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    • 2. 发明专利
    • Film deposition apparatus and substrate holder
    • 薄膜沉积装置和基板支架
    • JP2014077161A
    • 2014-05-01
    • JP2012224451
    • 2012-10-09
    • Ulvac Japan Ltd株式会社アルバック
    • HASEGAWA TAKEYUKINAGASAWA SHOJIOTOMO MASAHIKOMATSUMOTO TAKESHIKATAGIRI HIROAKIOTA ATSUSHIWATAI MIWA
    • C23C14/34
    • PROBLEM TO BE SOLVED: To provide a film deposition apparatus and a substrate holder in which good film deposition processing can be implemented on both surfaces of substrates-under-processing held by the substrate holder.SOLUTION: A substrate holder 11 comprises openings 22 which exposes surfaces of substrates-under-processing S at a bottom section of a concavity 21 housing the substrates-under-processing S, and supporting sections 23 which support the substrates-under-processing S by contacting outer peripheral edges of the substrates-under-processing S. Outer surfaces of the supporting sections 23 are constructed so that their tip sides are slant planes 24 slanting towards the substrates-under-processing S. The substrates-under-processing S are carried to a processing section 50 while being held in the substrate holder 11, and film deposition processing on both surfaces of the substrates-under-processing S is implemented.
    • 要解决的问题:提供一种成膜装置和衬底保持器,其中可以在由衬底保持器保持的衬底下的两个表面上实现良好的成膜处理。解决方案:衬底保持器11包括露出的开口22 在处理下基板S的凹部21的底部的基板下面的基板S的表面,以及支撑部23,其支撑下面的基板S,其中,通过接触下面的基板的外周边缘 支撑部23的外表面被构造成使得它们的末端侧是朝向下面处理的基板S倾斜的倾斜平面24.在被保持在基板中的基底处理S被运送到处理部分50 保持器11,并且在基底处理S的两个表面上进行成膜处理。
    • 3. 发明专利
    • Method of manufacturing photoelectric conversion device
    • 制造光电转换器件的方法
    • JP2012119537A
    • 2012-06-21
    • JP2010268820
    • 2010-12-01
    • Ulvac Japan Ltd株式会社アルバック
    • TANAKA YOSHIKAZUSAITO KAZUYAKATAGIRI HIROAKIKOMATSU TAKASHIOKO YOSHIKIKANAZAWA KEISUKETAKAGI MAKIKONISHIKATA YASUSHIOSONO SHUJISAKATA GENJIYOKOO HIDEKAZUSUZUKI HIDEOTOMITA MASATONISHIBASHI TSUTOMU
    • H01L31/04
    • Y02E10/546Y02P70/521
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing a photoelectric conversion device which can reduce the number of manufacturing steps of a photoelectric conversion device having an impurity region on the side surface of a semiconductor substrate covered with a passivation film.SOLUTION: A solar cell comprises a silicon substrate 11 having a light-receiving surface 11a, and a rear surface 11b on the reverse side of the light-receiving surface 11a is covered with a silicon oxide film 13 and a silicon nitride film 14 while having an N type impurity region 11n and a P type impurity region. When the solar cell is manufactured, the silicon oxide film 13 and the silicon nitride film 14 are formed on the rear surface 11b. Subsequently, an ion beam 23a of N type impurity element is irradiated toward the rear surface 11b from above the silicon oxide film 13 and silicon nitride film 14 thus forming an N type impurity region 11n in the rear surface 11b. An ion beam 24a of P type impurity element is also irradiated toward the rear surface 11b from above the silicon oxide film 13 and silicon nitride film 14 thus forming a P type impurity region in the rear surface 11b.
