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1. 发明专利

JP4595378B2 Resin processing method 有权
公开(公告)号：JP4595378B2
公开(公告)日：2010-12-08
申请号：JP2004134132
申请日：2004-04-28
申请人：住友電気工業株式会社
发明人：享井上 , 英一郎山田 , 麻紀池知 , 寛菅沼
IPC分类号： B26F1/31 , B29C65/16 , B23K26/00 , B29C35/08 , B29C65/48
CPC分类号： B29C65/1664 , B29C65/1603 , B29C65/1616 , B29C65/1635 , B29C65/1645 , B29C65/1667 , B29C65/1683 , B29C66/1122 , B29C66/45 , B29C66/952
摘要： PROBLEM TO BE SOLVED: To provide a resin processing method capable of easily performing flexible resin processing, and a resin processing apparatus. SOLUTION: A laser beam L1 with a wavelength λ1 and a laser beam L2 with a wavelength λ2 are used. A resin 50 is irradiated with the laser beam L1 with the wavelength λ1 to be raised in its temperature and subsequently irradiated with the laser beam L2 with the wavelength λ2 to be cured. COPYRIGHT: (C)2006,JPO&NCIPI

2. 发明专利

JP2006142342A Laser beam machining method and laser beam machining device 有权
标题翻译：激光束加工方法和激光束加工装置
公开(公告)号：JP2006142342A
公开(公告)日：2006-06-08
申请号：JP2004336944
申请日：2004-11-22
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： SHIOZAKI MANABU , FUSE TAKASHI , WATAYA KENICHI
IPC分类号： B23K26/06 , B23K26/20 , B23K26/38 , B23K26/40 , B29C65/16 , G02B3/08 , G02B5/18 , G02B13/00 , H01S3/00
CPC分类号： B23K26/0624 , B23K26/21 , B23K26/38 , B23K26/382 , B23K26/40 , B23K2201/40 , B23K2203/42 , B23K2203/50 , B23K2203/52 , B29C65/16 , B29C65/1603 , B29C65/1616
摘要： PROBLEM TO BE SOLVED: To solve the problem that, in the case an ultra-short pulse laser beam is condensed with a lens, and a hole is made in a work placed at the position of focal distance, since the depth of the focus is poor, the setting of the distance between the lens and the work is difficult, thus a deep hole can not be made at a uniform diameter. SOLUTION: Regarding the laser beam machining method, using a diffraction type lens in which, provided that the pulse time width (half-value whole width) of an ultra-short pulse generated by a pulse laser is defined as Δt, the diameter (half-value whole width) of the pulse as Δi, the focal distance of the diffraction type lens as f, and the velocity of light in a vacuum as c, a Z parameter Z p =2fcΔt/Δi 2 satisfies ≤1, an ultra-short pulse is condensed, and a work lying at a focal distance position is irradiated with a laser beam. In this way, the depth of the focus elongates, thus the setting of the distance is facilitated, and even a deep hole with a uniform diameter can be satisfactory made. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题为了解决在超短脉冲激光束与透镜聚光的情况下，并且在焦距位置处的工件中形成孔的问题，由于深度焦点差，透镜和工件之间的距离设置困难，因此不能在均匀的直径上形成深孔。解决方案：关于激光束加工方法，使用衍射型透镜，其中，如果脉冲激光产生的超短脉冲的脉冲宽度（半值整体宽度）定义为Δt，则脉冲的直径（半值整体宽度）为Δi，衍射型透镜的焦距为f，真空中的光速为c，Z参数Z p =2fcΔt /Δi 2 满足≤1，超短脉冲被冷凝，并且用激光束照射位于焦距位置的工件。以这种方式，焦点的深度延长，因此使距离的设定变得容易，并且即使是具有均匀直径的深孔也能够令人满意。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP4222296B2 Laser processing method and laser processing equipment 有权
公开(公告)号：JP4222296B2
公开(公告)日：2009-02-12
申请号：JP2004336944
申请日：2004-11-22
申请人：住友電気工業株式会社
发明人：学塩崎 , 敬司布施 , 研一綿谷
IPC分类号： B23K26/06 , B23K26/20 , B23K26/38 , B23K26/40 , B29C65/16 , G02B3/08 , G02B5/18 , G02B13/00
CPC分类号： B23K26/0624 , B23K26/21 , B23K26/38 , B23K26/382 , B23K26/40 , B23K2201/40 , B23K2203/42 , B23K2203/50 , B23K2203/52 , B29C65/16 , B29C65/1603 , B29C65/1616
摘要： Ultrashort pulse laser processing bores, welds or cuts objects (work pieces) by converging ultrashort laser pulses by a lens on the objects (work pieces) positioned at the focus and heating small spots or narrow lines on the objects (work pieces). Shortage of a focal depth of the lens prevents the ultrashort pulse laser processing from positioning the object (a work piece) and forming a deep, constant-diameter cylindrical hole. Z-parameter is defined to be Z=2fc&Dgr;t/&Dgr;i2, where &Dgr;t is a FWHM pulse width of the ultrashort pulse laser, &Dgr;i is a FWHM beam diameter of the ultrashort pulse, f is a focal length of the lens and c is the light velocity in vacuum. Selection of an optical system including a diffraction-type lens which gives the Z-parameter less than 1 (Z

4. 发明专利

JP2005313475A Resin processing method and resin processing apparatus 有权
标题翻译：树脂加工方法和树脂加工设备
公开(公告)号：JP2005313475A
公开(公告)日：2005-11-10
申请号：JP2004134132
申请日：2004-04-28
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： YAMADA EIICHIRO , SUGANUMA HIROSHI , INOUE SUSUMU , IKECHI MAKI
IPC分类号： B26F1/31 , B23K26/00 , B29C35/08 , B29C65/16
CPC分类号： B29C65/1664 , B29C65/1603 , B29C65/1616 , B29C65/1635 , B29C65/1645 , B29C65/1667 , B29C65/1683 , B29C66/1122 , B29C66/45 , B29C66/952
摘要： PROBLEM TO BE SOLVED: To provide a resin processing method capable of easily performing flexible resin processing, and a resin processing apparatus. SOLUTION: A laser beam L1 with a wavelength λ1 and a laser beam L2 with a wavelength λ2 are used. A resin 50 is irradiated with the laser beam L1 with the wavelength λ1 to be raised in its temperature and subsequently irradiated with the laser beam L2 with the wavelength λ2 to be cured. COPYRIGHT: (C)2006,JPO&NCIPI

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