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1. 发明专利

JP2008086996A Microporous filter membrane, method of making microporous filter membrane and separator employing microporous filter membrane 审中-公开
标题翻译：微波滤膜，制造微孔滤膜的方法和使用微波滤膜的分离器
公开(公告)号：JP2008086996A
公开(公告)日：2008-04-17
申请号：JP2007306647
申请日：2007-11-27
申请人： Baxter Internatl Inc , バクスター・インターナショナル・インコーポレイテッドBaxter International Incorp0Rated
发明人： JACOBSON JAMES D
IPC分类号： A61M1/02 , B01D63/06 , A61M1/16 , B01D39/16 , B01D63/16 , B01D67/00 , B01D69/02 , B01D69/10 , B01D69/12 , B01D71/64 , B23K26/38 , B26F1/31
CPC分类号： B26F1/31 , B01D63/16 , B01D67/0032 , B01D67/0034 , B01D69/02 , B01D69/10 , B01D71/64 , B01D2323/42 , B01D2325/028 , B23K26/384 , Y10S55/05 , Y10T428/249953
摘要： PROBLEM TO BE SOLVED: To provide a microporous filter membrane, methods of making such microporous filter membrane and a separator employing microporous filter membrane. SOLUTION: The filter membrane is a monolithic polymeric membrane (20) that includes a polymeric filter layer (22) including a micron-scale precision-shaped pores (24) and a polymeric support layer (26) that has a precision-shaped porous support for the filter layer. Several methods are disclosed for making such a membrane using micromachining technique, including lithographic, laser ablation and x-ray treatment techniques. Several filter apparatuses employing such a membrane are disclosed. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供微孔过滤膜，制造这种微孔过滤膜的方法和使用微孔过滤膜的隔膜。滤膜是一种整体式聚合物膜（20），其包括聚合物过滤层（22），其包括微米级精密形状的孔（24）和聚合物支撑层（26）用于过滤层的多孔支撑。公开了使用微加工技术制造这种膜的几种方法，包括光刻，激光烧蚀和x射线处理技术。公开了使用这种膜的几个过滤装置。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2005313475A Resin processing method and resin processing apparatus 有权
标题翻译：树脂加工方法和树脂加工设备
公开(公告)号：JP2005313475A
公开(公告)日：2005-11-10
申请号：JP2004134132
申请日：2004-04-28
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： YAMADA EIICHIRO , SUGANUMA HIROSHI , INOUE SUSUMU , IKECHI MAKI
IPC分类号： B26F1/31 , B23K26/00 , B29C35/08 , B29C65/16
CPC分类号： B29C65/1664 , B29C65/1603 , B29C65/1616 , B29C65/1635 , B29C65/1645 , B29C65/1667 , B29C65/1683 , B29C66/1122 , B29C66/45 , B29C66/952
摘要： PROBLEM TO BE SOLVED: To provide a resin processing method capable of easily performing flexible resin processing, and a resin processing apparatus. SOLUTION: A laser beam L1 with a wavelength λ1 and a laser beam L2 with a wavelength λ2 are used. A resin 50 is irradiated with the laser beam L1 with the wavelength λ1 to be raised in its temperature and subsequently irradiated with the laser beam L2 with the wavelength λ2 to be cured. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够容易地进行柔性树脂加工的树脂加工方法和树脂加工设备。解决方案：使用波长为λ1的激光束L1和波长λ2的激光束L2。用波长λ1的激光束L1照射树脂50的温度升高，随后用波长λ2的激光束L2照射以固化。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2001310208A STANDARD HOLE DRILLING MACHINE 失效
公开(公告)号：JP2001310208A
公开(公告)日：2001-11-06
申请号：JP2000130763
申请日：2000-04-28
申请人： MURAKI KK , SEIKO PRECISION KK
发明人： ARAKI MASATOSHI , SAITO TSUTOMU
IPC分类号： B23B41/00 , B23B49/00 , B23Q3/02 , B26F1/16 , B26F1/31 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To prevent positional slippage of a printed circuit board placed on a movable table and the movable table at the time of moving the movable table of a standard hole drilling machine. SOLUTION: The printed circuit board (not illustrated) which is a work is placed on the movable table 12 of the standard hole drilling machine 1. The work is sucked and fixed by air of negative pressure applied on pores (not illustrated) opened in a large number on the movable table 12. An axis of rotation is provided at right angles with the moving direction of the movable table on a central part of a printed circuit board presser 71, a presser roller 72 to rotate in accordance with movement of the movable of table 12 is set, and this presser roller 72 is singly free to move vertically. When the work is inserted at a working position, the printed circuit board presser 71 and the presser roller 72 are lowered at a working starting position, the printed circuit board presser 71 pressurizes the work when the movable table stops, pressurizes the work on the movable table 12 until working is finished, and it prevents positional slippage.