    • 解决的问题:提供一种制造光电转换装置的方法,其可以减少在被钝化膜覆盖的半导体衬底的侧表面上具有杂质区的光电转换装置的制造步骤数量。 解决方案:太阳能电池包括具有光接收表面11a的硅衬底11,并且在受光面11a的背面上的后表面11b被氧化硅膜13覆盖,并且氮化硅膜 同时具有N型杂质区域11n和P型杂质区域。 当制造太阳能电池时,在后表面11b上形成氧化硅膜13和氮化硅膜14。 随后,从后面11b中形成N型杂质区域11n的氧化硅膜13和氮化硅膜14的上方向背面11b照射N型杂质元素的离子束23a。 P型杂质元素的离子束24a也从氧化硅膜13和氮化硅膜14的背面11b向背面11b照射,从而形成P型杂质区。 版权所有(C)2012,JPO&INPIT
    • 5. 发明专利
    • Sputtering apparatus
    • 溅射装置
    • JP2009097057A
    • 2009-05-07
    • JP2007272054
    • 2007-10-19
    • Ulvac Japan Ltd株式会社アルバック
    • USHIYAMA FUMIZOODAGI HIDEYUKIKUBO MASASHIYAMAMOTO KAZUTOKATAGIRI HIROAKI
    • C23C14/35H01L21/285
    • PROBLEM TO BE SOLVED: To improve target use efficiency by operating magnetron-magnet apparatuses having different sizes in such a manner that their erosion regions do not overlap.
      SOLUTION: First and second magnetron-magnet apparatuses having different sizes 20
      1 and 20
      2 are circulated and moved at the back surface of first and second rectangular targets 21a and 21b so as to form four erosion regions. When the first and second magnetron-magnet apparatuses 20
      1 and 20
      2 comes in and out of the back surface position by crossing the shorter side of the first and second targets 21a and 21b, the erosion regions have a linear shape along the long side, thereby sputtering a large area.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:通过以不侵蚀区域不重叠的方式操作具有不同尺寸的磁控管 - 磁体装置来提高目标的使用效率。 解决方案:具有不同尺寸20 1 和20 2 的第一和第二磁控管磁铁装置在第一和第二矩形对象21a的背面被循环移动, 21b以形成四个侵蚀区域。 当第一和第二磁控管磁铁装置20 20 2 通过穿过第一和第二靶21a的短边而进入和离开背面位置时 如图21b所示,侵蚀区域沿着长边具有线性形状,从而溅射大面积。 版权所有(C)2009,JPO&INPIT
    • 6. 发明专利
    • Sputtering apparatus and sputtering method
    • 溅射装置和喷射方法
    • JP2008081805A
    • 2008-04-10
    • JP2006264231
    • 2006-09-28
    • Ulvac Japan Ltd株式会社アルバック
    • KUBO MASASHIODAGI HIDEYUKIKATAGIRI HIROAKI
    • C23C14/35
    • H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a sputtering apparatus which can uniformize erosion depth. SOLUTION: This sputtering apparatus has a magnetic circuit 12 which reciprocates between end-points A and B in the vicinities of both ends in a longitudinal direction of a target 10, along the longitudinal direction. When the magnetic circuit 12 moves from one end-point to the other end-point, the magnetic circuit 12 gradually increases the speed from a constant speed V 2 as it approaches the end-point; after the speed has reached a high speed V 3 , the magnetic circuit 12 rapidly decreases the speed; when reversing the direction of movement, the magnetic circuit 12 rapidly increases the speed up to a high speed V 1 , and then gradually decreases the speed to make the magnetic circuit 12 move at the constant speed V 2 . The magnetic circuit 12 moves at a higher speed in the vicinities of the end-points (A) and (B) than in the central area, and the target 10 is eroded into uniform depth in the longitudinal direction. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供可以使侵蚀深度均匀化的溅射装置。 解决方案:该溅射装置具有磁路12,该磁路12沿着纵向方向在靶10的纵向方向上的两端附近的端点A和B之间往复运动。 当磁路12从一个端点移动到另一个端点时,磁路12在接近端点时从恒定速度V SB> 2逐渐增加速度; 在速度达到高速V <3> 3 之后,磁路12迅速降低速度; 当反转运动方向时,磁路12迅速地将速度提高到高速V SB> 1,然后逐渐降低速度使得磁路12以恒定速度V 2 。 磁路12在端点(A)和(B)附近以比在中心区域更高的速度移动,并且靶10在纵向上被侵蚀成均匀的深度。 版权所有(C)2008,JPO&INPIT
