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11. 发明授权

KR101301182B1 엘이디 검사방법 失效
标题翻译： LED测试方法
公开(公告)号：KR101301182B1
公开(公告)日：2013-09-10
申请号：KR1020127016788
申请日：2009-12-05
申请人： 광전자정밀주식회사
发明人： 박성림 , 이현희
IPC分类号： G01R31/26 , H01L21/66 , G06T7/00 , H01L33/48
CPC分类号： G01R31/2635
摘要： 본 발명은 엘이디에 대한 검사속도를 향상시키고, 검사의 정확성을 높일 수 있으며, 상기 엘이디를 검사하기 위하여 상기 엘이디가 장착된 엘이디 모듈을 정렬할 필요가 없는 엘이디 검사방법을 제공하는 것이다.
이를 위하여, 본 발명은 촬영유닛을 사용하여 엘이디 모듈에서 발광되는 빛을 촬영하여 상기 엘이디 모듈에 대한 이미지를 생성하는 이미지 생성 단계, 상기 촬영유닛 상의 기준좌표축을 기준으로 상기 엘이디 모듈의 이미지에 대한 위치를 파악하는 상대위치 파악 단계, 상기 엘이디 모듈의 이미지 중에서 각각의 엘이디가 위치하는 지점을 포함하는 분석대상영역의 이미지를 추출하는 이미지 추출 단계, 상기 분석대상영역의 이미지를 영상처리하여 상기 엘이디의 광특성값을 획득하는 광특성값 획득 단계, 그리고 상기 광특성값을 바탕으로 상기 엘이디의 품질여부를 판단하는 품질 판단 단계를 포함하는 엘이디 검사방법을 제공한다.

12. 发明公开

KR1020130064010A 제품 웨이퍼 특성을 기초로 반도체 발광 디바이스를 특성분석하는 방법 审中-实审
标题翻译：基于产品波形特性的半导体发光器件表征方法
公开(公告)号：KR1020130064010A
公开(公告)日：2013-06-17
申请号：KR1020120129611
申请日：2012-11-15
申请人： 울트라테크 인크.
发明人： 하우리루크앤드류엠. , 오웬데이비드
IPC分类号： H01L33/00 , H01L33/02
CPC分类号： G01R31/2635
摘要： PURPOSE: A method for characterizing a semiconductor light emitting device based on a product wafer characteristic is provided to predict the irradiation wavelength of LED structures formed in the device layer of product wafer. CONSTITUTION: A relation between device-layer stress and actual irradiation wavelength is established(302). The curvature change of a product wafer is measured based on a substrate curvature measurement value(304). The device-layer stress of the product wafer is calculated by using a stoney equation(306). The device structure on the product wafer is related to the calculated device-layer stress(308). The actual irradiation wavelength is related to various dies based on the device-layer stress(310). At least one process variable is adjusted in order to reduce the change of the irradiation wavelengths of the dies(312). [Reference numerals] (302) Establish a relation between device-layer stress S(x,y) and irradiation wavelength λ_E(x,y) for a die formed from a device structure on a product wafer; (304) Measure the curvature change ΔC(x,y) of the product wafer based on substrate curvature measurement after and before forming a device; (306) Calculate the device-layer stress S(x,y) of the product wafer by using a stoney equation based on the measured curvature change ΔC(x,y); (308) Connect (x,y) positions of the device structure on the product wafer with the dies to the calculated device-layer stress S(x,y); (310) Connect the actual irradiation wavelength λ_E based on the device-layer stress value S(x,y) for each relation in step 302; (312) Adjust at least one process variable to form the device structure based on the result of step 310
摘要翻译：目的：提供一种基于产品晶片特性来表征半导体发光器件的方法，以预测在产品晶片的器件层中形成的LED结构的照射波长。构成：器件层应力与实际照射波长之间的关系成立（302）。基于基板曲率测量值（304）测量产品晶片的曲率变化。产品晶片的器件层应力通过使用固态方程（306）计算。产品晶片上的器件结构与计算出的器件层应力有关（308）。实际辐射波长与器件层应力（310）相关的各种模具有关。调整至少一个过程变量以减少模具（312）的照射波长的变化。（302）建立由产品晶片上的器件结构形成的管芯的器件层应力S（x，y）和照射波长λ_E（x，y）之间的关系; （304）在形成装置之前和之后，基于基板曲率测量来测量产品晶片的曲率变化ΔC（x，y）; （306）通过使用基于测量的曲率变化ΔC（x，y）的稳态方程来计算产品晶片的器件层应力S（x，y）; （308）将产品晶片上的器件结构的位置（x，y）与模具连接到计算的器件层应力S（x，y）; （310）在步骤302中，根据各关系的器件层应力值S（x，y），连接实际照射波长λ_E，（312）基于步骤310的结果调整至少一个过程变量以形成设备结构

