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    • 1. 发明专利
    • Tactile sensor system, orbit acquisition device, and robot hand
    • 触觉传感器系统,轨道采集设备和机器人手
    • JP2014145717A
    • 2014-08-14
    • JP2013015459
    • 2013-01-30
    • Toyota Motor Corpトヨタ自動車株式会社Toyota Central R&D Labs Inc株式会社豊田中央研究所
    • NAKAYAMA TAKAHIROKIDA YUSUKEDEO TAKASHIFUNAHASHI HIROFUMINONOMURA YUTAKAHATA YOSHIYUKIFUJIYOSHI MOTOHIRO
    • G01L5/00B25J15/08G01L5/16
    • PROBLEM TO BE SOLVED: To provide a tactile sensor system, orbit acquisition device, and robot hand that are able to estimate the movement locus in finer unit and more correctly.SOLUTION: A tactile sensor system 100 comprises: a plurality of tactile sensors 3-1, 3-2, and 3-m and a plurality of buses 1-1, 1-2, and 1-n which include at least one position sensor 4; and an arithmetic processing part 2 connected to the plurality of buses 1. An interval between the tactile sensors 3 is shorter than the minimal value of the resolution of the position sensor 4. The arithmetic processing part 2 calculates a pressure distribution on the basis of a value detected by the plurality of tactile sensors 3 adjacent to each other, and calculates a movement distance on the basis of the value detected by the position sensor 4. If the movement distance is not smaller than the minimal value of the resolution of the position sensor 4, the arithmetic processing part 2 estimates the locus of the movement. If the movement distance is smaller than the minimal value of the resolution of the position sensor 4, the arithmetic processing part 2 estimates the locus of the movement on the basis of the pressure distribution.
    • 要解决的问题:提供能够以更精细的单元估计运动轨迹并且更正确的触觉传感器系统,轨道获取装置和机器人手。解决方案:触觉传感器系统100包括:多个触觉传感器3- 1,2,3和3-m以及包括至少一个位置传感器4的多个总线1-1,1-2和1-n; 以及与多个总线1连接的算术处理部2.触觉传感器3之间的间隔比位置传感器4的分辨率的最小值短。算术处理部2基于 由彼此相邻的多个触觉传感器3检测到的值,并且基于由位置传感器4检测到的值来计算移动距离。如果移动距离不小于位置传感器的分辨率的最小值 如图4所示,运算处理部2估计运动的轨迹。 如果移动距离小于位置传感器4的分辨率的最小值,则算术处理部2基于压力分布来估计移动的轨迹。
    • 2. 发明专利
    • Mems structure
    • MEMS结构
    • JP2014004676A
    • 2014-01-16
    • JP2012282404
    • 2012-12-26
    • Toyota Central R&D Labs Inc株式会社豊田中央研究所Toyota Motor Corpトヨタ自動車株式会社
    • OMURA YOSHITERUFUJIYOSHI MOTOHIRONONOMURA YUTAKAAKASHI TERUHISAFUNAHASHI HIROFUMIHATA YOSHIYUKINAKAYAMA TAKAHIRO
    • B81B3/00G01C19/5755G01P15/125G02B26/08
    • PROBLEM TO BE SOLVED: To provide a technique capable of preventing the occurrence of warp such as the distal end of the movable unit flipping up and the concentration of stress at the movable unit or the coupling unit, which are caused from the release of residual strain of a stacked substrate in an MEMS structure formed in the stacked substrate in which linear expansion coefficients of adjacent layers are different.SOLUTION: The present specification discloses an MEMS structure. The MEMS structure includes a substrate unit formed in a first layer; an intermediate fixing unit formed in a second layer, and an upper fixing unit, a coupling unit, and a movable unit formed in a third layer, where the upper fixing unit is fixed to the substrate unit by way of the intermediate fixing unit, the movable unit is cantilever supported by the coupling unit, and the coupling unit is supported by the upper fixing unit. In the MEMS structure, the coupling unit is connected to the upper fixing unit at a position distant from the distal end of the movable unit than an end of the intermediate fixing unit closer to the distal end of the movable unit with respect to a supporting direction of the movable unit.
    • 要解决的问题:提供一种能够防止由于残留应变的释放引起的可动单元的前端起翘和可动单元或联接单元的应力集中的翘曲的发生的技术 在层叠基板中形成的MEMS结构中的层叠基板,其中相邻层的线性膨胀系数不同。解决方案:本说明书公开了一种MEMS结构。 MEMS结构包括形成在第一层中的衬底单元; 形成在第二层中的中间固定单元,以及形成在第三层中的上固定单元,联接单元和可移动单元,其中上固定单元通过中间固定单元固定到基板单元, 可移动单元是由联接单元支撑的悬臂,并且联接单元由上固定单元支撑。 在MEMS结构中,耦合单元在远离可移动单元的远端的位置处连接到上固定单元,而不是相对于支撑方向更靠近可移动单元的远端的中间固定单元的端部 的可移动单元。
    • 5. 发明专利
    • Mems sensors
    • MEMS传感器
    • JP2014032200A
    • 2014-02-20
    • JP2013189165
    • 2013-09-12
    • Toyota Central R&D Labs Inc株式会社豊田中央研究所
    • AKASHI TERUHISANONOMURA YUTAKAFUJIYOSHI MOTOHIROFUNAHASHI HIROFUMIHATA YOSHIYUKIOMURA YOSHITERU
    • G01C19/5762B81B3/00G01P15/125G01P15/18H01L29/84
    • PROBLEM TO BE SOLVED: To provide a technique that enables a manufacturing of a sensor having excellent detection sensitivity even with a downsized dimension in an entire device.SOLUTION: The present invention is embodied as a movable body to be formed on a substrate. The movable body comprises: a first frame body; a second frame body that mutually faces the first frame body, and is arranged so as to be partially or completely overlapped with each other; a joint part that is connected to the first frame body via a first spring part, and is connected to the second frame body via a second spring part; and a fixture part that is connected to the joint part via a third spring part, and is fixed to the substrate. The first spring part, the second spring part, and the third spring part have a spring constant in one direction extraordinarily lower than a spring constant in the other direction, and substantially allow for a relative displacement only in the one direction. The direction in which the first spring part, the second spring part, and the third spring part allow for the relative displacement is mutually orthogonal.
