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1. 发明专利

KR102231293B1 KR102231293B1 - Die bonding apparatus 有权
公开(公告)号：KR102231293B1
公开(公告)日：2021-03-23
申请号：KR1020140015002A
申请日：2014-02-10
申请人： 삼성전자주식회사
发明人： 하용대 , 이재룡 , 김철민 , 황이성 , 엄태석 , 정용진
IPC分类号： H01L21/50
CPC分类号： H01L24/75 , H01L21/67144 , H01L21/6838 , H01L2221/68363 , H01L2224/7555 , H01L2224/7565 , Y10T156/1132 , Y10T156/1179 , Y10T156/1944 , Y10T156/1983
摘要： 본 발명은 다이 본딩 장치에 관한 것이다. 본 발명의 일 실시 예에 따른 다이 본딩 장치는 이송 유닛; 상기 이송 유닛으로 기판을 로딩하는 로딩 부재; 상기 이송 유닛에서 기판을 언로딩 하는 언로딩 부재; 다이들을 제공하는 웨이퍼를 지지하는 웨이퍼 홀더; 및 상기 웨이퍼에서 상기 다이들 가운데 하나를 픽업한 후, 픽업된 상기 다이 방향으로 기체를 분사하여 상기 기체가 제공하는 압력으로 상기 다이를 상기 이송 유닛에 위치된 상기 기판의 상면에 부착하는 본딩 부재를 포함한다.

2. 发明专利

JP5977710B2 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体有权
公开(公告)号：JP5977710B2
公开(公告)日：2016-08-24
申请号：JP2013100195
申请日：2013-05-10
申请人：東京エレクトロン株式会社
发明人：本田勝 , 坂本亮一
IPC分类号： H01L21/677 , H01L21/683 , H01L21/02
CPC分类号： H01L21/6838 , H01L21/67092 , B32B2309/62 , B32B2457/14 , B32B38/10 , B32B38/1858 , B32B43/006 , Y10T156/1137 , Y10T156/1168 , Y10T156/1179 , Y10T156/19 , Y10T156/1961 , Y10T156/1983

3. 发明专利

JP2015198251A チップデタッチング装置およびチップデタッチング方法审中-公开
标题翻译：芯片拆卸设备和芯片拆卸方法
公开(公告)号：JP2015198251A
公开(公告)日：2015-11-09
申请号：JP2015061151
申请日：2015-03-24
申请人：プロテックカンパニーリミテッド , PROTEC CO., LTD.
发明人：コヨンスン
IPC分类号： H01L21/683
CPC分类号： H01L21/6836 , H01L21/67132 , H01L2221/68336 , Y10T156/1179 , Y10T156/1983
摘要：【課題】半導体チップに伝達される衝撃を最小限に抑えながら効果的に半導体チップをテープから分離することができるチップデタッチング装置およびチップデタッチング方法を提供する。【解決手段】テープTから分離すべき半導体チップCの外周のテープの下面を支持する支持体11、テープの下面を吸着させることができる吸着孔12、および支持体の上面の中央部を上下に貫通するように設けられたプッシュホール13を備えるイジェクトフード10と、吸着したテープを上下に昇降可能に設置される昇降体21、上方に膨らむように弾性変形し、テープを半導体チップと共に押し上げることができる弾性材質のメンブレイン30と、イジェクトフードの上側に配置され、メンブレインによって押し上げられる半導体チップを吸着させ上昇させて半導体チップを分離するピックアップヘッド40とで構成される。【選択図】図6
摘要翻译：要解决的问题：提供一种能够在最小化传播到半导体芯片的冲击的同时有效地去除半导体芯片的芯片拆卸装置和芯片拆卸方法。解决方案：一种芯片拆卸装置，包括：排出罩10，支撑体11，用于支撑位于半导体芯片C的外周的带T的一部分的下表面以从带上移除;吸入孔12，其能够吸附带的下表面;以及推孔13 布置成垂直地穿过支撑体的上表面的中心部分; 设置成能够垂直提升/降低被吸带的升降体21; 由弹性材料制成的膜30，其以向上扩展的方式弹性变形，以便能够将所述带与半导体芯片一起向上推; 拾取头40布置在排出罩的上侧，以吸引和提起被膜向上推的半导体芯片，从而移除半导体芯片。

