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    • 3. 发明公开
    • 촉각센서의 제조 방법
    • 手机传感器制造方法及手机传感器信号处理装置
    • KR1020080020281A
    • 2008-03-05
    • KR1020060083584
    • 2006-08-31
    • 한국표준과학연구원
    • 김종호권현준박연규김민석강대임최재혁
    • G01L1/18G01L1/16
    • G01L1/18B81C1/00349C09J7/20H05K3/1216
    • A manufacturing method of a tactile sensor is provided to reduce manufacturing costs of the tactile sensor by attaching an upper plate to a lower plate with an adhesive tape, and a signal processing apparatus for the tactile sensor is provided to detect output of the tactile sensor accurately. A manufacturing method of a tactile sensor comprises the steps of: forming a coating layer(102) and a metal layer(103) on a macromolecule film to predetermined thickness and manufacturing an upper plate of the tactile sensor by forming a resistor(104) on the metal layer; manufacturing a lower plate of the tactile sensor by forming a spacer of predetermined thickness on the metal layer except the resistor; and manufacturing the tactile sensor by bonding so as to allow the resistor of the upper plate to be opposite to the resistor of the lower plate.
    • 提供了一种触觉传感器的制造方法,以通过用胶带将上板附接到下板来降低触觉传感器的制造成本,并且提供用于触觉传感器的信号处理装置以精确地检测触觉传感器的输出 。 触觉传感器的制造方法包括以下步骤:在大分子膜上形成预定厚度的涂层(102)和金属层(103),并通过在电极(104)上形成电阻器(104)来制造触觉传感器的上板 金属层; 通过在电阻器之外的金属层上形成预定厚度的间隔来制造触觉传感器的下板; 并通过接合制造触觉传感器,以便允许上板的电阻器与下板的电阻器相反。
    • 7. 发明授权
    • 폴리에틸렌 글라이콜을 이용한 나노구조물의 표면 개질 및 이를 이용한 나노플루이딕 장치의 제작
    • 使用聚(乙二醇)制备纳米结构的纳米结构的表面改性和使用其制备纳米液体装置
    • KR101372285B1
    • 2014-03-19
    • KR1020130041734
    • 2013-04-16
    • 한국과학기술연구원
    • 이상엽맹준호김세훈
    • B82B3/00B29C59/02
    • B81C1/00349B81C1/00444B82B3/00
    • A method of manufacturing a nanostructure can comprise: a step of binding layer comprising polyethylene glycol (PEG) coupled with a function group on the upper substrate formed with polymer material; and a step of binding for binding the upper substrate with the lower substrate using the binding layer. At this time, a nanochannel can be defined by a dented area between the upper substrate and the lower substrate. Coating the surface of the upper substrate with PEG before binding the upper substrate with the lower substrate allows the coating of the surface of the nanochannel and the binding between the substrates to be performed in one process, and allows biofouling with respect to the surface to be prevented by reducing non-specific bindings while maintaining hydrophilicity of the surface of the nanochannel, as well as allows electroosmotic flow within the nanochannel to be reduced.
    • 一种制造纳米结构的方法可以包括:在由聚合物材料形成的上基材上的包含与官能团偶联的聚乙二醇(PEG)的结合层的步骤; 以及使用所述粘合层将所述上基板与所述下基板结合的步骤。 此时,可以通过上基板和下基板之间的凹陷区域来限定纳米通道。 在将上基板与下基板结合之前,用PEG涂覆上基板的表面允许在一个工艺中进行纳米通道的表面的涂覆和基板之间的结合,并允许相对于表面的生物结垢 通过在保持纳米通道的表面的亲水性的同时减少非特异性结合来防止,并且允许降低纳米通道内的电渗流。
    • 9. 发明公开
    • 마이크로전자기계적 구조물의 캡슐화 방법
    • 微电子结构的封装工艺
    • KR1020010051498A
    • 2001-06-25
    • KR1020000065928
    • 2000-11-07
    • 제이디에스 유니페즈 코오포레이션
    • 우드로버트엘.더들리부르스더블유.
    • B81B7/02
    • B81C1/00333B81C2203/0136B81B7/0032B81B3/0018B81B7/02B81B2201/01B81B2201/0242B81B2201/03B81C1/00349B81C1/00476
    • PURPOSE: A method for encapsulating microelectromechanical(MEMS) structures is provided which the MEMS structures are formed on a substrate and encapsulated prior to packaging thereof. CONSTITUTION: A MEMS microrelay(200) is typically formed on a substrate(210) and comprises, for example, an active actuator(220), a relay structure(230), and a passive actuator(240). In some cases, the structures forming the microrelay further include associated bond pads(250) at which the necessary electrical connections to the structures are established.The bonding pads forms electrical contact points providing the necessary electrical power for the active actuator or the connections to the relay structure. Typically, the operation of a MEMS device, such as the MEMS microrelay described, requires mechanical motion of components of the microrelay for the device to operate as intended.
    • 目的:提供一种用于封装微机电(MEMS)结构的方法,其中MEMS结构形成在衬底上并在其包装之前被封装。 构成:MEMS微型继电器(200)通常形成在衬底(210)上,并且包括例如主动致动器(220),中继结构(230)和无源致动器(240)。 在一些情况下,形成微型继电器的结构还包括相关联的接合焊盘(250),在该接合焊盘处形成与结构的必要的电连接。接合焊盘形成电接触点,为主动致动器提供必要的电力或者连接至 继电器结构。 通常,诸如所描述的MEMS微型继电器之类的MEMS器件的操作需要微型继电器的部件的机械运动,以使器件根据预期进行操作。