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    • 2. 发明专利
    • Opaque silica glass molding and method for producing the same
    • OPAQUE二氧化硅玻璃成型及其制造方法
    • JP2005139018A
    • 2005-06-02
    • JP2003375511
    • 2003-11-05
    • Tosoh CorpTosoh Quartz Corp東ソー・クォーツ株式会社東ソー株式会社
    • OSADA HIRONARIKUDO MASAYUKITSUYOSHI TORUKIMURA SHIGEO
    • C03B20/00C04B35/14
    • C03B19/06C03B19/066C03B20/00
    • PROBLEM TO BE SOLVED: To provide an opaque silica glass molding being an opaque silica glass molding with its surface entirely covered with transparent silica glass and being excellent in surface smoothness and light shielding properties.
      SOLUTION: The molding is an opaque silica glass molding with its surface entirely covered with a transparent silica glass layer, wherein the opaque part comprises silica glass and voids at least 90% of which have maximum diameters of below 20 μm and has an apparent density of 2.00 to 2.20 g/cm
      3 . The thickness of the transparent layer at the thinnest part of the molding is 1/1,000 to 400/1,000 of the thickness of the opaque part, and the surface roughness Ra on at least one surface is 0.05 to 0.5 μm. This molding is obtained by injection-molding a kneaded mixture of a binder and silica glass being spherical particles having the maximum diameter and the minimum diameter in the range of 0.01 to 20 μm and containing 5 to 70 wt.% 0.2 μm or smaller particles, degreasing the molding by heating, and vacuum-sintering the molding at 1,100 to 1,400°C.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种不透明的石英玻璃模制品,其是不透明的石英玻璃模制品,其表面完全被透明的石英玻璃覆盖并且具有优异的表面平滑性和遮光性。 解决方案:模制品是不透明的石英玻璃模制品,其表面完全被透明的石英玻璃层覆盖,其中不透明部分包括二氧化硅玻璃和至少90%的最大直径小于20μm的空隙,并且具有 表观密度为2.00〜2.20g / cm 3。 成型体最薄部分的透明层的厚度为不透明部分厚度的1 / 1,000〜400 / 1,000,至少一个表面的表面粗糙度Ra为0.05〜0.5μm。 该成型是将具有最大直径和最小直径的球状粒子的粘合剂和石英玻璃的捏合混合物注射成型为0.01〜20μm,含有5〜70重量%的0.2μm以下的粒子, 通过加热脱模成型,在1100〜1400℃下进行真空烧结。 版权所有(C)2005,JPO&NCIPI
    • 3. 发明专利
    • Method for producing composite particle, and composite particle
    • 生产复合颗粒的方法和复合颗粒
    • JP2006082073A
    • 2006-03-30
    • JP2005230593
    • 2005-08-09
    • Tosoh Corp東ソー株式会社
    • FUTAMI TATSUMESHIDA MASAMIOKAWA TOMOHIROKONDO SATORUOSADA HIRONARI
    • B01J19/00
    • PROBLEM TO BE SOLVED: To provide a method which enables a stable production of composite particles whose grain boundaries are uniformly dispersed with another group of particles, which method is applicable to a large scale production thereof.
      SOLUTION: The method comprises a mixing step wherein at least one fluid which contains fine particles charged with a positive surface potential and at least one fluid which contains fine particles charged with a negative surface potential are mixed, and a preceding surface potential adjustment step wherein the surface of at least one of the two fine particle groups is modified with a polymer compound to adjust the surface potential of the fine particle group(s) prior to the mixing step. It is preferable to carry out the mixing step in a micro flow path.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 待解决的问题:为了提供能够稳定地生产晶粒与另一组颗粒均匀分散的复合颗粒的方法,该方法适用于其大规模生产。 解决方案:该方法包括混合步骤,其中混合至少一种含有带有正表面电位的微粒和至少一种含有带有负表面电位的微粒的流体的流体,并且前面的表面电位调节 步骤,其中两个细颗粒组中的至少一个的表面用聚合物化合物改性,以在混合步骤之前调节微粒组的表面电位。 优选在微流路中进行混合工序。 版权所有(C)2006,JPO&NCIPI
    • 4. 发明专利
    • Method for producing silica glass molding
    • 生产二氧化硅玻璃成型的方法
    • JP2005145766A
    • 2005-06-09
    • JP2003386762
    • 2003-11-17
    • Tosoh CorpTosoh Quartz Corp東ソー・クォーツ株式会社東ソー株式会社
    • OSADA HIRONARIKUDO MASAYUKITSUYOSHI TORUKIMURA SHIGEO
    • C03B20/00
    • C03B19/06C03B19/066C03B20/00
    • PROBLEM TO BE SOLVED: To provide a method for producing a silica glass molding, which method does not necessitate complicated after-processings, such as machining and flaming, for attaining a desired shape or markedly reduces such after-processings, if necessary, and provides high productivity.
