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1. 发明专利

JP2011203042A Simulation method utilizing curing rule 审中-公开
标题翻译：使用固化规则的模拟方法
公开(公告)号：JP2011203042A
公开(公告)日：2011-10-13
申请号：JP2010069475
申请日：2010-03-25
申请人： Nagoya Univ , Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 国立大学法人名古屋大学 , 株式会社豊田中央研究所
发明人： WADA KENSUKE , YAGI YUJI , ATSUMI TAKASHI , NAKAGAWA IKURO , ONO NOBUTADA
IPC分类号： G01N3/32 , G01N3/00
摘要： PROBLEM TO BE SOLVED: To provide a technique for accurately simulating the behavior of a laminated substrate wherein a metal layer consisting of any one of Cu, Al, a Cu alloy and an Al alloy and an insulating layer, consisting of insulating ceramics that are laminated.SOLUTION: This simulation method is constituted of a process for repeatedly deformation of the metal layer in a predetermined amplitude and acquiring actually measured data, showing a stress-strain curve at the time of saturation, the process for forming a uniaxial increase curve on the basis of the actually measured data, and a process for forming a material constant introduced into a curing rule on the basis of the formed uniaxial increase curve.
摘要翻译：要解决的问题：提供一种准确地模拟层压基板的行为的技术，其中由Cu，Al，Cu合金和Al合金中的任一种构成的金属层和由层压的绝缘陶瓷构成的绝缘层解决方案：该模拟方法由金属层以预定的振幅重复变形的过程构成，并获取实际测量的数据，显示饱和时的应力 - 应变曲线，形成单轴增加曲线的过程实际测量数据的基础，以及基于形成的单轴增加曲线形成引入固化规则的材料常数的方法。

2. 发明专利

JP2010131618A METHOD OF MANUFACTURING Bi-CONTAINING SOLDER FOIL, Bi-CONTAINING SOLDER FOIL, JOINED BODY AND POWER SEMICONDUCTOR MODULE 有权
标题翻译：双包装机，双包装机，接合体和功率半导体模块的制造方法
公开(公告)号：JP2010131618A
公开(公告)日：2010-06-17
申请号：JP2008308653
申请日：2008-12-03
申请人： Tohoku Univ , Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 国立大学法人東北大学 , 株式会社豊田中央研究所
发明人： YAMADA YASUSHI , ISHIDA KIYOHITO , ONUMA IKUO , TAKAKU YOSHIKAZU , NAKAGAWA IKURO , ATSUMI TAKASHI
IPC分类号： B23K35/40 , B22F1/00 , B22F3/18 , B23K35/14 , B23K35/26 , C22C9/05 , C22C12/00 , H01L23/36 , H01L23/373 , H01L25/07 , H01L25/18 , H05K3/34
CPC分类号： H01L24/27 , H01L24/29 , H01L2224/83101 , H01L2924/351 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing Bi-containing solder foil and Bi-containing solder foil, and to provide a joined body that is highly heat resistant and accurately welded and a power semiconductor module. SOLUTION: In the method of manufacturing Bi-containing solder foil, powder of a solder material containing bismuth (Bi) is formed into a sheet by a powder rolling method. The ratio of a long side and a short side in the powder of the solder material is suitably ≥1.2 and ≤3.0 while the mean particle diameter of the powder is suitably ≥5 μm and ≤200 μm. The rolling by the powder rolling method is desirably performed at ≥-20°C and ≤269°C. Also, in the joined body and the power semiconductor module, the Bi-containing solder foil is used in the weld zone. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造含Bi焊料箔和Bi含有焊料箔的方法，并提供高耐热和精确焊接的接合体和功率半导体模块。解决方案：在制造含Bi焊料箔的方法中，通过粉末轧制法将含有铋（Bi）的焊料的粉末形成为片材。焊料的粉末中的长边和短边的比率适当地≥1.2和≤3.0，而粉末的平均粒径适当地≥5μm和≤200μm。通过粉末轧制法的轧制优选在≥-20℃和≤269℃下进行。此外，在接合体和功率半导体模块中，在焊接区域中使用含Bi焊料箔。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2009129983A Junction structure and method of manufacturing the same, and power semiconductor module and method of manufacturing the same 审中-公开
标题翻译：结构及其制造方法和功率半导体模块及其制造方法
公开(公告)号：JP2009129983A
公开(公告)日：2009-06-11
申请号：JP2007300793
申请日：2007-11-20
申请人： Tohoku Univ , Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 国立大学法人東北大学 , 株式会社豊田中央研究所
发明人： YAMADA YASUSHI , YAGI YUJI , TAKAKU YOSHIKAZU , ONUMA IKUO , ISHIDA KIYOHITO , ATSUMI TAKASHI , NAKAGAWA IKURO , SHIRAI MIKIO
IPC分类号： H01L21/52 , H01L23/34
