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    • 12. 发明公开
    • 포지티브형 감광성 수지 조성물
    • 正型型感光树脂组合物
    • KR1020110076492A
    • 2011-07-06
    • KR1020090133229
    • 2009-12-29
    • 제일모직주식회사
    • 이정우유용식조현용정지영정두영이종화정민국차명환전환승
    • G03F7/039
    • G03F7/039G03F7/0755
    • PURPOSE: A positive type photo-sensitive resin composition, a photo-sensitive resin film using the same, a semiconductor device including the same are provided to minimize the thickness reduction of the film by maximizing the dissolution suppressive effect of a non-exposing part. CONSTITUTION: A positive type photo-sensitive resin composition includes a resin precursor, a dissolution controlling agent, an acid generator, a silane-based compound, and a solvent. The resin precursor is selected from a polybenzoxazole precursor, polyamic acid, or the combination of the same. The polarity of the dissolution controlling agent is between 1 and 4D, and the boiling point of the dissolution controlling agent is between 210 and 400 degrees Celsius. The polybenzoxazole precursor includes a repeating unit which is represented by chemical formula 1 or both repeating units represented by the chemical formula 1 and chemical formula 2. In the chemical formula 1 and 2, the X1 is an aromatic organic group or tetravalent to hexavalent aliphatic organic group. The Y1 and the Y2 are identical or different and are respectively aromatic organic groups or bivalent to hexavalent aliphatic organic groups. The X2 is an aromatic organic group, bivalent to hexavalent aliphatic organic group, bivalent to hexavalent alicyclic organic group, or an organic group represented by chemical formula 3.
    • 目的:提供一种正型感光树脂组合物,使用其的感光树脂膜,包括该光敏树脂膜的半导体器件,以使非曝光部分的溶解抑制效果最大化来最小化膜的厚度减小。 构成:正型感光树脂组合物包括树脂前体,溶解控制剂,酸产生剂,硅烷类化合物和溶剂。 树脂前体选自聚苯并恶唑前体,聚酰胺酸或其组合。 溶解控制剂的极性在1和4D之间,溶解控制剂的沸点在210-400℃之间。 聚苯并恶唑前体包括由化学式1表示的重复单元或由化学式1和化学式2表示的两个重复单元。在化学式1和2中,X1是芳族有机基团或四价至六价脂族有机基团 组。 Y1和Y2相同或不同,分别为芳族有机基团或二价至六价脂族有机基团。 X 2为芳香族有机基团,二价至六价脂肪族有机基团,二价至六价脂环族有机基团或由化学式3表示的有机基团。
    • 14. 发明授权
    • 포지티브형 감광성 수지 조성물
    • 正型感光树脂组合物
    • KR101015859B1
    • 2011-02-23
    • KR1020080098202
    • 2008-10-07
    • 제일모직주식회사
    • 정지영정두영유용식조현용정민국이종화이길성차명환
    • G03F7/039
    • 본 발명은 포지티브형 감광성 수지 조성물에 관한 것으로서, 이 포지티브형 감광성 수지 조성물은 (A) 하기 화학식 1로 표시되는 반복단위를 갖는 폴리벤조옥사졸 전구체; (B) 감광성 디아조퀴논 화합물; (C) 실란 화합물; (D) 용해조절제; 및 (E) 용매를 포함하며, 상기 용해조절제는 지환족 알코올 화합물, 지환족 고리를 포함하는 방향족 알코올 화합물 및 이들의 조합으로 이루어진 군에서 선택되는 화합물이다.
      [화학식 1]

      (상기 화학식 1에서, 각 치환기의 정의는 명세서에 정의된 것과 동일하다.)
      본 발명의 포지티브형 감광성 수지 조성물은 막 수축율을 현저히 낮출 수 있으며, 고감도, 고해상도, 양호한 패턴 형상, 및 우수한 잔여물 제거성을 나타낸다.