      SOLUTION: The silica glass molding is obtained by kneading a silica glass powder comprising spherical particles having the maximum and minimum diameters in the range of 0.01 to 20 μm and containing 5 to 70 wt.%, based on the entire particles, of 0.2 μm or smaller particles with an organic binder in such a mixing ratio that the rate of the powder in the kneaded mixture with the organic binder is 65 to 85 wt.%, hot-extrusion-molding the mixture, degreasing the molding by heating, and vacuum-sintering the degreased molding at 1,200-1,400°C. The obtained silica glass molding has a density of 2.0 to 2.2 g/cm
      3 .
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了提供石英玻璃成型体的制造方法,该方法不需要诸如机械加工和燃烧的复杂的后处理,以获得所需的形状,或者如果需要,显着地减少这种后处理 ,并提供高生产率。 解决方案:二氧化硅玻璃成型体是将具有最大和最小直径的球形颗粒的二氧化硅玻璃粉末在0.01至20μm的范围内混合,并且含有基于整个颗粒的5-70重量% 0.2μm以下的有机粘合剂的粒子,使混合物中的粉末与有机粘合剂的比例为65〜85重量%,将该混合物进行热挤压成型,加热脱模, 并在1200-1,400℃下对脱脂模塑进行真空烧结。 得到的石英玻璃成型体的密度为2.0〜2.2g / cm 3。 版权所有(C)2005,JPO&NCIPI
    • 5. 发明专利
    • Alumina powder and its manufacturing process
    • 铝粉及其制造工艺
    • JP2008137838A
    • 2008-06-19
    • JP2006324907
    • 2006-11-30
    • Tosoh Corp東ソー株式会社
    • OSADA HIRONARIKUDO MASAYUKI
    • C04B35/115C01F7/02C04B35/628
    • PROBLEM TO BE SOLVED: To provide an alumina powder from which a transparent alumina sintered body exhibiting practically acceptable transparency and a high flexural strength of ≥500 MPa is manufactured even at a low sintering temperature of ≤1,500°C and its manufacturing process. SOLUTION: The highly strong and transparent alumina sintered body is obtained by using an alumina powder which has a BET specific surface area of 11-16 m 2 /g, an average particle size of the primary particles of ≤0.05-0.3 μm, the maximum particle size of the primary particles of ≤0.5 μm, a freely settled bulk density of 0.4-0.8 g/cm 3 , is free from agglomerates larger than 5 μm, contains ≤200 ppm of metal impurities other than Al and has a crystal structure of an α-type single phase, sintering the alumina with low temperature sintering to obtain a partially sintered body and subjecting the body to the HIP treatment. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了提供一种氧化铝粉末,其即使在≤1,500℃的低烧结温度下也可以制造出具有可接受的透明度和≥500MPa的高弯曲强度的透明氧化铝烧结体及其制造方法 。 解决方案:通过使用BET比表面积为11-16m 2 / SP / g / g的氧化铝粉末,得到高度透明的氧化铝烧结体,其主要的平均粒径 ≤0.05-0.3μm的颗粒,一次颗粒的最大粒径≤0.5μm,自由沉降堆积密度为0.4-0.8g / cm 3,不含大于5μm的团块 含有≤100ppm的Al以外的金属杂质,具有α型单相的晶体结构,通过低温烧结烧结氧化铝,得到部分烧结体,对体进行HIP处理。 版权所有(C)2008,JPO&INPIT
    • 6. 发明专利
    • Black silica glass molding and method for producing the same
    • 黑色二氧化硅玻璃成型及其制造方法
    • JP2005145767A
    • 2005-06-09
    • JP2003386763
    • 2003-11-17
    • Tosoh CorpTosoh Quartz Corp東ソー・クォーツ株式会社東ソー株式会社
    • OSADA HIRONARIKUDO MASAYUKITSUYOSHI TORUKIMURA SHIGEO
    • G02B6/36C03B19/06C03B20/00F21S2/00F21V7/00G03B21/14
    • C03B19/06C03B19/066C03B20/00C03B2201/03
    • PROBLEM TO BE SOLVED: To provide a black silica glass molding excellent in surface smoothness and light shielding properties and capable of markedly shortening a polishing time even when its polishing is necessary and to provide a method for producing the same.
