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    • 2. 发明专利
    • Method for producing group iii nitride semiconductor crystal
    • 生产III族氮化物半导体晶体的方法
    • JP2013159547A
    • 2013-08-19
    • JP2012025478
    • 2012-02-08
    • Toyoda Gosei Co Ltd豊田合成株式会社
    • KUMEGAWA SHOHEIMORIYAMA MIKIYAMAZAKI SHIRONAGAI SEIJI
    • C30B29/38C30B19/12
    • PROBLEM TO BE SOLVED: To provide a method for producing a group III nitride semiconductor crystal by a C-added Na flux method capable of growing a high-quality group III nitride semiconductor crystal suppressing meltback of a seed crystal and not generating inclusion or abnormal growth.SOLUTION: A product produced by laminating a GaN layer 101 and an AlGaN layer 102 in due order on a sapphire substrate 100 by an MOCVD method is used as a seed crystal, and GaN 103 is grown on the AlGaN layer 102 by an Na flux method. Meltback of a GaN seed crystal, which is a big problem generated when the GaN seed crystal is used and C is added to a melt mixture, can be suppressed by forming the AlGaN layer 102 on the seed crystal outermost layer.
    • 要解决的问题:提供一种通过C加Na通量法生产III族氮化物半导体晶体的方法,该方法能够生长抑制晶种的熔融回退的高质量III族氮化物半导体晶体,并且不产生夹杂物或异常生长 解决方案:使用通过MOCVD法在蓝宝石衬底100上按顺序层叠GaN层101和AlGaN层102制造的产品作为晶种,并且通过Na通量在AlGaN层102上生长GaN 103 方法。 可以通过在晶种最外层上形成AlGaN层102来抑制在使用GaN晶种时产生的大问题的GaN晶种和熔融混合物中加入C的熔融反应。
    • 3. 发明专利
    • Method for producing group iii nitride semiconductor crystal
    • 生产III族氮化物半导体晶体的方法
    • JP2011207676A
    • 2011-10-20
    • JP2010077174
    • 2010-03-30
    • Toyoda Gosei Co Ltd豊田合成株式会社
    • YAMAZAKI SHIRO
    • C30B29/38C30B19/10
    • PROBLEM TO BE SOLVED: To provide a method for producing a GaN crystal by an Na flux method that increases a crystal growth rate and a growth amount as well as improves uniformity in the thickness of a crystal.SOLUTION: While a GaN crystal is grown by an Na flux method, the distance from the GaN crystal surface in a mixture melt to a gas-liquid interface is kept to 10 mm or less, and a crucible and a seed crystal are independently rotated in the following rotation mode. That is, the rotation direction of the crucible is periodically inverted, so that the rotation direction of the seed crystal is completely opposite to the rotation direction of the crucible. By growing the GaN crystal while rotating the crucible and the seed crystal under the above conditions, the growth rate of the GaN crystal can be raised to increase the growth amount and the GaN crystal can be formed into a uniform thickness.
    • 要解决的问题:提供一种通过提高晶体生长速度和生长量的Na通量法生产GaN晶体的方法,并且提高晶体的厚度的均匀性。解决方案:GaN晶体生长在 通过Na通量法,将混合熔体中的GaN晶体表面与气液界面的距离保持为10mm以下,并且坩埚和晶种以随后的旋转模式独立地旋转。 也就是说,坩埚的旋转方向周期性地反转,使得晶种的旋转方向与坩埚的旋转方向完全相反。 通过在上述条件下旋转坩埚和晶种来生长GaN晶体,可以提高GaN晶体的生长速率以增加生长量,并且可以将GaN晶体形成为均匀的厚度。
    • 4. 发明专利
    • Method for producing group iii nitride compound semiconductor
    • 生产III族氮化物半导体的方法
    • JP2011073894A
    • 2011-04-14
    • JP2009224133
    • 2009-09-29
    • Toyoda Gosei Co Ltd豊田合成株式会社
    • YAMAZAKI SHIROHIRATA KOJI
    • C30B29/38C30B19/12
