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1. 发明专利

JP5747821B2 金属銅膜及びその製造方法、金属銅パターン及びそれを用いた導体配線、金属銅バンプ、熱伝導路、接合材、並びに液状組成物有权
标题翻译：金属铜膜及其制造方法，金属铜图案并使用相同的，金属铜凸块的导体布线，热传导路径，接合材料，并且所述液体组合物
公开(公告)号：JP5747821B2
公开(公告)日：2015-07-15
申请号：JP2011531915
申请日：2010-09-13
申请人：日立化成株式会社
发明人：中子偉夫 , 山本和徳 , 神代恭 , 横澤舜哉 , 増田克之 , 江尻芳則 , 稲田麻希 , 黒田杏子
IPC分类号： B22F1/02 , H01B1/20 , H01B13/00 , H01B5/14 , H05K1/09 , C23C20/02
CPC分类号： B22F9/26 , B32B15/01 , C22C5/04 , C22C9/00 , H01B1/026 , H05K3/1283 , B22F1/02 , B22F2201/01 , B22F2301/10 , B22F2302/25 , B22F9/22 , H05K1/097 , H05K2201/0224 , H05K2201/0272 , H05K2203/0315 , H05K2203/1131 , H05K2203/1157 , H05K3/105 , Y10T156/10 , Y10T428/12903

2. 发明专利

JP2006049865A Corrosion resistant rare earth magnet and manufacturing method thereof 审中-公开
标题翻译：耐腐蚀稀土磁铁及其制造方法
公开(公告)号：JP2006049865A
公开(公告)日：2006-02-16
申请号：JP2005191650
申请日：2005-06-30
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： HAMADA RYUJI , MINOWA TAKEHISA
IPC分类号： H01F41/02 , B22F1/02 , C22C38/00 , C23C20/02 , H01F1/053
CPC分类号： C23C18/1216 , C23C18/1241 , C23C18/1254 , C23C18/127
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a corrosion resistant rare earth magnet provided with a coating with corrosion resistance and heat resistance. SOLUTION: The rare earth permanent magnet is represented by R-T-M-B (R is at least one kind of rare earth elements containing Y, T is Fe or Fe and Co, M is at least one kind of element selected from among Ti, Nb, Al, V, Mn, Sn, Ca, Mg, Pb, Sb, Zn, Si, Zr, Cr, Ni, Cu, Ga, Mo, W, and Ta, and contents of the elements are as follows: 5 mass%≤R≤40 mass%, 50 mass%≤T≤90 mass%, 0 mass%≤M≤8 mass%, and 0.2 mass%≤B≤8 mass%). A compound coating of flake fine powder/metal oxide is formed on the surface of rare earth permanent magnet, which is acquired by heating a process film in a process liquid containing at least one kind of flake fine powder selected from among Al, Mg, Ca, Zn, Si, Mn and alloy of them, and at least one kind of metal sol selected from among Al, Zr, Si, and Ti. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造具有耐腐蚀性和耐热性的涂层的耐腐蚀稀土磁体的方法。解决方案：稀土永磁体由RTMB表示（R是至少一种含有Y的稀土元素，T是Fe或Fe和Co，M是选自Ti，Nb中的至少一种元素，Al，V，Mn，Sn，Ca，Mg，Pb，Sb，Zn，Si，Zr，Cr，Ni，Cu，Ga，Mo，W和Ta，元素含量如下：5质量％ ≤R≤40质量％，50质量％≤T≤90质量％，0质量％≤M≤8质量％，0.2质量％≤B≤8质量％）。在稀土永磁体的表面上形成薄片状细粉末/金属氧化物复合涂层，其通过在含有选自Al，Mg，Ca中的至少一种薄片状细粉末的工艺液中加热工艺膜而获得，Zn，Si，Mn和它们的合金，以及选自Al，Zr，Si和Ti中的至少一种金属溶胶。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP3315673B2 失效
公开(公告)号：JP3315673B2
公开(公告)日：2002-08-19
申请号：JP30757899
申请日：1999-10-28
IPC分类号： H01J29/88 , C23C20/02 , H01J9/20

4. 发明专利

JP2002514268A 失效
公开(公告)号：JP2002514268A
公开(公告)日：2002-05-14
申请号：JP54711998
申请日：1998-04-23
IPC分类号： C23C2/00 , B22F1/02 , C22C1/04 , C22C27/04 , C23C10/18 , C23C20/02 , H01G9/00 , H01G9/012

5. 发明专利

JP2000091084A POSITIVE HOLE INJECTION PERFORMANCE IMPROVING ELECTRODE 失效
公开(公告)号：JP2000091084A
公开(公告)日：2000-03-31
申请号：JP6009199
申请日：1999-03-08
申请人： UNIV PRINCETON
发明人： FORREST STEPHEN R , GU GONG
IPC分类号： C09K11/06 , C23C14/08 , C23C16/40 , C23C20/02 , C23C30/00 , H01L27/32 , H01L51/00 , H01L51/30 , H01L51/50 , H01L51/52 , H05B33/10 , H05B33/12 , H05B33/14 , H05B33/26 , H05B33/28
摘要： PROBLEM TO BE SOLVED: To improve electron efficiency in a low operating voltage by introducing additive oxygen of a controlled quantity into the surface of an indium tin oxide layer while sticking the oxide layer, and sticking an organic layer on the surface. SOLUTION: Gasoeus oxygen is introduced into sputtering gas by a quantity for a controlled time in a part of a sputtering process to control the oxygen content of an indium tin oxide(ITO) anode. For example, an ITO electrode of 600 Å can be stuck by sputtering by using an Ar flow of 150 sccm containing no oxygen gas while sticking initial 540 Å, including gaseous oxygen of 0.1 sccm in the next 50 Å and including gaseous oxygen of 0.2 sccm in the final 10 Å. Added oxygen is contained in the surface of the ITO anode containing the stuck final 60 Å besides oxygen existing in the anode part of residual ITO.