    • 要解决的问题:提供一种即使在整个装置中具有小尺寸的尺寸也能够制造具有优异的检测灵敏度的传感器的技术。解决方案:本发明被实施为要在基板上形成的可移动体。 可移动体包括:第一框体; 相互面对所述第一框体的第二框体,并且被配置为相互部分或完全重叠; 连接部,其经由第一弹簧部与第一框体连接,经由第二弹簧部与第二框体连接; 以及固定部,其经由第三弹簧部连接到所述接合部,并且固定到所述基板。 第一弹簧部分,第二弹簧部分和第三弹簧部分在一个方向上具有特别地低于另一个方向上的弹簧常数的弹簧常数,并且基本上允许仅在一个方向上的相对位移。 第一弹簧部分,第二弹簧部分和第三弹簧部分允许相对位移的方向相互正交。
    • 6. 发明专利
    • MEMS装置
    • MEMS器件
    • JP2014202548A
    • 2014-10-27
    • JP2013077393
    • 2013-04-03
    • 株式会社豊田中央研究所Toyota Central R&D Labs Inc
    • FUJIYOSHI MOTOHIROAKASHI TERUHISANONOMURA YUTAKAFUNAHASHI HIROFUMIHATA YOSHIYUKIOMURA YOSHITERU
    • G01C19/5762B81B3/00H01L29/84
    • 【課題】励振部を備えるMEMS装置において、励振に起因する他軸振動の発生を抑制することが可能な技術を提供する。【解決手段】MEMS装置2は、導電材料からなる第1導電層と、絶縁材料からなる絶縁層と、導電材料からなる第2導電層が順に積層された積層基板に形成されている。そのMEMS装置2は、基板部12と、基板部12に対して積層基板の面内方向に励振される励振部16と、励振部16と基板部12を連結する連結部18a、18b、18c、18dを備えている。そのMEMS装置2では、連結部18a、18b、18c、18dが第1導電層と第2導電層の両方に形成されている。【選択図】図1
    • 要解决的问题:在包括激励单元的MEMS装置中,提供能够抑制由激励引起的另一轴的振动的发生的技术。解决方案:MEMS装置2形成在层叠基板上,顺序堆叠 由导电材料制成的第一导电层,由绝缘材料制成的隔离层和由导电材料制成的第二导电层。 MEMS器件2包括:衬底单元12; 激励单元16相对于基板单元12在层叠基板的面内方向上被激励; 以及用于将激励单元16连接到基板单元12的连接单元18a,18b,18c和18d。在MEMS装置2中,连接单元18a,18b,18c和18d形成在第一导电层和 第二导电层。
    • 7. 发明专利
    • Movable body, two axis angular velocity sensor, and three axis acceleration sensor
    • 可移动身体,双轴角速度传感器和三轴加速度传感器
    • JP2011237393A
    • 2011-11-24
    • JP2010111480
    • 2010-05-13
    • Toyota Central R&D Labs Inc株式会社豊田中央研究所
    • AKASHI TERUHISANONOMURA YUTAKAFUJIYOSHI MOTOHIROFUNAHASHI HIROFUMIHATA YOSHIYUKIOMURA YOSHITERU
    • G01C19/56G01C19/5733G01C19/5762G01P15/125G01P15/18H01L29/84
    • PROBLEM TO BE SOLVED: To provide a technology capable of producing a compact sensor with high detection sensitivity.SOLUTION: The present invention is embodied as a movable body formed on a substrate. The movable body comprises a first frame body, a second frame body which is placed so as to be partly or completely superimposed on the first frame body with the first and second frame bodies opposing to each other, a coupling section which is linked with the first frame body via a first spring section and with the second frame body via a second spring section, and a stationary section which is linked with the coupling section via a third spring section and fixed to the substrate. Because in the first, second, and third spring sections, a spring constant in one direction is remarkably smaller than those in other directions, a relative displacement in the only one direction is substantially allowed. The directions in which the relative displacement is allowed by the first, second, and third spring sections are perpendicular to one another.
    • 要解决的问题:提供能够生产具有高检测灵敏度的紧凑型传感器的技术。 解决方案:本发明被实施为形成在基板上的可移动体。 可移动体包括第一框架体,第二框架体,其被布置成部分地或完全地叠置在第一框架体上,第一和第二框架体彼此相对;联接部分,其与第一框架主体 框架体经由第一弹簧部分和与第二框体通过第二弹簧部分,以及固定部分,其经由第三弹簧部分与联接部分连接并固定到基板。 因为在第一,第二和第三弹簧部分中,一个方向上的弹簧常数显着小于其它方向上的弹簧常数,因此基本上仅允许一个方向上的相对位移。 第一,第二和第三弹簧部分允许相对位移的方向彼此垂直。 版权所有(C)2012,JPO&INPIT