13. 发明授权

KR101182822B1 발광소자 검사장치 및 방법 失效
标题翻译：检测装置和发光装置的方法
公开(公告)号：KR101182822B1
公开(公告)日：2012-09-13
申请号：KR1020110028209
申请日：2011-03-29
申请人： 삼성전자주식회사
发明人： 지원수 , 박대서 , 김추호
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： G01R31/2635 , G01R31/024 , G01R31/302
摘要： PURPOSE: A light emitting diode inspection device and method are provided to inspect electric characteristics, optical characteristics and the defect of appearance state of a light emitting diode. CONSTITUTION: A probing unit(400) comprises a table in which a light emitting diode is loaded and a probe which supplies a current to the light emitting diode. An image acquiring unit(200) obtains an image of the light emitting diode. A determining unit(300) detects whether a light emitting cell emits light or not from luminance information of the image. The determining unit determines the open/short failure of the light emitting diode. A measuring unit(100) comprises an integrating sphere(120) and a detector(110). The integrating sphere collects light emitted from the light emitting diode by being placed on the upper side of the table. The detector detects optical characteristic of the light emitting diode from the integration sphere.
摘要翻译：目的：提供一种发光二极管检查装置和方法来检测发光二极管的电特性，光学特性和出现状态的缺陷。构成：探测单元（400）包括其中装载有发光二极管的表和向该发光二极管提供电流的探针。图像获取单元（200）获得发光二极管的图像。确定单元（300）根据图像的亮度信息检测发光单元是否发光。确定单元确定发光二极管的开/短故障。测量单元（100）包括积分球（120）和检测器（110）。积分球通过放置在桌子的上侧来收集从发光二极管发射的光。检测器从积分球检测发光二极管的光学特性。

14. 发明公开

KR1020120098830A 엘이디 검사방법 失效
标题翻译： LED测试方法
公开(公告)号：KR1020120098830A
公开(公告)日：2012-09-05
申请号：KR1020127016788
申请日：2009-12-05
申请人： 광전자정밀주식회사
发明人： 박성림 , 이현희
IPC分类号： G01R31/26 , H01L21/66 , G06T7/00 , H01L33/48
CPC分类号： G01R31/2635
摘要： PURPOSE: An LED(Light Emitting Diode) inspection method is provided to increase the accuracy of an inspection and inspection speed using an optical characteristic value. CONSTITUTION: An image for an LED module is created by capturing light emitted from the LED module(S10). A location for the image is obtained based on a reference coordinate axis of a capturing unit(S20). The coordinate of the LED is converted based on the reference coordinate axis(S30). An image of the analysis target area including an LED location position is extracted from the image(S40). The optical characteristic value of the LED is obtained by processing the image of the analysis target area(S50). The quality of the LED is determined based on the optical characteristic value(S60). [Reference numerals] (S10) Image creation step; (S20) Opponent location grasping step; (S30) Coordinate conversion step; (S40) Image extraction step; (S50) Optical characteristic value acquisition step; (S60) Quality determination step
摘要翻译：目的：提供一种LED（发光二极管）检测方法，以提高使用光学特性值的检查和检查速度的精度。构成：通过捕获从LED模块发出的光来创建LED模块的图像（S10）。基于拍摄单元的参考坐标轴获得图像的位置（S20）。基于坐标轴转换LED的坐标（S30）。从图像中提取包括LED位置位置的分析对象区域的图像（S40）。通过处理分析对象区域的图像获得LED的光学特性值（S50）。基于光学特性值来确定LED的质量（S60）。（附图标记）（S10）图像创建步骤; （S20）对手位置抓取步骤; （S30）坐标转换步骤; （S40）图像提取步骤; （S50）光学特性值获取步骤; （S60）质量确定步骤