CPC分类号： H01L24/83 , H01L2224/83101 , H01L2924/351 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a junction structure with a member junctioned uniformly owing to improved wetting properties when a solder material mainly comprising zinc is used, and to provide a power semiconductor module and method of manufacturing the same. SOLUTION: The junction structure 300 has a first member 101 and a second member 102. The part between the first member 101 and the second member 102 is junctioned by the solder material 50 mainly comprising zinc. Each surface to be junctioned of the first member 101 and the second member 102 includes nickel layers 111, 112. Further the surfaces of the nickel layers 111, 112 comprise metal surface layers 121, 122 having high reaction properties with zinc and generating the alloy with zinc. The metal surface layers 121, 122 are eliminated at the junction surface after the junction. The first member 101 and the second member 102 correspond to the power semiconductor device and an insulating substrate, or the insulating substrate and a heat sink. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种连接结构，其中当使用主要包含锌的焊料材料时，由于改善的润湿性能均匀地连接部件，并提供功率半导体模块及其制造方法。结合结构300具有第一构件101和第二构件102.第一构件101和第二构件102之间的部分由主要包含锌的焊料材料50连接。要与第一构件101和第二构件102接合的每个表面包括镍层111,112。此外，镍层111,112的表面包括与锌具有高反应性能的金属表面层121,122，并且与锌。金属表面层121,122在结之后的接合表面处被去除。第一构件101和第二构件102对应于功率半导体器件和绝缘基板，或者绝缘基板和散热器。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2010103311A Multilayer substrate 审中-公开
标题翻译：多层基板
公开(公告)号：JP2010103311A
公开(公告)日：2010-05-06
申请号：JP2008273419
申请日：2008-10-23
申请人： Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YAGI YUJI , WADA KENSUKE , YAMADA YASUSHI , ATSUMI TAKASHI , NAKAGAWA IKURO
IPC分类号： H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide technique such that a multilayer substrate having aluminum nitride and copper laminated has no crack in an insulating layer no matter how many times thermal loads of heating and cooling are placed repeatedly. SOLUTION: The multilayer substrate 2 has the insulating layer 6 of aluminum nitride and a conductive layer 4 of copper formed on the insulating layer 6. The conductive layer 4 has a thick portion 4a and a thin portion 4b. Part of the thick portion 4a forms a bonding region for bonding a semiconductor device. The thin portion 4b is provided outside the bonding region and formed thinner than the bonding region. The thin portion 4b is formed to a thickness of ≤0.05 mm within a range of at least 1.2 mm from an outer periphery of the conductive layer 4. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种技术，使得具有氮化铝和铜层压的多层基板在绝缘层中没有裂纹，而不管多少次加热和冷却的热负载重复放置。解决方案：多层基板2具有氮化铝的绝缘层6和形成在绝缘层6上的铜的导电层4.导电层4具有厚的部分4a和薄的部分4b。厚部分4a的一部分形成用于接合半导体器件的接合区域。薄部4b设置在接合区域的外侧，并且形成为比接合区域薄。在距离导电层4的外周至少1.2mm的范围内，薄部4b形成为≤0.05mm的厚度。（C）2010，JPO＆INPIT

5. 发明专利

JP2008270353A Power semiconductor module 有权
标题翻译：功率半导体模块
公开(公告)号：JP2008270353A
公开(公告)日：2008-11-06
申请号：JP2007108311
申请日：2007-04-17
申请人： Tohoku Univ , Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 国立大学法人東北大学 , 株式会社豊田中央研究所
发明人： YAGI YUJI , YAMADA YASUSHI , ATSUMI TAKASHI , NAKAGAWA IKURO , SHIRAI MIKIO , ISHIDA KIYOHITO , ONUMA IKUO , TAKAKU YOSHIKAZU
IPC分类号： H01L25/07 , H01L23/40 , H01L25/18
CPC分类号： H01L23/3735 , H01L23/473 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/29111 , H01L2224/29113 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83447 , H01L2224/838 , H01L2224/83805 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/1579 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01013 , H01L2924/01025 , H01L2924/01083 , H01L2924/3512 , H01L2924/00015 , H01L2224/83205
摘要： PROBLEM TO BE SOLVED: To provide a power semiconductor module which does not easily permit generation of a fault such as crack and break. SOLUTION: A power semiconductor module is formed by bonding a couple of components with a Bi solder material and this module is provided with a Cu layer at the surfaces to be bonded with a Bi solder material of the couple of components. The couple of components as the components to be bonded are formed by combining a semiconductor element 20, and an insulating material 30 or the insulating material 30 and a heat sink 40. The insulating material is constituted with a laminated material of Cu34/SiNx32/Cu36. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供不容易产生断裂和断裂等故障的功率半导体模块。解决方案：功率半导体模块通过用Bi焊料材料结合一对部件而形成，并且该模块在与两个部件的Bi焊料材料粘合的表面处设置有Cu层。通过组合半导体元件20，绝缘材料30或绝缘材料30和散热器40来形成要结合的部件的一对部件。绝缘材料由Cu34 / SiNx32 / Cu36的层叠材料构成。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2008028295A Power semiconductor module and production method therefor 有权