6. 发明专利

JP2734020B2 失效
公开(公告)号：JP2734020B2
公开(公告)日：1998-03-30
申请号：JP27939488
申请日：1988-11-07
申请人： MITSUBISHI GASU KAGAKU KK
发明人： KAWAKAMI TAKAMASA , NAKANO RIAKO , ANDO KAZUHIRO , FUJIURA TAKATSUGU
IPC分类号： C23C18/08 , C23C20/02

7. 发明专利

JPH101777A COATING SOLUTION FOR FORMING ELECTRIC CONDUCTIVE COATING FILM AND ELECTRIC CONDUCTIVE COATING FILM 失效
公开(公告)号：JPH101777A
公开(公告)日：1998-01-06
申请号：JP14751496
申请日：1996-06-10
申请人： ASAHI GLASS CO LTD
发明人： ISHIZEKI KENJI , ABE KEISUKE , SANADA YASUHIRO , HIROYA MANAMI , MORIMOTO TAKESHI
IPC分类号： C23C18/31 , C23C20/02 , C23C20/06 , H01J9/20 , H01J29/88 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To form high performance electric conductive coating film and low reflection electric conductive coating film by low temp. heat treatment by incorporating a specified amt. of specified metallic fine particles in the sols in a coating soln. SOLUTION: Sols in which one or more kinds of metallic fine particles selected from the groups of Ag, Ru, Re, Ir, Os, Pt, Rh, Pd, Ni, Co, Sn, Cr, Au and In dispersed are incorporated into electric conductive coating applying components. Also, >=10 pts.wt. among the electric conductive coating film forming components is composed of the metallic fine particles. The average particle size of the metallic fine particles is preferably regulated to about η100nm. The regulated coating soln. for forming electric conductive coating film is applied to a substrate of glass or the like. Since this coating soln. Contains the metallic particles in the shape of sols, in the case of its application, fine pores are introduced into the electric conductive coating film. In the case a coating soln. contg. the alkoxide of Si, Ti, Zr or the like or the partially hydrolyzed products thereof to the surface of the electric conductive coating film, the coating soln. infiltrates into the fine pores to improve the strength of the electric conductive coating film.

8. 发明专利

JPH0454744B2 失效
公开(公告)号：JPH0454744B2
公开(公告)日：1992-09-01
申请号：JP7957585
申请日：1985-04-15
申请人： KOGYO GIJUTSU INCHO , KUBOTA KK
发明人： ODAWARA OSAMU , ISHII YASUMASA , YAMAZAKI HIROSHI , SATO MIKIO
IPC分类号： C23C20/00 , B22D13/02 , B22D19/08 , C23C20/02 , C23C24/10

9. 发明专利

JPH02129380A PRODUCTION OF COPPER PLATED RESIN MOLDED PRODUCT 失效
公开(公告)号：JPH02129380A
公开(公告)日：1990-05-17
申请号：JP27939488
申请日：1988-11-07
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： KAWAKAMI TAKAMASA , NAKANO RIAKO , ANDO KAZUHIRO , FUJIURA TAKATSUGU
IPC分类号： C23C18/08 , C23C20/02
摘要： PURPOSE:To obtain a resin molded product with a high quality Cu film formed by a simple method by adhering copper formate to the desired part of a resin molded product having a high deformation or deterioration temp. and heating and holding the product at a prescribed temp. CONSTITUTION:A soln. contg. dissolved or dispersed copper formate is applied to the desired part of a resin molded product of polyamide, etc., having a high deformation or deterioration temp. of >=165 deg.C The product is heated to a prescribed temp. between 165 deg.C and the deformation or deterioration temp. at >=1 deg.C/min heating rate in the temp. range of 130 deg.C to the prescribed temp. In a nonoxidizing atmosphere or under reduced pressure and the heated product is held at the prescribed temp. The proper amt. of copper formate adhered is >=0.005g/cm . The product is then cooled to room temp. and a Cu plating film is formed on the desired part. Cu powder produced from copper formate not concerned in film formation is removed by slight wiping or other method and anticorrosive treatment is carried out as required.

10. 发明专利

JPH02129379A PRODUCTION OF COPPER PLATED LONG-SIZED MATTED PRODUCT 失效
公开(公告)号：JPH02129379A
公开(公告)日：1990-05-17
申请号：JP27939388
申请日：1988-11-07
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： KAWAKAMI TAKAMASA , NAKANO RIAKO , ANDO KAZUHIRO , FUJIURA TAKATSUGU
IPC分类号： C23C18/08 , C23C20/02 , C23C26/00
摘要： PURPOSE:To produce a Cu plated long-sized matted product with high productivity by continuously putting copper formate powder on a long-sized product having a resin layer on the surface and holding the product at a prescribed temp. for a prescribed time in a heater. CONSTITUTION:Copper formate powder 1 is continuously and uniformly put on a long-sized matted product 10 such as a nonwoven glass fabric having a resin layer on the surface. The product 10 is introduced into a plating chamber A provided with a heater H for holding the product 10 in the temp. range of 165 deg.C to the deterioration temp. of the product 10 in a nonoxidizing atmosphere or under reduced pressure. The product 10 is rapidly heated and the copper formate powder 1 put on the product 10 is decomposed to form a Cu layer and Cu powder on the surface of the product 10. The product 10 is then introduced into a post-treatment vessel C, where the Cu powder as a by-product is removed and anticorrosive treatment is carried out. The resulting Cu plated long-sized product 11 has superior adhesion of the Cu film and exhibits satisfactory electrical characteristics as it is.

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