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    • 91. 发明公开
    • 포토 다이오드 및 이를 채용한 이미지센서
    • 照片二极管和图像传感器使用它
    • KR1020080050129A
    • 2008-06-05
    • KR1020060120975
    • 2006-12-01
    • 삼성전자주식회사
    • 김기범김택
    • H01L27/146
    • H01L31/032H01L27/14609H01L31/103H01L31/105
    • A photodiode and an image sensor using the same are provided to improve photosensitivity and to reduce the thickness of a light receiving section by using a high light absorption coefficient of a semiconductor silicide. An image sensor(100) is comprised of a substrate(110), a wiring layer(130) prepared on the substrate, a photodiode(150) prepared on the wiring layer, and a transparent electrode(180) covering the photodiode. The wiring layer connects the photodiode to the substrate, electrically. The wiring layer includes at least one insulating layer and a via hole(135). The photodiode is a pin structure in which an i layer is interposed between an n layer and a p layer. The n layer and the p layer are formed by adding an n-type impurity or a p-type impurity into a semiconductor silicide. Therefore, the photodiode is a structure of which a p-type semiconductor and an n-type semiconductor are used instead of the semiconductor silicide, so that photosensitivity is improved.
    • 提供光电二极管和使用该光电二极管的图像传感器,以通过使用半导体硅化物的高光吸收系数来提高光敏性和减小光接收部分的厚度。 图像传感器(100)由衬底(110),在衬底上制备的布线层(130),在布线层上制备的光电二极管(150)和覆盖光电二极管的透明电极(180)构成。 布线层电连接光电二极管到基板。 布线层包括至少一个绝缘层和通孔(135)。 光电二极管是其中i层插入在n层和p层之间的引脚结构。 通过在半导体硅化物中添加n型杂质或p型杂质来形成n层和p层。 因此,光电二极管是使用p型半导体和n型半导体代替半导体硅化物的结构,从而提高光敏性。
    • 92. 发明授权
    • 씨모스 이미지 센서 및 그 제조방법
    • CMOS图像传感器及其制造方法
    • KR100802295B1
    • 2008-02-11
    • KR1020060119770
    • 2006-11-30
    • 동부일렉트로닉스 주식회사
    • 우혁
    • H01L27/146
    • H01L27/14647H01L27/14601H01L31/103
    • A CMOS image sensor and a method for manufacturing the same are provided to prevent a contact defect by not requiring a plug connected to a red photodiode in a contact region. A red photodiode(120) is formed on an initial epitaxial layer(110). A separate layer(130) is formed on one side of an upper part of the red photodiode except for a contact region. A green photodiode(150) is formed on a surface of the separate layer. A contact is formed on the contact region in order to be connected to the red photodiode. A first epitaxial layer(160) is formed on the initial epitaxial layer including the green photodiode. A plurality of plugs(170) are formed within the first epitaxial layer in order to be connected to the green photodiode and the contact. An isolation layer(180) is formed on the first epitaxial layer between the plugs. A blue photodiode(200) is formed on the surface of the first epitaxial layer between the isolation layers. A well(190) is formed on a surface of the first epitaxial layer of upper sides of the plugs.
    • 提供CMOS图像传感器及其制造方法,以通过不需要在接触区域中连接到红色光电二极管的插头来防止接触缺陷。 在初始外延层(110)上形成红色光电二极管(120)。 除了接触区域之外,在红色光电二极管的上部的一侧上形成单独的层(130)。 绿色光电二极管(150)形成在分离层的表面上。 在接触区域上形成接触以连接到红色光电二极管。 在包括绿色光电二极管的初始外延层上形成第一外延层(160)。 多个插头(170)形成在第一外延层内,以连接到绿色光电二极管和触点。 在插头之间的第一外延层上形成隔离层(180)。 在隔离层之间的第一外延层的表面上形成蓝色光电二极管(200)。 在插头的上侧的第一外延层的表面上形成有阱(190)。
    • 93. 发明授权
    • 이미지 센서 제조방법
    • 图像传感器制作方法
    • KR100792342B1
    • 2008-01-07
    • KR1020060080134
    • 2006-08-23
    • 동부일렉트로닉스 주식회사
    • 한재원
    • H01L27/146
    • H01L31/103H01L27/14609H01L31/18
    • A method for manufacturing an image sensor is provided to enhance sensitivity by transmitting efficiently incident light to a photodiode region. An isolation layer region, a transistor region, and a photodiode region are defined on a semiconductor substrate(200). An isolation layer(210) is formed on the isolation layer region by etching the semiconductor substrate. A plurality of holes are formed at the photodiode region. A first conductive type ion implantation region(221) is formed by implanting first conductive type ions into the photodiode region. A second conductive type ion implantation region(223) is formed by implanting second conductive type ions into the first conductive type ion implantation region.
    • 提供一种用于制造图像传感器的方法,以通过有效地将入射光传输到光电二极管区域来提高灵敏度。 隔离层区域,晶体管区域和光电二极管区域被限定在半导体衬底(200)上。 通过蚀刻半导体衬底,在隔离层区域上形成隔离层(210)。 在光电二极管区域形成多个孔。 通过将第一导电型离子注入到光电二极管区域中来形成第一导电型离子注入区域(221)。 通过将第二导电型离子注入到第一导电型离子注入区域中形成第二导电型离子注入区(223)。