4. 发明专利

JP2000036507A METHOD FOR POURING RESIN BY FLIP CHIP AND METALLIC MOLD FOR POURING RESIN 失效
公开(公告)号：JP2000036507A
公开(公告)日：2000-02-02
申请号：JP21961198
申请日：1998-07-17
申请人： TOWA CORP
发明人： MAEDA KEIJI
IPC分类号： B26F1/16 , B23K26/382 , B26F1/31 , B29C33/68 , B29C45/02 , B29C45/14 , B29C45/34 , B29L31/34 , H01L21/56 , H01L21/60 , B23K26/00
摘要： PROBLEM TO BE SOLVED: To improve the productivity of a flip chip by quickly pouring resin into a clearance between an electronic part and a substrate in the flip chip. SOLUTION: The inside part of the cavity of a resin injecting mold constituted of a fixed type 5 and a movable type 6 is vacuumed from a bottom face member 14 provided at the bottom face of the cavity, so that a separate type film 12 can be led to the cavity, and a hole part for resin passage is formed at the separate type film 12 by a protrusion 20 provided at a gate 18 communicated and connected with the cavity. At the same time, resin 22 (melting resin materials) is injected from the gate 18 through the hole part 21 into a clearance 4 between an electronic part 2 and a substrate 3 in the cavity.

5. 发明专利

JPH11277281A Perforation forming device 失效
标题翻译：执行形成装置
公开(公告)号：JPH11277281A
公开(公告)日：1999-10-12
申请号：JP8451298
申请日：1998-03-30
申请人： Toppan Forms Co Ltd , トッパン・フォームズ株式会社
发明人： KONO OSAMU
IPC分类号： B26F1/31 , B23K26/00 , B23K26/06 , B23K26/40
摘要： PROBLEM TO BE SOLVED: To realize an inexpensive perforating device. SOLUTION: The paper 10 on which perforation is to be formed is transported at high speed in a tense state by means of rollers 12, 14. A carbon dioxide gas laser 16 generates a laser beam continuously. A shutter disk 18 equipped with a number of fins (8 fins in this embodiment) radially is placed at a position shifted horizontally from the optical path of the laser 19 output beam, and rotated at a prescribed revolution speed by a motor 20. The output beam of the laser 16 is intermittently shielded with the fins of the shutter disk 18. The motor 20 is fixed on a holding plate 22 movable against a fixed part. With the holding plate 22, the shutter disk 18 can be adjusted in the horizontal shift quantity against the output beam of the laser 16. The horizontal shift quantity determines the cut/tie ratio of perforation.
摘要翻译：要解决的问题：实现廉价的穿孔装置。解决方案：要在其上形成穿孔的纸张10通过辊12,14以高速传送。二氧化碳气体激光器16连续地产生激光束。放置有多个翅片（本实施例中为8个散热片）的快门盘18放置在从激光器19输出光束的光路水平偏移的位置，并通过马达20以规定的转速旋转。输出激光器16的光束与快门盘18的翅片间歇地屏蔽。马达20固定在可抵靠固定部分移动的保持板22上。利用保持板22，快门盘18能够相对于激光器16的输出光束以水平移位量进行调节。水平移动量决定了穿孔的切割/拉伸比。

6. 发明专利

JPH0150663B2 失效
公开(公告)号：JPH0150663B2
公开(公告)日：1989-10-31
申请号：JP3300285
申请日：1985-02-22
申请人： WAVIN BV
发明人： HEINRITSUHI REHITERUSU
IPC分类号： B23K26/00 , B26F1/31 , B65D30/02 , B65D33/01 , B65D33/04