4. 发明专利

JP2013097078A Paper peeling member and image forming apparatus 有权
标题翻译：纸张剥离构件和图像形成装置
公开(公告)号：JP2013097078A
公开(公告)日：2013-05-20
申请号：JP2011238107
申请日：2011-10-31
申请人： Sharp Corp , シャープ株式会社
发明人： YAMAUCHI KOICHI
IPC分类号： G03G15/14 , G03G15/20
CPC分类号： B32B43/006 , B26F1/00 , B32B37/00 , G03G15/6532 , Y10T156/1174 , Y10T156/1179 , Y10T156/1184 , Y10T156/1961 , Y10T156/1967 , Y10T156/1983
摘要： PROBLEM TO BE SOLVED: To improve safety of workers while suppressing deformation and damage of a peeling claw, when replacing the peeling claw.SOLUTION: A paper peeling member 10 is detachably supported by a support member that is disposed on the peripheral face of a photosensitive drum facing thereto and peels paper from the peripheral surface. The paper peeling member 10 includes a sharp-pointed peeling claw 40, a holding member 50, and a cover member 60. The holding member 50 is configured to be attachable/detachable with respect to the support member and holds the peeling claw 40 so as to extend towards the peripheral surface. The cover member 60 is configured to be attachable/detachable with respect to the holding member 50 and, in a state of being attached to the holding member 50, covers at least a part of the peeling claw 40 in an extending direction 91.
摘要翻译：要解决的问题：当更换剥离爪时，为了提高工人的安全性，同时抑制剥离爪的变形和损伤。解决方案：纸张剥离部件10由设置在与其相对的感光鼓的周面上的支撑部件可拆卸地支撑，并且从周面剥离纸张。纸张剥离部件10包括尖锐的剥离爪40，保持部件50和盖部件60.保持部件50被构造成相对于支撑部件可以安装/拆卸，并且将剥离爪40保持为以朝外围表面延伸。盖构件60被构造成相对于保持构件50可附接/拆卸，并且在附接到保持构件50的状态下，在延伸方向91上覆盖剥离爪40的至少一部分。
版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2012199456A Die bonder and pick up method of die bonder 有权
标题翻译： DIE BONDER的DIE BONDER和PICK UP方法
公开(公告)号：JP2012199456A
公开(公告)日：2012-10-18
申请号：JP2011063532
申请日：2011-03-23
申请人： Hitachi High-Tech Instruments Co Ltd , 株式会社日立ハイテクインスツルメンツ
发明人： OKAMOTO NAOKI , YAMAMOTO KEITA
IPC分类号： H01L21/52 , H01L21/67 , H05K13/04
CPC分类号： H01L21/67132 , H01L21/67271 , H01L2221/68322 , H01L2221/68336 , H01L2221/68354 , H01L2221/68381 , H01L2221/68386 , Y10S156/932 , Y10S156/943 , Y10T156/1132 , Y10T156/1179 , Y10T156/1944 , Y10T156/1983
摘要： PROBLEM TO BE SOLVED: To provide a die bonder which ensures to peel a die, or to provide a highly reliable die bonding or a pick up method that use the die bonder.SOLUTION: When a die 4 to be peeled, from among multiple dies (semiconductor chip) 4d attached to a dicing film 16, is pushed up and peeled from the dicing film, a predetermined area of the dicing film, from among areas surrounding the die, is pushed up to form a peeling start point 51a. Then, an area of the dicing film other than the predetermined area is pushed up to peel the die from the dicing film.
摘要翻译：要解决的问题：提供一种确保剥离模具的芯片焊接机，或提供使用该芯片焊接机的高可靠性的芯片焊接或拾取方法。解决方案：当从附着于切割膜16的多个模具（半导体芯片）4d中要剥离的模具4被推出并从切割膜的预定区域从切割膜的区域中剥离围绕模具被推起以形成剥离开始点51a。然后，将规定区域以外的切割膜的区域向上方推出，从切割膜剥离模具。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP4985513B2 Electronic components of the peeling method and peeling equipment 有权
公开(公告)号：JP4985513B2
公开(公告)日：2012-07-25
申请号：JP2008080734
申请日：2008-03-26
申请人：富士通セミコンダクター株式会社
发明人：山田　　豊 , 吉人金野
IPC分类号： H01L21/683 , H01L21/301
CPC分类号： H01L21/67132 , H01L21/67011 , H01L21/6838 , Y10T156/1132 , Y10T156/1142 , Y10T156/1168 , Y10T156/1179 , Y10T156/1195 , Y10T156/1944 , Y10T156/1978 , Y10T156/1983

7. 发明专利

JP4781529B2 The die was recovered from the wafer, a method and apparatus for transferring to the pick-up position 有权
公开(公告)号：JP4781529B2
公开(公告)日：2011-09-28
申请号：JP2000532273
申请日：1999-02-17
申请人：ユーアイホールディングカンパニー
发明人：ディーンタラント , ピーターデイビス
IPC分类号： B65G49/07 , H01L21/67 , H01L21/00
CPC分类号： H01L21/67132 , H01L21/67092 , Y10T29/49819 , Y10T29/49824 , Y10T156/1105 , Y10T156/1906 , Y10T156/1983