    • 7. 发明专利
    • Solar cell
    • 太阳能电池
    • JP2012124328A
    • 2012-06-28
    • JP2010273826
    • 2010-12-08
    • Ulvac Japan Ltd株式会社アルバック
    • TANAKA YOSHIKAZUSAITO KAZUYAKATAGIRI HIROAKIKOMATSU TAKASHISAKIO SUSUMUTAKAGI MAKIKOKANAZAWA KEISUKEOSAWA MASATOTEI KYUKOHASHIMOTO NATSUKI
    • H01L31/04
    • Y02E10/50
    • PROBLEM TO BE SOLVED: To provide a solar cell which sufficiently secures power collection property of finger electrodes, increases solar light reaching a semiconductor element, and achieves high generation efficiency.SOLUTION: Each finger electrode 22 has at least two regions made of materials which are different from each other, a first region 22a formed by a transparent conductor and a second region 22b formed by a conductive metal. The first region 22a may be formed by the transparent conductor, for example, ITO (indium oxide-tin), ZnO (zinc oxide), and TO (tin oxide). According to this embodiment, for example, ITO is used. On the other hand, the second region may be formed by the conductive metal, for example, Ag (silver), Al (aluminum), Au (gold), and Cu (copper).
    • 要解决的问题:为了提供充分确保手指电极的集电性的太阳能电池,增加到达半导体元件的太阳光,并且实现高发电效率。 解决方案:每个指状电极22具有由彼此不同的材料制成的至少两个区域,由透明导体形成的第一区域22a和由导电金属形成的第二区域22b。 第一区域22a可以由透明导体形成,例如ITO(氧化铟锡),ZnO(氧化锌)和TO(氧化锡))。 根据本实施方式,例如使用ITO。 另一方面,第二区域可以由导电金属形成,例如Ag(银),Al(铝),Au(金)和Cu(铜)。 版权所有(C)2012,JPO&INPIT
    • 9. 发明专利
    • Sputtering apparatus
    • 溅射装置
    • JP2008081807A
    • 2008-04-10
    • JP2006264236
    • 2006-09-28
    • Ulvac Japan Ltd株式会社アルバック
    • KUBO MASASHIODAGI HIDEYUKIKATAGIRI HIROAKI
    • C23C14/35
    • PROBLEM TO BE SOLVED: To improve a utilization ratio of a target by making an erosion depth of a circular arc part equivalent to that of other parts or shallower, and to reduce the replacement frequency of the target.
      SOLUTION: This sputtering apparatus has a magnetic circuit 20 installed such that the distance between the magnetic circuit 20 and the surface of the target 12 while the magnetic circuit 20 moves in a circular arc part R
      A is longer than that while it moves in a linear part R
      L , and controls the strength of a magnetic field on the surface of the target 12 in a circular arc part R
      A lower than that in the linear part R
      L . Then, an erosion depth in the circular arc part R
      A is decreased, and the life of the target 12 is extended. Instead of changing the distance, a weakening member for weakening the strength of the magnetic field on the surface of the target 12 may be placed in a circular arc part R
      A , or an intensifying member for intensifying the strength of the magnetic field on the surface of the target 12 can be placed in a linear part R
      L .
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:通过使圆弧部分的侵蚀深度等于其它部分的腐蚀深度或更浅的方式来提高目标的利用率,并且降低目标的替换频率。 解决方案:该溅射装置具有安装成使磁路20与目标12的表面之间的距离同时磁路20以圆弧部分R A移动的磁路20, 比直线部分R L 移动时长,并且在圆弧部分R SB> A 中控制目标12的表面上的磁场的强度, 低于线性部分R L 。 然后,圆弧部分R A 中的侵蚀深度减小,并且靶材12的寿命延长。 代替改变距离,用于削弱目标12的表面上的磁场强度的弱化构件可以放置在圆弧部分R 中,或者用于增强强度的增强构件 目标12的表面上的磁场可以被放置在线性部分R L 中。 版权所有(C)2008,JPO&INPIT