7. 发明专利

JPH01500577A 失效
公开(公告)号：JPH01500577A
公开(公告)日：1989-03-01
申请号：JP50200787
申请日：1987-03-24
IPC分类号： B26F1/26 , B01D67/00 , B26F1/31

8. 发明专利

JPS59153762A Roll paper cutter for duplicating machine and the like 失效
标题翻译：用于复印机的卷纸切割机
公开(公告)号：JPS59153762A
公开(公告)日：1984-09-01
申请号：JP2656383
申请日：1983-02-19
申请人： Fuji Xerox Co Ltd
发明人： TSUKAHARA SUMIO
IPC分类号： B26F1/31 , B65H35/04 , G03G15/00
CPC分类号： B65H35/04
摘要： PURPOSE:To improve the work efficiency with a simple construction by conducting a laser beam from semiconductor laser elements arranged in lines to a paper conveying route via a cellphox lens eye for cutting a roll paper. CONSTITUTION:A roll paper 14 from a holder 7 is conveyed to a copying point of a photosensitive body 9 through a feed-roller pair 8. When a paper top detector detects the top of the paper, the signal is sent to semiconductor laser elements 10... arranged in lines on substrates for outputting a laser beam. This beam is linearly condensed at a proper position on a paper conveying route below via cellphox lens eye 9 and 9 to be intensified, and simultaneously radiated in the width of the roll paper 14 for cutting the roll paper by the energy of radiation. This construction permits to cut papers efficiently with a simple construction without using a polyhedral mirror and reduce the frequency of troubles.
摘要翻译：目的：通过将半导体激光元件的激光束经由用于切割卷纸的细胞晶状体眼线的纸张输送路线排列成线状的激光元件，通过简单的结构来提高工作效率。构成：来自保持器7的卷纸14通过进给辊对8被传送到感光体9的复印点。当纸顶检测器检测到纸张的顶部时，信号被发送到半导体激光元件10 ...排列成用于输出激光束的基板上的线。该光束在通过细胞晶状体眼9和9的下方的纸张传送路径上的适当位置处被线性聚焦，以被加强，同时以卷纸14的宽度辐射，以通过辐射能量切割卷纸。这种结构允许以简单的结构有效地切割纸张，而不使用多面体镜子并减少故障频率。

9. 发明专利

JPS5163902A Tasojinzohikaku no enerugiibiimunyoru sankohoho 失效
标题翻译：无锡电力有限公司
公开(公告)号：JPS5163902A
公开(公告)日：1976-06-02
申请号：JP12298675
申请日：1975-10-14
申请人： Steigerwald Strahltech
发明人： KAARU HAINTSU SHUTAIGERUARUDO
IPC分类号： B32B37/00 , B26F1/31 , C14B5/00 , H01J37/31
CPC分类号： H01J37/31 , B26F1/31 , C14B5/00 , Y10T428/24322

10. 发明专利

JP4595378B2 Resin processing method 有权
公开(公告)号：JP4595378B2
公开(公告)日：2010-12-08
申请号：JP2004134132
申请日：2004-04-28
申请人：住友電気工業株式会社
发明人：享井上 , 英一郎山田 , 麻紀池知 , 寛菅沼
IPC分类号： B26F1/31 , B29C65/16 , B23K26/00 , B29C35/08 , B29C65/48
CPC分类号： B29C65/1664 , B29C65/1603 , B29C65/1616 , B29C65/1635 , B29C65/1645 , B29C65/1667 , B29C65/1683 , B29C66/1122 , B29C66/45 , B29C66/952
摘要： PROBLEM TO BE SOLVED: To provide a resin processing method capable of easily performing flexible resin processing, and a resin processing apparatus. SOLUTION: A laser beam L1 with a wavelength λ1 and a laser beam L2 with a wavelength λ2 are used. A resin 50 is irradiated with the laser beam L1 with the wavelength λ1 to be raised in its temperature and subsequently irradiated with the laser beam L2 with the wavelength λ2 to be cured. COPYRIGHT: (C)2006,JPO&NCIPI

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