15. 发明公开

KR1020120081927A 박막 표시 소자의 검사 수정 방법 및 검사 수정 장치 有权
标题翻译：薄膜显示装置的测试校正方法和装置
公开(公告)号：KR1020120081927A
公开(公告)日：2012-07-20
申请号：KR1020110131719
申请日：2011-12-09
申请人： 가부시키가이샤 히다치 하이테크놀로지즈
发明人： 나까오도시유끼 , 마루야마시게노부 , 가따오까후미오
IPC分类号： H01L51/56
CPC分类号： H01L51/0031 , G01R31/2635 , H01L2251/568
摘要： PURPOSE: An inspection correcting apparatus and method of a thin film display device are provided to improve yield by correcting a non-lighting pixel by using laser of a single wavelength. CONSTITUTION: A lighting inspection unit, an inspection correcting unit(102), and a system controller are provided. The inspection correcting unit comprises a defect inspection unit(105) and a correction unit(106). A light emitting layer emits light by applying electricity to a metal electrode and a transparent electrode. A portion which does not emit light is detected by observing the state of the light emitting layer from the side of the transparent electrode. A metal electrode layer of the upper side of the portion which does not emit light is eliminated by radiating laser to the metal electrode.
摘要翻译：目的：提供一种薄膜显示装置的检查校正装置和方法，以通过使用单个波长的激光校正非点亮像素来提高产量。构成：提供照明检查单元，检查校正单元（102）和系统控制器。检查校正单元包括缺陷检查单元（105）和校正单元（106）。发光层通过向金属电极和透明电极施加电力而发光。通过从透明电极侧观察发光层的状态来检测不发光的部分。通过向金属电极照射激光来消除不发光的部分的上侧的金属电极层。

16. 发明公开

KR1020110132572A 전자 디바이스의 개선된 테스트를 위한 시스템 및 방법 无效
标题翻译：用于改进电子设备测试的系统和方法
公开(公告)号：KR1020110132572A
公开(公告)日：2011-12-08
申请号：KR1020117022357
申请日：2010-03-26
申请人： 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
发明人： 가르시아더글라스 , 쿠크버논 , 바렛스펜서
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： G01R31/2635 , G01R31/01 , G01R31/2893 , H01L33/005
摘要： 고속으로 전기 및 광학 특성 모두에 의해 전기-광학 디바이스(52)를 테스트하고 분류하기 위한 개선된 방법 및 장치가 개시된다. 전기-광학 디바이스(52), 특히 발광 다이오드는 단일화 디바이스(14)에 의해 단일화되고, 이들이 전기 및 광학 특성에 대해 테스트(20)되는 선형 트랙(12)으로 전달된다. 디바이스는 테스트된 특성에 따라 다수의 상이한 빈(24)으로 분류(26)된다.