    • PROBLEM TO BE SOLVED: To reduce the stress on an interface between a crystal and a seed crystal when a GaN substrate is obtained by a flux method. SOLUTION: A GaN self-supporting 21 to be used as a seed crystal is produced by a HVPE method using a hetero substrate 1 comprising sapphire. The gallium nitride layer 2 is formed thick by controlling the HVPE conditions in such a manner that the surface 2f of the gallium nitride layer 2 has a less portion to be parallel to the principal plane of the sapphire substrate, and then the hetero substrate 1 is separated (1.A to 1.D). Although the surface 21s is not parallel to the c-plane, the GaN self-supporting 21 functioning as a seed crystal has a planar shape substantially parallel to the c-plane. The GaN self-supporting 21 is conveyed to a flux crystal growth apparatus and a crystal is grown on the surface 21s in a sodium/gallium flux under high temperature and high pressure conditions to form a nitride gallium layer 3 having a layer thickness of 2 mm (1.E). The GaN self-supporting 21 is removed by polishing. The nitride gallium single crystal substrate 31 grown by the flux method is almost free of cracks (1.F). COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:通过通量法获得GaN衬底时,减小晶体和晶种之间的界面上的应力。 解决方案:使用包含蓝宝石的异质衬底1的HVPE法制造用作晶种的GaN自支撑21。 通过以如下方式控制HVPE条件来形成氮化镓层2,使得氮化镓层2的表面2f具有与蓝宝石衬底的主平面平行的较少部分,然后异质衬底1为 分开(1.A至1.D)。 尽管表面21s不平行于c面,但是用作晶种的GaN自支撑21具有基本上平行于c面的平面形状。 将GaN自支撑体21输送到通量晶体生长装置,在高温高压条件下,在钠/镓通量的表面21s上生长晶体,形成层厚度为2mm的氮化镓层3 (1.E)。 通过抛光除去GaN自支撑21。 通过助熔剂法生长的氮化镓单晶基板31几乎没有裂纹(1.F)。 版权所有(C)2011,JPO&INPIT
    • 5. 发明专利
    • Method for producing group iii nitride compound semiconductor crystal
    • 生产III族氮化物半导体晶体的方法
    • JP2010037155A
    • 2010-02-18
    • JP2008202899
    • 2008-08-06
    • Yusuke MoriToyoda Gosei Co Ltd勇介 森豊田合成株式会社
    • YAKUSHI YASUHIDEYAMAZAKI SHIRONAGAI SEIJISATO SHINYUKIMORI YUSUKEKITAOKA YASUO
    • C30B29/38C30B9/00
    • PROBLEM TO BE SOLVED: To provide a production method of a thick film crystal of a group III nitride compound semiconductor the major face of which is not a c-plane, for fabricating a semiconductor element free from a piezoelectric effect in the layered direction. SOLUTION: The production method of a group III nitride compound semiconductor by a flux method using an alkali metal is disclosed, wherein a group III nitride compound semiconductor substrate 10 having a normal vector of the major face in a direction rotating by 0.2 to 5 degrees from the m-axis toward the +c-axis is used as a seed crystal, on which a crystal growth portion 11 of the group III nitride compound semiconductor is formed by a flux method, thereby a thick film crystal 100 of the group III nitride compound semiconductor having the normal line of the major face in a direction rotating by 0.2 to 5 degrees from the m-axis toward the +c-axis is obtained. Instead of the group III nitride compound semiconductor substrate 10, a group III nitride compound semiconductor film can be used, which has a normal line vector of the major face in a direction rotating by 0.2 to 5 degrees from the m-axis toward the +c-axis direction and is formed on a substrate of a different material. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了提供一种III族氮化物化合物半导体的厚膜晶体的制造方法,该III族氮化物化合物半导体的主表面不是c面,用于制造在层状物中没有压电效应的半导体元件 方向。 解决方案:公开了通过使用碱金属的助熔剂法制备III族氮化物化合物半导体的方法,其中将III族氮化物化合物半导体衬底10的主面的法线向旋转0.2至 使用从m轴朝向+ c轴的5度作为晶种,通过磁通法形成III族氮化物化合物半导体的晶体生长部11,从而形成组中的厚膜结晶100 获得具有从m轴朝向+ c轴旋转0.2〜5度的方向的主面的法线的III族氮化物化合物半导体。 代替III族氮化物化合物半导体衬底10,可以使用III族氮化物化合物半导体膜,该III族氮化物化合物半导体膜在从m轴朝向+ c旋转0.2至5度的方向上具有主面的法线矢量 并且形成在不同材料的基板上。 版权所有(C)2010,JPO&INPIT
