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    • 130. 发明公开
    • 2단계 원자층증착법에 의한 산화구리층 제조방법
    • 通过2步原子层沉积制备CUXO的制备方法
    • KR1020130071339A
    • 2013-06-28
    • KR1020120099484
    • 2012-09-07
    • 한국기계연구원
    • 권정대김동호
    • C23C16/448H01L21/205C23C16/40
    • C23C16/45527C23C16/408C23C16/45542C23C16/45553H01L21/205
    • PURPOSE: A copper oxide layer manufacturing method through a two-step atomic layer deposition method is provided to selectively manufacture a first or second copper oxide layer and to control the depth of the whole thin film. CONSTITUTION: A copper oxide layer manufacturing method through a two-step atomic layer deposition method comprises the following steps: forming a copper atom layer on a substrate using copper precursor gas and reaction gas; and forming a copper oxide layer by oxidizing the copper atom layer using oxidizing gas. The copper atom layer performs the following steps: absorbing copper precursor gas on the substrate; purging the copper precursor gas from a deposition chamber; forming the copper atom layer on the substrate after making the reaction gas into plasma by taking the reaction gas inside the deposition chamber; and purging the reaction gas from the deposition chamber. [Reference numerals] (AA) Copper precursor gas; (BB,DD,FF) Purge; (CC) Hydrogen plasma; (EE) Oxidizing gas; (GG) First step; (HH) Second step
    • 目的:提供通过两步原子层沉积方法的氧化铜层制造方法来选择性地制造第一或第二氧化铜层并控制整个薄膜的深度。 构成:通过两步原子层沉积方法的氧化铜层制造方法包括以下步骤:使用铜前体气体和反应气体在基板上形成铜原子层; 以及通过使用氧化气体氧化铜原子层而形成氧化铜层。 铜原子层进行以下步骤:在基板上吸收铜前体气体; 从沉积室中清除铜前体气体; 通过将沉积室内的反应气体制成等离子体,在基板上形成铜原子层; 并从沉积室吹扫反应气体。 (附图标记)(AA)铜前体气体; (BB,DD,FF)清洗; (CC)氢等离子体; (EE)氧化气体; (GG)第一步; (HH)第二步