      포지티브형, 감광성 폴리벤조옥사졸 전구체, 용해조절제, 열중합 가교제, 알칼리 수용액, 반도체 장치
    • 本发明聚苯并恶唑前体具有由下述通式表示的重复单元(1),以正型感光性树脂组合物(A)涉及一种正型感光性树脂组合物; (B)光敏重氮醌化合物; (C)硅烷化合物; (D)溶解调节剂; 和(E)包含溶剂,其中,所述溶解控制剂是选自脂环族醇化合物,脂环族,芳族醇化合物,包括一个环,以及它们的组合组成的组中的化合物。
    • 17. 发明公开
    • 포지티브형 감광성 수지 조성물
    • 正型型感光树脂组合物
    • KR1020100080344A
    • 2010-07-08
    • KR1020090106661
    • 2009-11-05
    • 제일모직주식회사
    • 조현용정두영이종화정지영정민국유용식이길성
    • G03F7/039G03F7/075G03F7/016
    • G03F7/039C08L79/08G03F7/0045G03F7/0226G03F7/0233G03F7/0236G03F7/0392
    • PURPOSE: A positive photosensitive resin composition, a photosensitive resin film using the same, and a semiconductor device using the film are provided to have excellent sensitivity and high resolution in a process for forming a pattern at a temperature below 200°C and to obtain excellent mechanical properties through a crosslink bond of a crosslinking agent and a polybenzoxazole in thermal hardening of 300°C or greater. CONSTITUTION: A positive photosensitive resin composition includes: a repeating unit which is marked as a chemical formula 1 or a chemical formula 2; a polybenzoxazole precursor having a thermal polymerizable functional group on the terminal of the precursor; a photosensitive diazoquinone compound, a silane compound, a phenolic compound; a crosslinking agent having the thermal polymerizable functional group; and a solvent.
    • 目的:提供正型感光性树脂组合物,使用该感光性树脂组合物的感光性树脂膜和使用该膜的半导体装置,在200℃以下的图案形成工序中,具有优异的灵敏度和高分辨率, 通过交联剂和聚苯并恶唑的交联键在300℃以上的热硬化中的机械性能。 构成:正型感光性树脂组合物包括:标记为化学式1或化学式2的重复单元; 在前体的末端具有热聚合性官能团的聚苯并恶唑前体; 光敏重氮醌化合物,硅烷化合物,酚类化合物; 具有热聚合性官能团的交联剂; 和溶剂。
    • 18. 发明公开
    • 포지티브형 감광성 수지 조성물
    • 正型型感光树脂组合物
    • KR1020100080343A
    • 2010-07-08
    • KR1020090106634
    • 2009-11-05
    • 제일모직주식회사
    • 조현용정두영이종화정지영정민국유용식이길성
    • G03F7/039G03F7/075G03F7/016
    • G03F7/039C08L79/08G03F7/0045G03F7/0226G03F7/0233G03F7/0236G03F7/0392G03F7/105
    • PURPOSE: A positive photosensitive resin composition, a photosensitive resin film using the same, and a semiconductor device including the film are provided to enable a cold hardening at a low temperature of 250°C-300°C due to a thermal hardening functional group of a polybenzoxazole polymer terminal and to form a pattern having high sensitivity and high resolution. CONSTITUTION: A positive photosensitive resin composition comprises: a repeating unit which is marked as a chemical formula 1 or a chemical formula 2; a polybenzoxazole precursor having a thermal polymerizable function group which is indueced from a monoamine compound having a carbon-carbon double bond; a photosensitive diazoquinone compound; a silane compound; a phenolic compound, and a solvent. In the chemical formula 1 and 2, X1 is an aromatic organic group or an alicyclic organic group.
    • 目的:提供正型感光性树脂组合物,使用该感光性树脂组合物的感光性树脂膜和包含该膜的半导体装置,由于能够在250℃〜300℃的低温下进行冷硬化, 聚苯并恶唑聚合物末端并形成具有高灵敏度和高分辨率的图案。 构成:正型感光性树脂组合物包含:标记为化学式1或化学式2的重复单元; 具有由具有碳 - 碳双键的单胺化合物诱导的热聚合性官能团的聚苯并恶唑前体; 光敏重氮醌化合物; 硅烷化合物 酚类化合物和溶剂。 在化学式1和2中,X 1是芳族有机基团或脂环族有机基团。