      SOLUTION: The molding has a linear transmittance of at most 5% to 200 to 5,000 nm light at a thickness of 1 mm, an apparent density of 2.10 to 2.20 g/cm
      3 , a total content of Na, K, Mg, and Ca elements of at most 200 ppm, and having a surface roughness Ra of 0.05 to 1 μm on at least one surface. The black silica glass molding is obtained by kneading a silica glass powder comprising spherical particles of a particle diameter of 0.01 to 20 μm and contains 5 to 70 wt.% of 0.2 μm or smaller particles with an organic binder in a weight ratio of 70:30 to 90:10, injection-molding the mixture, degreasing the molding by heating in a non-oxidizing atmosphere at 0.1 to 5 atm, and vacuum-sintering the degreased molding at 1,200-1.400°C.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 解决的问题:提供表面平滑性和遮光性优异的黑色二氧化硅玻璃成型体,即使在需要研磨的情况下也能够显着缩短研磨时间并提供其制造方法。 解决方案:模制品具有至多5至200至5000nm光线的线性透射率,其厚度为1mm,表观密度为2.10至2.20g / cm 3 SP / 3,总共 Na,K,Mg和Ca元素的含量至多为200ppm,并且在至少一个表面上具有0.05至1μm的表面粗糙度Ra。 黑色二氧化硅玻璃成型体通过将粒径为0.01〜20μm的球状粒子的二氧化硅玻璃粉末与重量比为70:1的有机粘合剂相比,含有5〜70重量%的0.2μm以下的粒子, 30〜90:10,对混合物进行注射成型,在非氧化性气氛中以0.1〜5atm进行加热脱脂成型,在脱脂成型中以1,200-1.400℃进行真空烧结。 版权所有(C)2005,JPO&NCIPI
    • 8. 发明专利
    • PIEZOELECTRIC PUMP
    • JPH07151060A
    • 1995-06-13
    • JP29787393
    • 1993-11-29
    • TOSOH CORP
    • OKAMURA TOSHIHIKOOSADA HIRONARIKOIKE TOMOKAZUKUDO MASAYUKIKURAMOCHI TOSHIHITO
    • F04B43/04
    • PURPOSE:To facilitate elimination of air inside a pump chamber in the case that driving is started from the vacant condition by fixing an outer peripheral part of a piezoelectric vibrator by means of a casing provided with a packing, and providing the piezoelectric vibrator with downward inclination from the discharge port side to the suction port side. CONSTITUTION:A piezoelectric vibrator 3 in a piezoelectric pump is prepared by applying electrodes on both surfaces of piezoelectric bodies, applying them to each other with their electrodes being trued up through phosphor bronze plates, and providing a lead wire for an ac current thereto. The piezoelectric vibrator 3 is sealed and supported by the inner peripheral surface of a casing through a fixing packing 4. The casing has a suction port 6 and a discharge port 6', respectively provided with check valves 2, 2'. In such a piezoelectric pump, a portion of an outer peripheral part of the discharge port 6' nearest the packing 4 is formed on a position located by 1mm from an inner end of the packing. A pump chamber has inclination of substantially four degrees, which chamber is prepared by the casing, the piezoelectric vibrator 3 and the fixing packing 4. The side of the discharge port 6 is et higher.
    • 9. 发明专利
    • PRODUCTION OF PIEZOELECTRIC BIMORPH ELEMENT
    • JPH05175569A
    • 1993-07-13
    • JP35453391
    • 1991-12-20
    • TOSOH CORP
    • KOIKE TOMOKAZUOSADA HIRONARIOKAMURA TOSHIHIKO
    • H01L41/09H01L41/39
    • PURPOSE:To improve the electrical characteristics and adhesive strength and further improve the durability of element by curing an adhesive in a state where it is kept pressurized mechanically after the bonding has been performed under evacuation, in a bonding process where a piezoelectric plate, that is provided with electrodes on a ceramic piezoelectric body, and a shim plate are bonded by using the adhesive. CONSTITUTION:Electrodes 2 made of silver, etc., are formed on both sides of disc or rectangular thin-plate sintered body composed of piezoelectric body. A piezoelectric plate 1 is made of solid-solved lead niobate consisting essentially of PbTiO3-Pb2nO3 that is superior in piezoelectric characteristics. An adhesive 6 such as epoxy-based ones is coated on one side of the plate 1 and the plate 1 and a shim plate 5 are bonded together under evacuation. Then the adhesive 6 is cured under pressurization mechanically. While, it is necessary to keep electrical conductivity between the shim plate 5 and the plate 1, so at least one point comes into being contact. Further an outer lead wire 3 to impress the voltage to an element and a connection lead wire 4 to conduct two piezoelectric plates 1 are soldered.