17. 发明公开

KR1020110088705A 발광 다이오드 포장장치를 이용한 발광 다이오드 연속포장방법 有权
标题翻译： LED连续拍摄方法使用LED贴片装置
公开(公告)号：KR1020110088705A
公开(公告)日：2011-08-04
申请号：KR1020100008329
申请日：2010-01-29
申请人： (주)에이피텍
发明人： 주재철 , 박춘용 , 허영철 , 장종률
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： G01R31/2635 , G01R31/01 , G01R31/2867 , G01R31/2879 , G01R31/2893 , G01R31/311
摘要： PURPOSE: A continuous light emitting diode packing method using a light emitting diode packing apparatus is provided to extract or change the direction of a light emitting diode when inferior goods are detected or the direction of the light emitting diode is not the right direction, thereby improving productivity and reducing a unit price. CONSTITUTION: A finished product of a light emitting diode is inserted in a supplying part in an injection step(S10). The light emitting diode inserted in the supplying part is arranged using a vibrating body and successively transferred along a guide rail in a supplying step(S20). The light emitting diode supplied in a raw along the guide rail is placed one by one in a mounting groove in a mounting step(S30). An electric signal is applied to the light emitting diode transferred by an index rail using an inspection device in a electric inspection part in order to inspect a faulty products in the light emitting diode in an electric inspection step(S40). A reversing part changes a direction of the light emitting diode in order to make a uniform light emitting diode direction among the light emitting diode determined as a good product from the electric inspection part in a direction reversing step(S50). A vision inspection part inspects attached foreign substances and exterior damage of the light emitting diode transferred by the index rail in a vision inspection step(S60). An extraction part extracts a faulty light emitting diode determined in the vision inspection part or electricity testing part from the index rail in an extraction step. A taping part performs packing the good light emitting diode which is not extracted from the extraction part in a taping step(S80).
摘要翻译：目的：提供使用发光二极管封装装置的连续发光二极管封装方法，用于提取或改变劣质商品时的发光二极管的方向，或者发光二极管的方向不是正确的方向，从而改善生产率降低单价。构成：在注射步骤中，将发光二极管的成品插入供给部（S10）。插入供给部的发光二极管使用振动体配置，并且在供给工序中依次沿导轨传送（S20）。沿着导轨供给的原料的发光二极管在安装步骤中逐个放置在安装槽中（S30）。为了在电气检查步骤中检查发光二极管中的故障产品，电信号被施加到由电子检查部分中的检查装置由索引轨道传送的发光二极管（S40）。反转部分改变发光二极管的方向，以便在方向反转步骤中确定为来自电检查部件的良好产品的发光二极管中的均匀的发光二极管方向（S50）。视觉检查部件在视觉检查步骤中检查由索引轨道传送的发光二极管的附着异物和外部损坏（S60）。提取部分在提取步骤中从索引轨道提取在视觉检测部分或电测试部分中确定的有缺陷的发光二极管。胶带部件在胶带步骤中对从提取部分未提取的良好的发光二极管进行打包（S80）。

18. 发明公开

KR1020110088704A 발광 다이오드 포장장치 有权
标题翻译： LED贴片机
公开(公告)号：KR1020110088704A
公开(公告)日：2011-08-04
申请号：KR1020100008328
申请日：2010-01-29
申请人： (주)에이피텍
发明人： 주재철 , 박춘용 , 허영철 , 장종률
IPC分类号： G01R31/01 , G01R31/00
CPC分类号： G01R31/01 , G01R31/2635 , G01R31/2893
摘要： PURPOSE: A light emitting diode packing apparatus is provided to automatically change direction of a product when the direction is not in the correct direction without stopping the light emitting diode packing apparatus, thereby improving productivity and reducing a unit price. CONSTITUTION: An approximately hemisphere shaped supplying part(10) includes a vibrating body(11) arraying an inputted light emitting diode(1). The supplying part successively moves the light emitting diode along a guide rail(13). A first placing means places the light emitting diode supplied in a row through the guide rail one by one in a mounting groove(21) by vacuum suction. An index rail(20) transfers the placed light emitting diode in the mounting groove. An electricity testing part(30) comprises an inspection device which inspects a faulty state of the light emitting diode by applying an electric signal. A reversing part(40) converts a direction of the light emitting diode when the direction of the light emitting diode is not in the majority direction among the light emitting diode determined as not in the faulty state in the electricity testing part. A vision inspection part(50) inspects attached foreign substances and exterior damage of the light emitting diode transferred by the index rail. An extraction part(60) extracts a faulty light emitting diode determined in the vision inspection part or electricity testing part from the index rail. A taping part(70) performs packing the good light emitting diode which is not extracted in the extraction part.
摘要翻译：目的：提供一种发光二极管封装装置，用于在不停止发光二极管封装装置的情况下，在方向不正确的方向自动改变产品的方向，从而提高生产率并降低单价。构成：大致半球状的供给部（10）具有排列输入的发光二极管（1）的振动体（11）。供给部沿着导轨（13）依次移动发光二极管。第一放置装置通过真空吸附将通过导轨供给的发光二极管逐一放置在安装槽（21）中。索引轨道（20）将放置的发光二极管传送到安装槽中。电测试部件（30）包括检查装置，其通过施加电信号来检查发光二极管的故障状态。当发光二极管的方向在电测试部分中判定为不在故障状态的发光二极管中不是多数方向时，反转部分（40）转换发光二极管的方向。视觉检查部件（50）检查附着的异物和由折射轨传输的发光二极管的外部损坏。提取部（60）从索引轨道提取在视觉检查部或电测试部中确定的有缺陷的发光二极管。带状部件（70）执行未在提取部分中提取的良好发光二极管的包装。