标题翻译：功率半导体模块及其生产方法
公开(公告)号：JP2008028295A
公开(公告)日：2008-02-07
申请号：JP2006201725
申请日：2006-07-25
申请人： Toyota Central Res & Dev Lab Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YAMADA YASUSHI , YAGI YUJI , NISHIBE YUJI , SHIRAI MIKIO , NAKAGAWA IKURO , SHIMIZU TATSUHIKO
IPC分类号： H01L23/36
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a high-reliability power semiconductor module, without the generation of nonconformities, such as cracks and liftings with respect to thermal shock cycles nor troubles, such as displacement in the production process. SOLUTION: A power semiconductor module comprises a power semiconductor element, an insulating substrate, and a heat sink. At least either the gap between the power semiconductor element and the insulating substrate or the gap between the insulating substrate and the heat sink is joined by a lamination structure with a Cu layer, a Cu 3 S n layer, and a Cu layer laminated in this order, and a production method therefor are provided. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种高可靠性功率半导体模块，而不会产生诸如在热冲击循环之间的裂纹和提升以及诸如生产过程中的位移之类的麻烦的不整合。解决方案：功率半导体模块包括功率半导体元件，绝缘衬底和散热器。功率半导体元件和绝缘基板之间的间隙或绝缘基板与散热片之间的间隙中的至少一个是通过具有Cu层，Cu <3> S n 层和Cu层按顺序层压，并提供其制造方法。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007099947A Sliding structure and sliding method 有权
标题翻译：滑动结构和滑动方法
公开(公告)号：JP2007099947A
公开(公告)日：2007-04-19
申请号：JP2005292846
申请日：2005-10-05
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： NAKAGAWA IKURO , OGAWA MASAAKI , FUWA YOSHIO , OZAKI YOSHINORI
IPC分类号： C10M169/04 , C10M101/02 , C10M103/02 , C10M125/22 , C10M135/18 , C10M137/10 , C10N10/12 , C10N20/00 , C10N30/06 , C10N40/02 , F02F1/00 , F16H53/02
CPC分类号： C10M137/10 , C10M125/22 , C10M135/18 , C10M141/08 , C10M141/10 , C10M2201/066 , C10M2219/068 , C10M2223/045 , C10N2210/06 , C23C14/0605 , C23C16/26 , F16C33/10
摘要： PROBLEM TO BE SOLVED: To provide a sliding structure which improves the abrasion resistance of a pair of sliding members sliding over each other and can reduce the coefficient of friction.
SOLUTION: The sliding structure allows at least one of sliding members to slide while supplying a lubricating oil to between the sliding surfaces of a pair of sliding members sliding over each other and on the sliding surface of at least one of the sliding members, an amorphous carbon film having an area strength ratio of the D-band to the G-band in the Raman spectroscopic spectrum of 1.5-2.0 is formed, and the lubricating oil present in between the sliding surfaces comprises a compound containing at least molybdenum and sulfur in such a manner that the amount of the molybdenum comes to not less than 400 ppm based on the lubricating oil.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种滑动结构，其提高一对滑动构件相对于彼此滑动的耐磨性，并且可以降低摩擦系数。解决方案：滑动结构允许滑动构件中的至少一个滑动，同时将滑动构件滑动到一对滑动构件的滑动表面之间，并且滑动构件中的至少一个滑动构件的滑动表面形成拉曼光谱中的D-带与G带的面积强度比为1.5〜2.0的无定形碳膜，存在于滑动面之间的润滑油含有至少含有钼和硫以钼的量相对于润滑油为不低于400ppm的方式。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2010040714A Ultrasonic bonding method and ultrasonic bonded object 审中-公开
标题翻译：超声结合方法和超声粘结物体
公开(公告)号：JP2010040714A
公开(公告)日：2010-02-18
申请号：JP2008200955
申请日：2008-08-04
申请人： Osaka Univ , Toyota Motor Corp , トヨタ自動車株式会社 , 国立大学法人大阪大学
发明人： TAKAHASHI YASUO , MAEDA MASAKATSU , SHIRAI MIKIO , NAKAGAWA IKURO , ATSUMI TAKASHI , YANAGIUCHI AKIHIRO
IPC分类号： H01L21/607 , B23K20/10 , B23K101/38
CPC分类号： H01L2224/34 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To make it possible to expand a bonding area and to avoid damage on elements, a substrate, element electrodes, substrate wiring, etc., in the ultrasonic bonding method.