8. 发明专利

JP2011187827A Method and apparatus for releasing protection tape 有权
标题翻译：用于释放保护胶带的方法和装置
公开(公告)号：JP2011187827A
公开(公告)日：2011-09-22
申请号：JP2010053447
申请日：2010-03-10
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KUGA MASAICHI
IPC分类号： H01L21/683
CPC分类号： B65H3/32 , B32B38/10 , B32B43/006 , B32B2457/14 , H01L21/67132 , H01L21/6836 , H01L2221/68327 , H01L2221/68386 , Y10S156/932 , Y10S156/943 , Y10T156/1179 , Y10T156/1983
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for releasing a protection tape, capable of easily releasing the protection tape from a wafer even when the tape is not adhered to the wafer along the outer periphery of the wafer. SOLUTION: The method includes the steps of: mounting a wafer on a stage, on which a protection tape is adhered so as to be superposed on only a portion of a notch; adhering a releasing adhesive tape to the protection tape; lifting up the protection tape of the notch with the top surface of a lift pin by protruding the lift pin from the stage; and releasing the protection tape from the wafer by pulling the releasing adhesive tape while lifting up the protection tape with the lift pin. The top surface of the lift pin is shaped so that the top surface of the lift pin may lift up the protection tape of the notch. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于释放保护带的方法和装置，即使当带没有沿着晶片的外周边粘附到晶片时，也能够容易地将保护带从晶片释放。解决方案：该方法包括以下步骤：将晶片安装在平台上，在其上粘贴保护带以仅叠置在凹口的一部分上; 将释放的胶带粘附到保护胶带上; 通过将升降销从工作台上突出来，用提升销的顶面提起切口的保护带; 并且通过拉起释放胶粘带同时用提升销提起保护带来将保护胶带从晶片上释放出来。提升销的顶表面成形为使得提升销的顶表面可提升切口的保护带。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2010535685A Tape removal device and process for use in automated composite tape joining apparatus 有权
公开(公告)号：JP2010535685A
公开(公告)日：2010-11-25
申请号：JP2010521095
申请日：2008-08-07
申请人：ザ・ボーイング・カンパニーThe Boeing Company
发明人：ピーターディー．マクコイン，
IPC分类号： B65H41/00 , B65H35/07
CPC分类号： B29C70/386 , B29C70/545 , B29K2063/00 , B29K2077/10 , B29K2105/246 , B29K2709/02 , B29K2709/08 , Y10T156/1168 , Y10T156/1174 , Y10T156/1179 , Y10T156/1195 , Y10T156/19 , Y10T156/195 , Y10T156/1956 , Y10T156/1978 , Y10T156/1983 , Y10T156/1994
摘要： Apparatus are provided for attaching to a composite tape lamination machine in order to remove composite scrap tape material from a backing paper. When a moveable member is in one position composite non-scrap tape material on a backing paper is directed along a path to avoid a removing member and keep composite non-scrap tape material on a backing paper. When the moveable member is in another position composite scrap tape material on a backing paper is directed along a different path to contact the removing member and remove composite scrap tape material from a backing paper. Composite scrap tape material may be disposed in a scrap disposal member. Backing paper having attached composite non-scrap tape material and not having attached composite scrap tape material may be spooled using a spool roller.

10. 发明专利

JP2009070837A Protective tape separation method, and protective tape separation apparatus 有权
标题翻译：保护胶带分离方法和保护胶带分离装置
公开(公告)号：JP2009070837A
公开(公告)日：2009-04-02
申请号：JP2007234151
申请日：2007-09-10
申请人： Nitto Denko Corp , Nitto Seiki Kk , 日東精機株式会社 , 日東電工株式会社
发明人： YAMAMOTO MASAYUKI , MIYAMOTO SABURO
IPC分类号： H01L21/683
CPC分类号： B29C63/0013 , H01L21/67132 , Y10T156/1105 , Y10T156/1189 , Y10T156/1972 , Y10T156/1983
摘要： PROBLEM TO BE SOLVED: To separate a protective tape applied on the surface of a semiconductor wafer without giving any damage to the semiconductor wafer. SOLUTION: A surface height of a protective tape joined to a wafer placed and held on a separation table is detected, an operation amount of approaching a joining member to the protective tape until a separation tape wound around the joining member contacts the protective tape based on detected information is calculated, the joining member is operation-controlled to approach the protective tape based on the calculated operation amount, the joining member and the separation table are relatively moved along a direction of a surface of the protective tape in a state of maintaining the height of the joining member to join the separation tape to the protective tape, and then the separation tape is separated from the surface of the wafer together with the protective tape. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：分离施加在半导体晶片的表面上的保护带，而不会对半导体晶片造成任何损害。检测接合到放置并保持在分离台上的晶片的保护带的表面高度，将接合构件接近保护带的操作量直到缠绕在接合构件上的分离带接触保护计算出基于检测信息的胶带，根据计算出的操作量，接合部件进行操作控制以接近保护带，接合部件和分离台在保护带的表面方向相对移动保持接合构件的高度以将分离带连接到保护带，然后分离带与保护带一起与晶片的表面分离。版权所有（C）2009，JPO＆INPIT

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