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    • 3. 发明专利
    • Method of manufacturing wiring board
    • 制造接线板的方法
    • JP2010056370A
    • 2010-03-11
    • JP2008220961
    • 2008-08-29
    • Tdk CorpTdk株式会社
    • KAWABATA KENICHIOKAWA HIROSHIGE
    • H05K3/46
    • B32B43/006B32B37/12B32B2038/0084B32B2457/08H05K3/007H05K3/025H05K3/386H05K3/4602H05K3/4682H05K2203/0152H05K2203/0156H05K2203/0191H05K2203/0264H05K2203/1105Y10T29/49117Y10T29/49124Y10T29/49126Y10T156/11Y10T156/1142
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board, which is capable of sufficiently suppressing distortion and deformation of the wiring board and is capable of improving productivity by suppressing adhesion of an adhesive and the like to a multilayer wiring structure formed on a supporting board and allows the supporting board to be recycled. SOLUTION: A composite adhesive sheet 20 is stuck to one surface of a supporting board 10, and a double-sided CCL 30 is stuck to the other surface. In a state wherein they are integrated, the multilayer wiring structure including a conductor layer and a resin insulating layer is formed on a metal layer 33 of the double-sided CCL 30 by the well-known buildup method. Next, a heat foaming adhesive layer 22 of the composite adhesive sheet 20 is heated to produce gas by thermal decomposition of a heat foaming agent, whereby the supporting board 10 is separated from a remaining junction structure. Then, a carrier foil layer 32b and a copper foil layer 32a of a copper foil 32 with a carrier foil are mechanically peeled from each other in an interface between them to obtain the wiring board 1. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种能够充分抑制布线板的变形和变形的布线板的制造方法,并且能够通过抑制粘合剂等与多层布线的粘附性来提高生产率 结构形成在支撑板上并且允许支撑板被再循环。 解决方案:复合粘合片20贴在支撑板10的一个表面上,双面CCL30粘在另一表面上。 在它们被集成的状态下,包括导体层和树脂绝缘层的多层布线结构通过公知的堆积方法形成在双面CCL 30的金属层33上。 接着,通过加热发泡剂的热分解,加热复合粘合片20的热发泡粘合剂层22,从而产生气体,由此支撑基板10与剩余的结合部分分离。 然后,将带有载体箔的铜箔32的载体箔层32b和铜箔层32a在它们之间的界面上机械地剥离,得到布线板1.版权所有(C)2010, JPO&INPIT