    • 6. 发明专利
    • Apparatus and method for producing group iii nitride semiconductor
    • 用于生产III族氮化物半导体的装置和方法
    • JP2008297153A
    • 2008-12-11
    • JP2007144220
    • 2007-05-30
    • Toyoda Gosei Co Ltd豊田合成株式会社
    • HIRATA KOJIYAMAZAKI SHIRO
    • C30B29/38C30B19/02
    • C30B29/403C30B9/10Y10T117/1024
    • PROBLEM TO BE SOLVED: To provide a production apparatus capable of reusing Na, which has been conventionally discarded after the completion of a crystal growth step, in the production of a group III nitride semiconductor by the Na flux method. SOLUTION: After the completion of a crystal growth step of a group III nitride semiconductor by a Na flux method, when the temperature of a crucible 11 is not less than 100°C, Na is sucked by a recovery apparatus 20 and held in a liquid state in a holding container 22. The recovered Na can be taken out from a tap 24. Here, since Na which remains after the completion of a crystal growth step does not contain an impurity with a high vapor pressure, it is highly pure. Thus, if the recovered Na is reused as flux, a group III nitride semiconductor with a low impurity concentration can be produced. COPYRIGHT: (C)2009,JPO&INPIT
    • 解决的问题:提供一种能够在通过Na通量法制造III族氮化物半导体时,重新使用在晶体生长步骤完成之后通常被丢弃的Na的制备装置。 解决方案:在通过Na通量法完成III族氮化物半导体的晶体生长步骤之后,当坩埚11的温度不低于100℃时,Na被回收装置20吸入并保持 在保持容器22中处于液态。回收的Na可以从龙头24中取出。这里,由于在结晶生长步骤结束后残留的Na不含有高蒸气压的杂质,因此高 纯。 因此,如果回收的Na被重新用作助熔剂,则可以生产具有低杂质浓度的III族氮化物半导体。 版权所有(C)2009,JPO&INPIT
    • 9. 发明专利
    • Method for manufacturing iii nitride based compound semiconductor
    • 制备III型氮化物化合物半导体的方法
    • JP2003037069A
    • 2003-02-07
    • JP2001221425
    • 2001-07-23
    • Toyoda Gosei Co Ltd豊田合成株式会社
    • KOIKE MASAYOSHIYAMAZAKI SHIRO
    • C30B29/38C30B25/02C30B25/18H01L21/20H01L21/205
    • C30B25/02C30B25/18C30B29/403C30B29/406H01L21/0242H01L21/02458H01L21/02472H01L21/02502H01L21/0254H01L21/0262
    • PROBLEM TO BE SOLVED: To obtain a crack-free thin film III nitride based compound semiconductor. SOLUTION: A sapphire substrate 1 having a major surface of a face c is set in an RF sputtering device (a). An intermediate layer 2 of ZnO having thickness of 100 nm is formed by sputtering a target of ZnO (b). The sapphire substrate 1 is then set in a halogen transporter and heated at 1000 deg.C, and GaClx (x=1-3) and NH3 are supplied to the surface of the sapphire substrate 1, thus growing a GaN layer 3 of about 200 μm thick (c). Subsequently, hydrogen chloride(HCl) gas is supplied and the intermediate layer 2 of ZnO is etched by the hydrogen chloride(HCl) gas starting from the circumferential edge part thereof (d). Consequently, a region for jointing the intermediate layer 2 of ZnO and the sapphire substrate 1 can be reduced (e) or substantially eliminated. Cracking due to thermal stress can be prevented even if the sapphire substrate 1 is returned back to the room temperature and a thick film GaN substrate 3 can be obtained.
    • 要解决的问题:获得无裂纹的III族氮化物基化合物半导体。 解决方案:在RF溅射装置(a)中设置具有面c主表面的蓝宝石衬底1。 通过溅射ZnO(b)的靶,形成厚度为100nm的ZnO的中间层2。 然后将蓝宝石衬底1放置在卤素转运体中并在1000℃加热,并将GaClx(x = 1-3)和NH 3供应到蓝宝石衬底1的表面,从而生长约200的GaN层3 μm厚(c)。 随后,从其周边部分(d)开始供给氯化氢(HCl)气体,用氯化氢(HCl)气体蚀刻ZnO的中间层2。 因此,可以减小(e)或基本上消除用于连接ZnO的中间层2和蓝宝石衬底1的区域。 即使将蓝宝石衬底1返回到室温,也可以防止由于热应力引起的破裂,并且可以获得厚膜GaN衬底3。