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    • 9. 发明专利
    • Thermosetting resin composition and cured film
    • 热固性树脂组合物和固化膜
    • JP2008156546A
    • 2008-07-10
    • JP2006348994
    • 2006-12-26
    • Chisso Corpチッソ株式会社
    • ITAMI SETSUO
    • C08G59/46C08G69/44C08L63/00G02B1/10G02B1/14G02B5/20G02F1/1335
    • C08L63/00C08G59/32C08L79/08Y10T428/1073C08L2666/20C08L2666/22
    • PROBLEM TO BE SOLVED: To provide a cured film especially excellent in flatness and heat resistance and also in solvent resistance and chemical resistance such as acid resistance and alkali resistance, and adhesion to a substrate such as glass and also excellent in transparency, scratch resistance, applicability, and light resistance and to provide a resin composition which gives the cured film. SOLUTION: The thermosetting resin composition is a resin composition comprising a polyester amic acid obtained by reacting a tetracarboxylic acid dianhydride, a diamine, and a polyhydroxy compound as essential components, an epoxy resin containing 3-20 epoxy groups and having a weight-average molecular weight of below 5,000, and an epoxy curing agent, wherein 20-400 pts.wt. epoxy resin is present per 100 pts.wt. polyester amic acid, and 0-13 pts.wt. epoxy curing agent is present per 100 pts.wt. epoxy resin. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了提供平坦度和耐热性以及耐溶剂性和耐化学性如耐酸性和耐碱性以及对玻璃等基材的粘合性以及透明性优异的固化膜, 耐刮擦性,适用性和耐光性,并提供产生固化膜的树脂组合物。 解决方案:热固性树脂组合物是一种树脂组合物,其包含通过使四羧酸二酐,二胺和多羟基化合物作为必需组分反应获得的聚酯酰胺酸,含有3-20个环氧基并具有重量的环氧树脂 - 平均分子量低于5,000,和环氧固化剂,其中20-400重量份 每100重量份存在环氧树脂 聚酯酰胺酸和0-13重量份 环氧固化剂每100重量份存在 环氧树脂。 版权所有(C)2008,JPO&INPIT