
    • 자동차용 아웃 사이드 미러 가열 장치
    • 用于加热车辆外部镜子的装置
    • KR1020010066424A
    • 2001-07-11
    • KR1019990068140
    • 1999-12-31
    • 현대자동차주식회사기아자동차주식회사
    • 이용성
    • B60R1/06
    • PURPOSE: A heater of an outside mirror for a vehicle is provided to quicken a heating speed of the outside mirror and to reduce a cost of the heater. CONSTITUTION: A heater of an outside mirror comprises a chrome(53) coated in the rear face of a mirror(52) for reflecting; many electrodes(1) arranged sequentially for uniformly feeding current into the chrome(53) and fed positive and negative current alternatively; a temperature read switch(2) to detect a temperature of the chrome(53); and a relay to supply/isolate current into the chrome(53) by temperature read switch(2). A switch is installed between a battery and the electrodes to turn on/off the heater.
    • 目的:提供一种用于车辆的外部反射镜的加热器,以加速外部反射镜的加热速度并降低加热器的成本。 构成:外部反射镜的加热器包括涂覆在反射镜(52)的后表面中的铬(53),用于反射; 依次布置许多电极(1),以均匀地将电流馈送到铬(53)中,并交替地馈送正和负电流; 用于检测铬(53)的温度的温度读取开关(2); 以及通过温度读取开关(2)将电流供应/隔离到铬(53)中的继电器。 在电池和电极之间安装开关以打开/关闭加热器。