SOLUTION: The ultrasonic bonding method is used to bond a bonding member 1 to a member 2 to be bonded by press-fitting the bonding member 1 to the member 2 to be bonded and applying ultrasonic vibration to the bonding member 1. The bonding member 1 and the member 2 to be bonded contain copper mainly, and a tin layer 4 made mainly of tin is interposed between the bonding faces 11 and 21 of the bonding member 1 and the member 2 to be bonded. While the tin layer 4 is pinched, the bonding member 1 is press-fitted to the member 2 to be bonded in, and ultrasonic vibration is applied to the bonding member 1 at normal temperature.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：在超声波接合方法中，可以扩大接合面积并避免损坏元件，基板，元件电极，基板布线等。解决方案：超声波接合方法用于通过将接合构件1压配合到待接合的构件2上并将结合构件1粘合到待接合的构件2上，并将超声振动施加到接合构件1。接合构件1和待接合构件2主要包含铜，并且主要由锡制成的锡层4插入在接合构件1的接合面11和21与待接合的构件2之间。当锡层4被夹持时，接合构件1被压配合到待接合的构件2上，并且在常温下对接合构件1施加超声波振动。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2005306958A Additive for lubricating oil and lubricating oil composition 审中-公开
标题翻译：润滑油和润滑油组合物的添加剂
公开(公告)号：JP2005306958A
公开(公告)日：2005-11-04
申请号：JP2004124062
申请日：2004-04-20
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： NAKAGAWA IKURO
IPC分类号： C10M141/10 , C10M125/22 , C10M125/26 , C10M129/10 , C10M133/04 , C10M133/06 , C10M133/12 , C10M135/18 , C10M137/10 , C10N10/04 , C10N10/12 , C10N20/06 , C10N30/06 , C10N40/04
摘要： PROBLEM TO BE SOLVED: To make a lubricating oil to exhibit lubricating oil performances in response to different sliding characteristics required for respective sliding sites.
SOLUTION: This additive used for lubricating oils and having a double capsule structure which comprises an outer capsule 1 and inner capsules 2 encapsulated in the outer capsule 1 and is formed so that only the outer capsule 1 is broken, while the second capsules 2 are not broken, at the first sliding site under the first surface pressure, and so that both the outer capsule 1 and the inner capsules 2 are broken under a higher second surface pressure than the first surface pressure is characterized by encapsulating a frictional coefficient μ-lowering agent for exhibiting a frictional coefficient μ-lowering performance and the inner capsules in the outer capsule 1 and encapsulating a frictional coefficient μ-lowering performance-controlling agent for controlling the frictional coefficient μ-lowering performance and a frictional coefficient μ-enhancing agent for exhibiting a frictional coefficient μ-enhancing performance for enhancing the frictional coefficient, in the inner capsules.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了使润滑油响应于各个滑动部位所需的不同滑动特性而显示润滑油性能。解决方案：用于润滑油并具有双胶囊结构的添加剂，其包括外胶囊1和封装在外胶囊1中的内胶囊2，并且形成为仅使外胶囊1断裂，而第二胶囊 2在第一表面压力下的第一滑动位置处不破裂，并且使得外部胶囊1和内部胶囊2在比第一表面压力高的第二表面压力下破裂，其特征在于将摩擦系数μ 用于表现出摩擦系数μ降低性能的下降剂和外胶囊1中的内胶囊，并且包封用于控制摩擦系数μ降低性能的摩擦系数μ降低性能控制剂和摩擦系数μ增强剂用于在内盖中显示用于提高摩擦系数的摩擦系数μ增强性能 ULES。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005246140A Method for removing bubble in oil liquid and apparatus for removal of bubble 有权
标题翻译：在油液中除去泡沫的方法和拆卸泡沫的装置
公开(公告)号：JP2005246140A
公开(公告)日：2005-09-15
申请号：JP2004056587
申请日：2004-03-01
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： NAKAGAWA IKURO
IPC分类号： F01M11/03 , B01D19/00
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for removing bubbles generated in an oil liquid being used in a specified circulatory system.
SOLUTION: The method is characterized by detecting the total volume of the oil liquid present in a specified circulatory system and bubbles generated in the oil liquid and/or on the surface of the oil liquid and introducing a gas actively into the oil liquid in use at such a supplying rate as to be capable of decreasing the total volume to a specified value or a value close to the specified value. The method does not cause deterioration of the defoaming effect due to mechanical defoaming.
COPYRIGHT: (C)2005,JPO&NCIPI

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