19. 发明授权

KR101049310B1 ＬＥＤ 소자 테스트 방법 및 ＬＥＤ 소자 테스트 시스템 失效
标题翻译：用于测试LED器件的方法和用于测试LED器件的系统
公开(公告)号：KR101049310B1
公开(公告)日：2011-07-13
申请号：KR1020100010894
申请日：2010-02-05
申请人： (주)티에스이
发明人： 강병혁
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： G01R31/2635 , G01J1/02 , G01R31/01 , G01R31/2867 , G01R31/2879 , H01L21/67271
摘要： PURPOSE: An LED element test method and a LED element test system are provided to shorten a test time without increasing a processing speed of a test device by performing individual test processes in a parallel manner. CONSTITUTION: A vision sensor determines polarity of an LED element which is transferred on a linear feeder. The LED element having the determined polarity is loaded into a LED element absorbing unit of the loading position among the LED element absorbing units. The LED elements of n number are tested in parallel by using first to n-th test sites for performing first to n-th test works. The tested LED elements are unloaded from the LED element absorbing units.
摘要翻译：目的：提供LED元件测试方法和LED元件测试系统，通过以并行方式执行各个测试过程，缩短测试时间，而不会增加测试设备的处理速度。构成：视觉传感器确定在线性进纸器上传输的LED元件的极性。具有确定的极性的LED元件被装载到LED元件吸收单元中的装载位置的LED元件吸收单元中。 n号的LED元件通过使用第一至第n个测试点进行并行测试，用于执行第一至第n个测试工作。测试的LED元件从LED元件吸收单元卸载。

20. 发明公开

KR1020110048323A 발광소자 수납장치, 발광소자 분류장치 및 발광소자 테스트 핸들러 失效
标题翻译：发光元件包含装置，Luminouw元件分选装置和Luminouw元件测试处理器
公开(公告)号：KR1020110048323A
公开(公告)日：2011-05-11
申请号：KR1020090105078
申请日：2009-11-02
申请人： 미래산업 주식회사
发明人： 김형희 , 김태윤 , 박무균
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： G01R31/2635 , G01R31/2863 , G01R31/2867 , G01R31/2893
摘要： PURPOSE: A light emitting element receiving device, light emitting element classifying device, and light element test handler are provided to increase the performance reliability of a light emitting element and save the manufacturing costs of a light emitting element. CONSTITUTION: A light emitting element receiving device(1) comprises the following devices. Tested light emitting devices are contained in a first receiving member(11) and a second receiving member(12). First receiving members are installed in a first receiving device(13). Second receiving members are installed in a second receiving device(14). The first receiving device and the second receiving device are installed in a receiving main body(15). The second receiving device can be independently opened/closed for the first receiving device.
摘要翻译：目的：提供一种发光元件接收装置，发光元件分类装置和光元件测试处理器，以增加发光元件的性能可靠性并节省发光元件的制造成本。构成：发光元件接收装置（1）包括以下装置。经测试的发光器件包含在第一接收部件（11）和第二接收部件（12）中。第一接收构件安装在第一接收装置（13）中。第二接收构件安装在第二接收装置（14）中。第一接收装置和第二接收装置安装在接收主体（15）中。可以为第一接收设备独立地打开/关闭第二接收设备。

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